Core Viewpoint - The advanced packaging market is expected to grow significantly, driven by trends in generative AI, high-performance computing (HPC), and the recovery of mobile and consumer markets, with a projected increase from $37.8 billion in 2023 to $69.5 billion by 2029, representing a compound annual growth rate (CAGR) of 12.9% [2][44]. Group 1: Overview of Advanced Packaging - Advanced packaging differs from traditional packaging in terms of equipment, materials, and technology, offering advantages such as miniaturization, lightweight, high density, low power consumption, and functional integration [6]. - The advanced packaging market in China has seen rapid growth, increasing from 42 billion yuan in 2019 to 79 billion yuan in 2023, with a projected market size of 134 billion yuan by 2029, reflecting a CAGR of 9% from 2024 to 2029 [8][10]. Group 2: Application Areas of Advanced Packaging - System-in-Package (SiP) is a key growth driver in the advanced packaging market, with the consumer electronics sector being the largest downstream application, accounting for 70% of SiP applications [14]. - High-Density Flip Chip (FC) packaging has significant growth potential in mobile and consumer markets, with the FC-CSP segment expected to exceed $10 billion by 2026 [17]. - The QFN/DFN packaging market is projected to grow from $13.65 billion in 2023 to $30.68 billion by 2032, with a CAGR of approximately 9.42% [22][24]. - MEMS packaging is also gaining attention, with a market size of around $2.7 billion in 2022 and a CAGR of 16.7% from 2016 to 2022 [25]. Group 3: Representative Technologies in Advanced Packaging - Wafer Level Chip Scale Packaging (WLCSP) is characterized by its ability to provide higher bandwidth, speed, and reliability, with a market size expected to grow from $18.45 billion in 2023 to $43.5 billion by 2032, reflecting a CAGR of around 10% [27][29]. - WLCSP is widely applied in various fields, including consumer electronics, automotive, telecommunications, and healthcare, driven by the rise of IoT devices and smart technologies [37]. Group 4: Market Space and Forecast - The advanced packaging market is projected to reach $80 billion by 2029, with a CAGR of 12.7%, driven by AI and HPC applications [68]. - Advanced packaging shipment volume is expected to increase from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [70]. - The total advanced packaging wafer output is anticipated to grow at a CAGR of 11.6% from 2023 to 2029, with 2.5D/3D packaging expected to see the highest growth rate of 32.1% [73]. Group 5: Related Companies in Advanced Packaging - Key players in the advanced packaging sector include companies like JCET, which focuses on sensor packaging and has established a leading position in the WLCSP market [50]. - Other notable companies include Taiwan Semiconductor Manufacturing Company (TSMC), which has developed advanced packaging technologies across various applications, and Huatian Technology, which specializes in advanced packaging solutions for automotive and consumer electronics [50].

Core Viewpoint - Yongxi Electronics focuses on mid-to-high-end advanced packaging and testing business, enhancing its one-stop delivery capability of "Bumping+CP+FC+FT" and successfully breaking into major clients like MediaTek and Realtek, with fundraising aimed at increasing heterogeneous packaging capacity [1][5] Group 1: Financial Performance and Projections - The company plans to issue convertible bonds to raise up to 1.165 billion yuan, with 900 million yuan allocated for R&D and industrialization of advanced heterogeneous packaging technology [1] - The company expects to achieve revenue of 1.239 billion yuan and a net profit of 396 million yuan after the project reaches full production [1] - For the first half of 2025, the company anticipates revenue between 1.9 billion and 2.1 billion yuan, representing a year-on-year growth of 16.60% to 28.88% [3] - In Q2 2025, the expected revenue is between 955 million and 1.155 billion yuan, with a year-on-year growth of 0.96% to 22.11% [3] Group 2: Client Relationships and Market Position - The company has established a core customer base primarily consisting of well-known chip design companies, including partnerships with companies like Hengxuan Technology, Amlogic, and MediaTek [2] - Realtek and MediaTek are projected to be among the top five customers in 2024, with sales amounts of 231 million yuan and 225 million yuan, respectively [2] Group 3: Product Offerings and Technological Advancements - The company's packaging products include five major categories: FC products, SiP, WLP, QFN/DFN, and MEMS, with over 2,100 product varieties [2] - The company has achieved mass production of advanced system-level packaging products that can simultaneously package multiple chips and components, showcasing significant technological capabilities [4] - The company has reached industry-leading specifications in advanced wafer-level packaging, with minimum pitch and diameter of micro bumps at 45μm and 30μm, respectively [4]

