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马年IPO第一审!无锡“独角兽”成功过会
Xin Lang Cai Jing· 2026-02-26 10:25
Group 1 - Wu Qingwen emphasized the importance of promoting efficient and convenient flow of factors between Shanghai and Suzhou, aiming to accelerate the integration of the two cities [3] - The Shanghai Airport-Suzhou front cargo station is the first cross-province and cross-customs area airport customs integrated supervision station in the country, enhancing logistics efficiency [3] - The integration of Shanghai and Suzhou is seen as a significant opportunity for Suzhou's development, with plans to deepen cooperation in technology innovation and resource sharing [3] Group 2 - Shenghe Jingwei, established in November 2014, is a leading global advanced packaging and testing enterprise for integrated circuits, focusing on advanced 12-inch wafer processing [4] - The company plans to raise 4.8 billion yuan for projects related to three-dimensional multi-chip integration packaging, aiming to enhance technological innovation and expand product offerings [5] - Shenghe Jingwei's services support high-performance chips, particularly GPUs, CPUs, and AI chips, through heterogeneous integration methods to improve performance metrics [4]
马年首家IPO过会,盛合晶微拟募资48亿元
Sou Hu Cai Jing· 2026-02-25 10:14
Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has successfully passed the listing review by the Shanghai Stock Exchange for its IPO on the Sci-Tech Innovation Board, becoming the first company to be approved in the Year of the Rabbit [1] Group 1: Company Overview - Shenghe Jingwei is a leading global advanced packaging and testing enterprise for integrated circuits, specializing in advanced 12-inch silicon wafer processing and providing full-process advanced packaging services [1] - The company focuses on supporting high-performance chips, particularly GPUs, CPUs, and AI chips, aiming to enhance performance through heterogeneous integration that surpasses Moore's Law, achieving high computing power, high bandwidth, and low power consumption [1] Group 2: Financial Performance - For the years 2023, 2024, and the first half of 2025, Shenghe Jingwei is projected to achieve operating revenues of 3.038 billion yuan, 4.705 billion yuan, and 3.178 billion yuan, respectively, with net profits attributable to the parent company of 34.13 million yuan, 214 million yuan, and 435 million yuan [1] Group 3: IPO Details - The company plans to raise 4.8 billion yuan through its IPO, which will be allocated to projects including three-dimensional multi-chip integration packaging and ultra-high-density interconnect three-dimensional multi-chip integration packaging, focusing on scaling the chiplet multi-chip integration packaging technology platform and enhancing bump manufacturing capacity [1] Group 4: Shareholding Structure - In the past two years, Shenghe Jingwei has had no controlling shareholder or actual controller. As of the signing date of the prospectus, the largest shareholder, Wuxi Industrial Development Fund, holds a 10.89% stake, while the second largest shareholder, the Zhuhai Bank system, controls 9.95%, and the third largest shareholder, the Houwang system, holds 6.76% [2]
上峰水泥参股公司盛合晶微科创板上市申请通过审议
Zhi Tong Cai Jing· 2026-02-24 10:11
Core Viewpoint - The company Shenghe Jingwei, in which the company holds a stake, has received approval for its initial public offering (IPO) and listing on the Sci-Tech Innovation Board [1] Group 1 - Shenghe Jingwei is an advanced packaging and testing enterprise for integrated circuits, starting with 12-inch mid-range silicon wafer processing [1] - The company provides a full range of advanced packaging and testing services, including wafer-level packaging (WLP) and chiplet multi-chip integration packaging [1]
上峰水泥(000672.SZ)参股公司盛合晶微科创板上市申请通过审议
智通财经网· 2026-02-24 10:10
Core Viewpoint - The company Shengtai Cement (000672.SZ) announced that its associate company, Shenghe Jingwei, has received approval for its initial public offering (IPO) and listing on the Sci-Tech Innovation Board [1] Group 1: Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise specializing in integrated circuit wafer-level packaging [1] - The company started with 12-inch mid-range silicon wafer processing and offers a full range of advanced packaging services, including wafer-level packaging (WLP) and chiplet multi-chip integrated packaging [1]
盛合晶微IPO无实控人,汪灿等6名董事与股东关联关系披露
Sou Hu Cai Jing· 2026-02-03 09:11
Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has responded to the second round of IPO inquiry from the Sci-Tech Innovation Board, with CICC as the sponsor [2] Group 1: Company Structure and Shareholding - The company has no actual controller, and major shareholders holding more than 5% of shares, including Advpackaging, have committed to a 36-month lock-up period starting from the listing date, with a total lock-up ratio of 39.22% [2] - There are interconnections among several shareholders, such as Puhua Chuangyu, Puhua Zhixin, and Hua Capital, which can be traced back to three natural person shareholders: Liu Yue, Chen Datong, and Wu Haibin [2] Group 2: Board and Management Relationships - The board consists of 9 directors, with some directors having relationships with shareholders, including being appointed by relevant shareholders or holding more than 5% equity in related shareholders [4] - The company has confirmed that there are no undisclosed relationships between senior management and shareholders, aside from those already disclosed [4] Group 3: Director Backgrounds - The company provided a detailed table of directors and their relationships with shareholders, indicating various levels of involvement and shareholdings [5] - Notable positions include the Chairman and CEO, who holds 18.14% of the equity in the employee stock ownership platform, and other directors with similar ties to shareholder entities [5] Group 4: Business Overview - Shenghe Jingwei is an advanced packaging and testing enterprise in the integrated circuit industry, focusing on 12-inch silicon wafer processing and providing advanced packaging services such as wafer-level packaging (WLP) and multi-chip integration packaging [2] - The company aims to support high-performance chips, particularly GPUs, CPUs, and AI chips, by enhancing performance through heterogeneous integration beyond Moore's Law, achieving high computing power, high bandwidth, and low power consumption [2]