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兆芯集成、盛合晶微、中图科技科创板IPO已问询
Xin Lang Cai Jing· 2026-02-02 01:39
本周(1月26日至2月1日),共5家冲刺科创板IPO企业更新进展。 作者 | 陈俊清 本周(1月26日至2月1日),共5家冲刺科创板IPO企业更新进展。 其中,泰金新能、联讯仪器注册生效;兆芯集成、盛合晶微、中图科技已问询。 | 发行人全称 板块 | | | 保荐机构 律师事务所 会计师事务所 更新日期 > 受理日期 > | | --- | --- | --- | --- | | 盛合晶微半导体有限公司 | 科创板 已问词 境外 计算机、通信和其... 中国国际金融.. 上海市锦天城.. 容诚会计师事... 2026-02-01 2025-10-30 | | | | 苏州联讯仪器股份有限公司 科创板 注册生效 江苏 仪器仪表制造业 | | 中信证券股份... 北京德恒律师... 容诚会计师事... 2026-01-30 2025-08-15 | | | 广东中图半导体科技股份有 科创板 已问间 广东 计算机、通信和亮... 国泰海通证券... 北京市中伦律... 天健会计师事... 2026-01-28 2025-12-31 | | | | | 限公司 | | | | | 上海兆芯集成电路股份有限 科创板 已 ...
这一芯片问题,不容忽视!
半导体行业观察· 2026-01-10 03:37
Core Viewpoint - The article discusses the increasing complexity and challenges of end-to-end security in semiconductor manufacturing, particularly with the rise of multi-chip packaging and edge computing, which complicates supply chain tracking and security measures [1][2][3]. Group 1: Challenges in Multi-Chip Packaging - Multi-chip packaging enhances performance but complicates supply chain tracking, as components may come from different manufacturers [1]. - The aging of chipsets under different workloads can introduce unforeseen vulnerabilities, especially with new components developed using advanced nodes like 3nm [1]. - The fragmentation of chip production among various suppliers increases complexity, making it difficult to ensure compatibility and security across the supply chain [2]. Group 2: Security Measures and Standards - There is a need for comprehensive security measures throughout the supply chain, from chip manufacturing to final product deployment, to mitigate risks associated with malicious chips [3][4]. - The introduction of the EU's Cyber Resilience Act (CRA) mandates companies to assess their security vulnerabilities and supply chain risks, pushing for a more standardized approach to security [5]. - Companies are encouraged to embed unique identifiers in chips to enhance traceability and security [4][5]. Group 3: Long-Term Security Considerations - The longevity of products necessitates ongoing assessments of potential security vulnerabilities that may arise over time [9][10]. - The automotive industry exemplifies the need for long-term security planning, as vehicles may have lifespans of up to 40 years, requiring continuous updates and risk assessments [10]. - Quantum computing poses a future threat to existing encryption methods, necessitating proactive measures during the design phase [9][10]. Group 4: Role of Artificial Intelligence - AI can be utilized to identify security vulnerabilities that are difficult for humans to detect, enhancing the overall security of systems [11]. - However, AI systems themselves require strict controls to prevent independent communication that could compromise security [11][12]. - The development of unified standards for AI in security is still in progress, with organizations working towards establishing comprehensive guidelines [12]. Group 5: Conclusion on Security Landscape - Security has transitioned from a secondary consideration to a primary focus across all stages of electronic system development, with companies facing significant penalties for neglecting security [12]. - Achieving true end-to-end security remains uncertain, but the motivation for companies to pursue it has increased alongside the challenges they face [12].
芯片市场,1454亿美元
半导体芯闻· 2025-11-19 10:32
Group 1 - The chip market is expected to reach a size of $9.2 billion in 2024 and grow at a compound annual growth rate (CAGR) of 29.1% from 2026 to 2035, reaching $145.4 billion by 2035 [2] - The Japanese chip market is projected to grow at a CAGR of 30.3%, driven by factors such as the domestic IoT ecosystem, aging population leading to increased medical device usage, and the development of robotic infrastructure for AI applications [2] - The chip group market is expanding as chipsets can produce small, independent functional modules, becoming a viable alternative to large single chips, which require significant capital investment and have lower yields [2] Group 2 - CPU chips will dominate the market as the core of computing systems, with 2.5D/3D packaging expected to hold approximately 48% market share [3] - The North American market is experiencing steady growth, primarily due to its leadership in AI cloud infrastructure and high-performance computing [3] - The Asia-Pacific region holds the largest market share at 42% and leads the market with a CAGR of 28.9%, driven by demand for modular chip architectures in consumer electronics, IoT, automotive electrification, and 5G/6G deployment [3]
黄仁勋称英特尔33年试图消灭英伟达,如今双方合作共赢
Xin Lang Ke Ji· 2025-10-09 03:01
Core Viewpoint - NVIDIA CEO Jensen Huang humorously stated that Intel has spent 33 years trying to eliminate NVIDIA, reflecting on their historical rivalry and recent collaboration [1] Group 1: Historical Context - In the early 21st century, Intel was the dominant player in the computing industry, leading in both consumer and professional markets [1] - NVIDIA initially signed a contract with Intel to manufacture chipsets but later shifted to internal design, leading to a licensing dispute that NVIDIA ultimately won [1] Group 2: Current Collaboration - Huang emphasized that the key to their current partnership is his friendship with Intel's current CEO, Pat Gelsinger [1] - The collaboration is expected to create a win-win situation for both companies in the evolving AI hardware market, with Huang stating, "We are friends, not rivals" [1]