Core Viewpoint - Chipone Microelectronics (芯碁微装) plans to initiate the process for issuing H-shares and listing on the Hong Kong Stock Exchange to enhance its international strategy and brand recognition [1][2]. Group 1: H-Share Listing Plans - The company's board approved the proposal to start preparations for the H-share issuance and listing on June 27, 2025, with a 12-month authorization period [1]. - The H-share listing aims to strengthen the company's capital strength and overall competitiveness [1]. - Specific details regarding the H-share listing are yet to be finalized, and the company will consult with relevant intermediaries [1]. Group 2: Previous Fundraising Activities - Chipone Microelectronics was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on April 1, 2021, raising a total of 460 million yuan, with a net amount of 416 million yuan after expenses [2][3]. - The company initially planned to raise 473 million yuan, with allocations for various projects including high-end PCB laser imaging equipment and wafer-level packaging [3]. - The total fundraising from the IPO and subsequent private placement amounts to 1.258 billion yuan [5]. Group 3: Recent Capital Increases - As of July 25, 2023, the company issued 10,497,245 shares at a price of 75.99 yuan per share, raising approximately 797.69 million yuan, with a net amount of about 789.36 million yuan after expenses [4].

[Table_Info1] 证券研究报告 [Table_Title] 证券研究报告 / 债券研究报告 [Table_Report] 相关报告 甬矽转债定价：首日转股溢价率 23%~28% ---东北固收转债分析 报告摘要： [Table_Summary] 6 月 24 日，甬矽电子发布公告，拟于 2025 年 6 月 26 日通过网上发行可 转债，公司本次计划发行可转换公司债券募集资金总额不超过 11.65 亿 元。其中 9 亿元拟用于投资"多维异构先进封装技术研发及产业化项目"， 总投资 14.64 亿元；2.65 亿元拟用于补充流动资金。 甬矽转债发行方式为优先配售，网上发行，债项和主体评级 A+。发行规 模为 11.65 亿元，初始转股价格为 28.39 元，参考 6 月 25 日正股收盘价 格 29.46 元，转债平价 103.77 元，参考同期限同评级中债企业债到期收 益率（6 月 24 日）为 5.97%，到期赎回价 113 元，计算纯债价值为 83.7 元。博弈条款方面，下修条款（15/30，85%）正常、赎回条款（15/30， 130%）正常、回售条款（30/30，70%）正常。综合来看，债券 ...

甬矽电子（宁波）股份有限公司 关于2025年上半年度主要经营数据的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 本公告所载甬矽电子（宁波）股份有限公司（以下简称"公司"）2025年上半年度主要经营数据为初步核 算数据，未经会计师事务所审计，具体数据以公司披露的2025年半年度报告为准，提请投资者注意投资 风险。 一、2025年半年度主要经营数据 证券代码：688362 证券简称：甬矽电子 公告编号：2025-043 1、2025上半年，随着全球终端消费市场出现回暖，集成电路行业景气度明显回升，在AI"创新驱动"的 周期下，新应用场景渗透率提升，下游需求稳健增长。 2、公司核心客户群竞争力持续增强，市场份额逐步提升，公司伴随客户一同成长；此外，公司客户结 构持续优化，海外大客户拓展、部分原有客户的份额提升使得公司营收规模持续增长。 3、公司晶圆级封装、汽车电子等产品线持续丰富，"Bumping+CP+FC+FT"的一站式交付能力不断提 升；先进封装产品线稼动率持续上升，成熟产品线稼动率饱满，整体稼动率稳中向好。上述因 ...

