Core Viewpoint - The company has made significant advancements in its silicon carbide chip production and new product development, indicating a strong position in the semiconductor industry [1] Group 1: Silicon Carbide Chip Production - The silicon carbide chip wafer process line has been upgraded from 6 inches to 8 inches and is currently operational, entering the product upgrade and customer onboarding phase [1] - The company is actively working on the development of 3.2Tbps products in collaboration with customers, expanding its capabilities in high-speed communication [1] Group 2: New Product Development - The company has achieved milestone progress in the research and development of ceramic components, successfully validating them with domestic semiconductor equipment and achieving mass production [1] - The aluminum nitride multilayer thin and thick film products have seen rapid growth, with applications in high-frequency and high-speed optical modules, particularly in AI and data center scenarios [1] Group 3: Optical Communication Devices - The company’s optical communication device housings have achieved transmission rates covering a wide range from 2.5Gbps to 1.6Tbps, all of which are in mass production [1]

Core Viewpoint - Hebei Zhongci Electronic Technology Co., Ltd. has experienced significant growth in net profit in the first half of 2025, driven by the increase in high-end product output and effective cost reduction measures [1] Group 1: Financial Performance - The company's net profit for the first half of 2025 increased due to the ramp-up of high-end products and significant improvements in profitability [1] - The company maintains a high capacity utilization rate, seizing opportunities in the optical module market to accelerate the construction of electronic ceramic shell production lines [1] Group 2: Industry Opportunities - The growth in AI computing power demand is driving the development of the digital economy, leading to sustained growth in the semiconductor and communication industries [1] - The market for optical modules and semiconductor equipment is expanding, with the company aiming to increase its market share in the third-generation semiconductor gallium nitride (GaN) RF chips and devices [1] Group 3: Product Development - The company is actively involved in the research and development of 3.2Tbps products in collaboration with clients, with current optical communication device shell transmission rates covering 2.5Gbps to 10Gbps [1] - The company has upgraded its silicon carbide (SiC) chip wafer process line from 6 inches to 8 inches, which is currently in the product upgrade and customer introduction phase [1] Group 4: Project Progress - The construction of the "GaN microwave product precision manufacturing production line" and "communication power amplifier and microwave integrated circuit R&D center" is underway, with the main structure already completed [1] - The timeline for the "third-generation semiconductor process and testing platform construction project" has been extended to October 2027 due to various objective factors [1] Group 5: Technological Advancements - The subsidiary, Bowei Company, is advancing key technology breakthroughs and R&D for RF chips and devices for next-generation communication systems, including 5G-A, 6G, and Starlink communication [1] - The company has developed core materials and supporting metallization systems for precision ceramic components, achieving international standards and user validation for its ceramic heating plate products [1]

随着 AI 算力需求的持续增长，将推动数字经济蓬勃发展， 带动半导体、通信、消费电子、新能源汽车等行业持续增长，以 光模块为代表的电子元器件和半导体设备等行业市场规模持续 上升。第三代半导体氮化镓通信基站射频芯片与器件领域，紧密 围绕战略目标，坚持"市场牵引、科技驱动"，在保持现有优势 的基础上，进一步提升市场占有率，保障公司持续、健康、稳定 发展。第三代半导体碳化硅功率模块及其应用领域，上半年碳化 硅芯片晶圆工艺线经过升级改造由 6 英寸升级为 8 英寸，目前已 通线，处于产品升级及客户导入阶段，今后将有效提升国联万众 碳化硅功率产品的市场竞争力。 3.公司光模块陶瓷产品中哪一类产品增长幅度较大？ 光通信市场的繁荣给公司光通讯相关产品领域订单带来增 长，公司氮化铝多层薄厚膜产品实现快速增长，产品应用于高频 高速光模块中，应用于 AI 智能和数据中心等新场景。公司时刻 关注该类产品更新换代趋势，紧跟市场及技术方向来加快新产品 开发，产品结构将随市场需求变化而调整。公司在积极开展现有 业务的同时，也在不断探索和跟进行业发展趋势及市场需求。 4.公司电子陶瓷领域目前产能利用率如何？ 公司产能利用率始终维持在较高水 ...