Core Viewpoint - The article discusses the emergence of Mobile HBM (High Bandwidth Memory) technology for mobile devices, highlighting the confusion surrounding its definition and potential applications in flagship smartphones by 2027 [1][4]. Summary by Sections HBM Characteristics - HBM utilizes 3D TSV stacking and ultra-wide I/O buses, making it suitable for high-performance processors like GPUs and TPUs [2][3]. - HBM modules can achieve bandwidths of up to 1024GB/s, with HBM3 and HBM3E offering speeds of 7-8Gbps/Pin and 10Gbps/Pin respectively [3]. Misunderstanding of Mobile HBM - The term "Mobile HBM" originated from a report by ETnews, which speculated on its use in the iPhone 20 anniversary model, leading to widespread misinterpretation [4][6]. - Many media outlets misrepresented "Mobile HBM" as a low-power version of HBM, which is not accurate [6]. LLW DRAM Insights - LLW DRAM, introduced by Samsung, is a low-power DRAM aimed at terminal AI applications, achieving a bandwidth of 128GB/s with a power consumption of only 1.2pJ/bit [6]. - The Vision Pro AR/VR headset utilizes a different packaging method that achieves high bandwidth without employing HBM's TSV stacking [6]. Clarification on Packaging Technologies - VFO and VCS are new packaging technologies that are small and thin but fundamentally different from HBM, lacking the official designation of "Mobile HBM" [7]. - The term "Mobile HBM" appears to be a coined term by ETnews, not recognized by industry standards or manufacturers [7].

Core Viewpoint - Samsung plans to launch its first mobile product featuring LPW DRAM memory by 2028, which is expected to significantly enhance performance and reduce power consumption in mobile devices [1][15]. Group 1: HBM in Automotive Sector - The automotive industry is increasingly adopting HBM memory due to the rising demand for real-time data processing and high-resolution image handling in advanced driving assistance systems and smart cockpit systems [2][4]. - SK Hynix's HBM2E has already been integrated into Waymo's autonomous vehicles, marking a significant entry of HBM into the automotive sector [3]. - The global automotive storage chip market is projected to grow from $4.76 billion in 2023 to $10.25 billion by 2028, with demand for HBM in automotive applications expected to surpass that in data centers [5]. Group 2: HBM in Mobile Devices - The rapid advancement of AI and 5G technologies is driving the need for high-performance memory in mobile devices, as they require higher bandwidth and lower latency for complex applications [7][9]. - Mobile HBM, developed by Samsung and SK Hynix, utilizes advanced 3D stacking technology to significantly increase memory bandwidth, achieving data transfer rates of hundreds of GB/s [9][10]. - Samsung's LPW DRAM is expected to achieve a bandwidth of over 200GB/s, a 166% increase compared to existing LPDDR5x, while reducing power consumption to 1.9pJ/bit, which is 54% lower than LPDDR5x [16]. Group 3: Competitive Landscape - Samsung and SK Hynix are competing in the mobile HBM market, with Samsung focusing on high bandwidth designs and SK Hynix prioritizing low power consumption and cost-effectiveness [20][21]. - The development of mobile HBM is expected to shift from a supplier-centric model to a demand-driven approach, allowing for customized solutions tailored to specific customer needs [21]. - As both companies advance their technologies, the competition will likely influence the market dynamics for mobile HBM, impacting the performance of smartphones, PCs, and AR/VR devices [20][26].