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大咖云集、百亿签约!都在无锡这场盛会
为抢抓集成电路产业发展新机遇,打造具有国际竞争力的集成电路产业集群,9月4日,2025集成电路(无锡)创新发展大会在无锡举办,3000余名院士专 家、企业高管应邀参加活动,同期举办的半导体设备与核心部件展展商数量超1130家,规模再创新高。 大会主题为"与锡同行融合创芯",总体采用"1+5"架构,即1场开幕式、5场系列活动,包含人工智能、汽车电子、先进封装、高端装备及关键材料等领 域,集聚国内外集成电路重点企业和产业资源,通过资源共享、优势互补、协同创新等方式,实现产业链上下游的高效协同和共同发展。 大会参会嘉宾阵容豪华、大咖云集。华虹半导体总裁白鹏、中微公司董事长兼总经理尹志尧、摩尔线程创始人张建中等,围绕集成电路制造、高端制造、 人工智能等领域开展主题演讲,前瞻行业趋势,共话未来发展。 大会期间,共有57个项目成果签约落地,有55项为产业项目,涉及高端装备、关键材料等,总投资达177.21亿元。其中装备及零部件领域项目数量和规模 居首位,覆盖检测、分选、减薄等整机设备,以及离子预处理、磁流体、热处理等关键环节。 本届大会上,长三角国家技术创新中心车规级芯片中试服务平台、无锡先进制程半导体纳米级光刻胶中试线 ...
2025集成电路(无锡)创新发展大会开幕, 57个项目成果签约落地
多个重磅项目揭牌,为产业攀高造势聚力 集成电路是支撑国家经济社会发展和保障国家安全的战略性、基础性和先导性产业,是引领新一轮科技革命和产业变革的关键力量。为抢抓集成电路产业发 展新机遇,打造具有国际竞争力的集成电路产业集群,9月4日—6日,2025集成电路(无锡)创新发展大会在无锡拉开帷幕,3000余名院士专家、企业高管应 邀参加活动,同期举办的半导体设备与核心部件展展商数量超1130家,规模再创新高。 无锡集成电路产业规模居全国第二 集成电路产业与无锡的缘分可追溯至上世纪60年代。作为集成电路产业的重要发源地,无锡半个多世纪以来持续深耕产业赛道,先后承担了国家微电子"六 五""七五"和"908"工程,集聚了华虹、卓胜微(300782)、长电科技(600584)等龙头企业,培育形成了较为完整的集成电路全产业链。截至2024年底,无 锡集成电路产业链上企业数量超600家,产值达2512亿元,产业规模位居全国第二。今年上半年,全市集成电路产业营收同比增长12%,延续了稳中向好的 发展势头。 作为无锡倾力打造的集成电路产业品牌活动,集成电路(无锡)创新发展大会在推动产业进步中扮演着至关重要的角色,同期举办的半导体设 ...
一份PPT带你看懂光刻胶分类、工艺、成分以及光刻胶市场和痛点
材料汇· 2025-05-25 14:37
Core Viewpoint - The article provides an in-depth analysis of photoresists, focusing on their types, compositions, and the processes involved in their application in semiconductor manufacturing. Group 1: Types of Photoresists - Positive photoresists undergo a decomposition reaction upon exposure to light, resulting in high resolution and good contrast, but they have lower adhesion and higher costs [3][8]. - Negative photoresists form a cross-linked structure upon exposure, which enhances adhesion and etch resistance, but can lead to deformation during development [3][37]. Group 2: Composition of Positive Photoresists - The main component of positive photoresists is phenolic resin, which is soluble in alkaline developers and can be easily cross-linked through thermal reactions [12][35]. - The average molecular weight of the resin typically ranges from 1000 to 3000 g/mole, consisting of 8 to 25 repeating units [17]. Group 3: Development Process - The development process for positive photoresists involves using alkaline developers, which are often based on sodium hydroxide or potassium hydroxide solutions [94]. - The choice of developer is crucial, as it must be compatible with the photoresist to ensure effective development without residue [102][106]. Group 4: Process Conditions - Recommended process conditions for applying photoresists include specific spin speeds and baking temperatures to achieve desired film thickness and uniformity [62][73]. - The article emphasizes the importance of controlling environmental factors such as humidity and temperature during the photoresist application process to avoid defects [78][113]. Group 5: Sensitivity to Environmental Factors - Positive photoresists are particularly sensitive to humidity, which can affect their performance during the development process [25][36]. - The article discusses the impact of temperature on the development rate, highlighting the need for precise control to avoid underdevelopment or overdevelopment [113][116]. Group 6: Conclusion - The article concludes that understanding the properties and processes of photoresists is essential for optimizing semiconductor manufacturing and achieving high-quality results [1][10].