报告期内，半导体设备（含泛半导体）业务实现营业收入5.96亿元，同比下降20.76%。2025年上半年，公司推出全新一 代全自动晶圆激光开槽设备——GV-N3242系列，在开槽质量、开槽精度、洁净度管控以及材料兼容性方面大幅提升， 已通过客户严苛的技术验证，具备量产能力。公司持续推进激光切割、钻孔，激光修复，激光剥离等设备的技术升级和 性能改善，成功研发、生产多款显示行业国内首台设备，打破面板前段及中段工艺进口设备的垄断，取得国内首台前段 核心制程设备订单，激光修复机、激光剥离机、平板显示器基板切割机等设备2025年上半年再度多次中标京东方 AMOLED生产线项目，获得行业龙头客户的广泛认可。子公司大族富创得业务受益于部分下游客户扩产需求及新产品 突破，EFEM（设备前端模块）、SMIF（标准机械接口晶圆盒）、SORTER（分选机）等产品取得高速增长。 报告期内，公司信息产业设备业务实现收入31.96亿元，同比增长35.95%。其中，消费电子设备业务实现营业收入8.15 亿元，同比有所增长。公司深度参与头部客户前沿研发，为其定制激光钎焊机、密封检测系统等设备，满足AI硬件散热 结构与微型化需求。目前，公司已组 ...

Core Insights - The company reported a total revenue of 14.771 billion yuan for 2024, a year-on-year increase of 4.83%, and a net profit attributable to shareholders of 1.694 billion yuan, up 106.52% year-on-year [1] - In Q1 2025, the company achieved a revenue of 2.944 billion yuan, a year-on-year increase of 10.84%, but the net profit dropped by 83.47% to 163 million yuan [1] - The company has a vertical integration capability in smart manufacturing equipment, providing comprehensive solutions from basic components to complete equipment and process solutions [1] Revenue Breakdown - The information industry equipment business generated 5.486 billion yuan in revenue for 2024, a growth of 43.73% [1] - The consumer electronics equipment business remained stable with a revenue of 2.143 billion yuan [1] - General industrial laser processing equipment revenue reached 5.971 billion yuan in 2024, growing by 7.64%, with high-power laser cutting equipment contributing 2.963 billion yuan, a 26.67% increase [4] Market Trends and Innovations - AI technology is driving innovation in the consumer electronics sector, with the company responding to customized demands by offering products like laser welding machines and automated assembly equipment [2] - The company is expanding its overseas production, research, and sales teams to capture market opportunities arising from the diversification of the consumer electronics supply chain [2] - The lithium battery equipment sector is shifting focus from domestic to international markets, with the company collaborating with major clients to enhance competitiveness [3] Product Development and R&D - The semiconductor equipment business remains stable, with new product developments such as SiC crystal ingot laser debonding machines and laser de-bonding equipment receiving formal orders from major clients [3] - The company has successfully developed various new devices, including the fourth-generation semiconductor diamond laser debonding technology, filling a domestic technology gap [3] - The company launched the world's first 150KW ultra-high power cutting machine, enhancing its market presence in high-end applications [4] Future Outlook - The company is projected to achieve net profits of 1.699 billion yuan, 2.069 billion yuan, and 2.503 billion yuan from 2025 to 2027, with corresponding EPS of 1.61, 1.97, and 2.38 yuan [5] - The company is positioned as a leading provider of smart manufacturing equipment and solutions, with a strong vertical integration advantage [5]