证券代码：688362 证券简称：甬矽电子 公告编号：2025-043 甬矽电子（宁波）股份有限公司 关于2025年上半年度主要经营数据的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 。 本公告所载甬矽电子（宁波）股份有限公司（以下简称"公司"）2025年上半年度 主要经营数据为初步核算数据，未经会计师事务所审计，具体数据以公司披露的2025 年半年度报告为准，提请投资者注意投资风险。 一、2025年半年度主要经营数据 经公司财务部初步测算，预计2025年半年度实现营业收入190,000.00万元到 210,000.00万元，较上年同期增长16.60%到28.88%。 二、业绩增长的主要原因 2025年上半年，公司营收规模同比增长。主要得益于以下几个方面： 1、2025上半年，随着全球终端消费市场出现回暖，集成电路行业景气度明显回 升，在AI"创新驱动"的周期下，新应用场景渗透率提升，下游需求稳健增长。 2、公司核心客户群竞争力持续增强，市场份额逐步提升，公司伴随客户一同成 长；此外，公司客户结构持续优化，海外大客 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 marklapedus 。 IBM 和 Deca Technologies 在半导体封装领域结成了重要联盟，此举将使 IBM 进入先进的扇出 型晶圆级封装市场。 根据该计划，IBM 预计将在其位于加拿大魁北克省南部城市布罗蒙特 (Bromont) 的现有封装工厂 内建立一条新的高产量生产线。未来某个时候，IBM 的新生产线预计将生产基于 Deca 的 M 系列 扇出型中介层技术 (MFIT) 的先进封装。MFIT 技术可实现一类新型复杂的多芯片封装。 尽管如此，IBM 多年来一直在布罗蒙特为外部客户提供封装和测试服务，以满足其内部需求。随 着 Deca 的宣布，IBM 将扩展其封装能力，并进入扇出型晶圆级封装 (FOWLP) 领域。 基本上，芯片在晶圆厂制造完成后，会被组装成封装。封装是一种小型外壳，用于保护一个或多个 芯片免受恶劣工作条件的影响。FOWLP 是一种先进的封装形式，可以将复杂的芯片集成到封装 中。FOWLP 和其他类型的封装有助于提升芯片性能。 Deca 的 MFIT 是 FOWLP 的 高级形式，其中最新的存储器件、 处 理 器 ...

