Core Insights - The demand for logic-to-memory integration driven by AI and high-performance computing is propelling advancements in panel-level packaging (PLP), with expectations that PLP will approach 10 times the maximum reticle size in the coming years [2][3] - Fan-out panel-level packaging (FOPLP) is emerging as a cost-effective solution, replacing silicon interposers with organic interposers, which is crucial for accommodating larger chip sizes and higher I/O counts [2][3][20] - The panel-level packaging market is projected to grow significantly, from $160 million in 2024 to $650 million, and nearly tripling to approximately $2.2 billion by 2030 [4] Panel-Level Packaging Developments - The integration of organic interposers and glass substrates is advancing, with companies like TSMC transitioning from wafer-based to panel-based processes for advanced packaging [3][4] - The choice of panel size varies based on application needs, with sizes ranging from 310 x 310 mm to 700 x 700 mm, influenced by existing manufacturing capabilities [5][6] - The utilization efficiency of panel-level packaging improves with larger interposer sizes, significantly reducing waste compared to wafer-level processes [6][10] Manufacturing Techniques and Challenges - Various manufacturing processes are being implemented in fan-out packaging, including chip-first, RDL-first, and mold-first methods, each with its own advantages and challenges [12][14] - Warpage remains a critical issue in fan-out packaging, exacerbated by differences in thermal expansion coefficients between materials, necessitating new materials and process controls to mitigate this risk [16][18][20] - Laser direct imaging and step-and-repeat lithography are both utilized for RDL patterning, with step-and-repeat lithography being more suitable for high throughput [10][20] Future Outlook - The future of panel-level packaging is promising, particularly for AI and HPC devices, as manufacturers seek to achieve yield rates comparable to current fan-out wafer-level packaging processes [20] - The development of new interlayer dielectric materials and molding materials with thermal expansion coefficients closer to silicon will enhance control over chip displacement and warpage [20]

Core Viewpoint - Wuhan Textile University has announced procurement intentions for 24 items of laboratory equipment with a total budget of 114 million yuan, expected to be purchased between April and June 2025 [1][2]. Procurement Summary - The procurement includes various advanced instruments such as ultrafast pulse lasers, vector network analyzers, and plasma-enhanced chemical vapor deposition systems, among others [2][4]. - The total budget for the procurement is 114 million yuan, with specific allocations for different equipment types [2][4]. Equipment Details - The procurement list includes: - Non-woven fabric machine for textile education: 3.6 million yuan [4] - Fiber material analysis equipment: 2.75 million yuan [4] - Five-axis composite machining center: 6.15 million yuan [4] - Small animal imaging system: 1.5 million yuan [4] - High-speed centrifuge: 510,000 yuan [4] - Stepper photolithography machine: 5.5 million yuan [4] - Lipidomics analysis system: 2.6 million yuan [4] - Deep ultraviolet spectrometer: 8.8 million yuan [5] - Multifunctional thermal processing furnace: 1.35 million yuan [5] - High-shear multifunctional melt spinning machine: 1.25 million yuan [5] - Online solid-phase extraction system: 2.5 million yuan [5] Research and Development Background - Wuhan Textile University is recognized for its strong research capabilities, with multiple key laboratories and a history of significant research projects in textile and material sciences [7][8]. - The university has received numerous awards for its research achievements, indicating a robust academic and practical impact in the textile industry [8]. Collaboration and Innovation - The university emphasizes collaboration with local governments and industries, aiming to extend its research applications to various sectors, including military, healthcare, and environmental protection [8][9].