Core Viewpoint - The global semiconductor materials market is projected to grow by 3.8% in 2024, reaching $67.5 billion, driven by the recovery of the overall semiconductor market and increasing demand for advanced materials in high-performance computing and high-bandwidth memory manufacturing [2] Semiconductor Materials Market Summary - In 2024, wafer manufacturing materials revenue is expected to grow by 3.3% to $42.9 billion, while packaging materials revenue is projected to increase by 4.7% to $24.6 billion [2] - The chemical mechanical planarization (CMP), photoresist, and photoresist auxiliary equipment segments are experiencing strong double-digit growth due to the complexity and number of processes required for advanced DRAM, 3D NAND flash, and cutting-edge logic ICs [2] - All semiconductor material segments, except silicon and silicon-on-insulator (SOI), are expected to show year-on-year growth [2] - Demand for silicon remains weak due to ongoing inventory digestion, leading to a projected 7.1% decline in silicon revenue in 2024 [2] Regional Market Insights - Taiwan continues to be the largest semiconductor materials consumer region with revenue of $20.1 billion for 15 consecutive years [3] - Mainland China is expected to achieve $13.5 billion in revenue, maintaining year-on-year growth and ranking second in 2024 [3] - South Korea ranks third with $10.5 billion in revenue, while all regions except Japan are expected to achieve single-digit growth in 2024 [3] Advanced Semiconductor Packaging Market Forecast - The advanced semiconductor packaging market is valued at $18.09 billion in 2024 and is expected to reach $29.8 billion by 2031, with a compound annual growth rate (CAGR) of 7.5% [5] - The shift in value creation from front-end miniaturization to back-end integration is anticipated to drive strong double-digit growth in the advanced semiconductor packaging market by 2030 [5] - Demand for heterogeneous chip architecture, high-bandwidth memory stacks, ultra-thin fan-out modules, and automotive-grade power packaging is continuously increasing [5] Packaging Technology Developments - Flip-chip packaging technology is replacing long wire bonding, providing improved thermal performance and enabling higher power ranges without compromising performance [6] - Fan-out wafer-level packaging (FO WLP) offers ultra-thin packaging suitable for space-constrained devices, enhancing economic viability for mid-range smartphones and IoT sensors [7] - Advanced packaging technologies are being adopted in automotive applications to meet stringent AEC Q100 standards, driven by the need for high reliability and durability [7] Market Drivers and Trends - The transition from monolithic scaling to heterogeneous integration is driving demand for advanced packaging, integrating logic, memory, analog, and photonic chips into single system-in-package solutions [8] - The proliferation of 5G base stations and edge AI gateways relies on advanced packaging methods to meet thermal and signal integrity requirements [8] - The demand for AI accelerators and high-performance computing is pushing OSAT manufacturers to develop larger organic substrates and advanced filling materials, leading to higher average selling prices and long-term capacity investments [9] Consumer Electronics and Wearable Devices - The growing demand for smartphones, AR glasses, and health monitoring wearables is prompting OEMs to shift towards WLP, FO PLP, and molded embedded packaging [10] - The reduction in the number of discrete components per circuit board is freeing up battery space and enhancing waterproof performance, while also shortening design cycles [10]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 semiconductor-digest ，谢谢。 SEMI今日在其材料市场数据订阅（MMDS）中报告称，2024年全球半导体材料市场收入将增长 3.8%，达到675亿美元。整体半导体市场的复苏，以及高性能计算和高带宽存储器制造对先进材料 需求的不断增长，支撑了2024年材料收入的增长。 2024年，晶圆制造材料收入增长3.3%，达到429亿美元；封装材料收入增长4.7%，达到246亿美 元。化学机械平坦化(CMP)、光刻胶及光刻胶辅助设备细分市场实现了强劲的两位数增长，这得益 于先进DRAM、3D NAND闪存和前沿逻辑集成电路(IC)所需的工艺复杂性和工序数量的增加。除 硅和绝缘体上硅(SOI)外，所有半导体材料细分市场均实现了同比增长。由于行业持续消化过剩库 存，2024年对硅的需求（尤其是在后缘细分市场）依然疲软，导致2024年硅收入下降7.1%。 台湾地区以201亿美元的营收连续15年成为全球最大的半导体材料消费地区。中国大陆地区以135 亿美元的营收继续实现同比增长，将在2024年位居第二；韩国则以105亿美元的营收位居第三。除 日本外 ...

Investment Rating - The report upgrades the investment rating to "Buy" based on expected growth in the PCB and semiconductor sectors driven by AI and electric vehicle demand [4][9]. Core Insights - The company reported a revenue of 954 million yuan for 2024, a year-on-year increase of 15.09%, while the net profit attributable to shareholders was 161 million yuan, a decrease of 10.38% [1][2]. - In Q1 2025, the company achieved a revenue of 242 million yuan, representing a year-on-year growth of 22.31% and a significant sequential increase of 2.63% [1][2]. - The company is focusing on high-end PCB products, with over 60% of sales coming from mid-to-high-end products in 2024, and is expanding its international presence, particularly in Southeast Asia [3][9]. Financial Performance Summary - Revenue projections show a steady increase from 829 million yuan in 2023 to 2,380 million yuan by 2027, with a compound annual growth rate (CAGR) of 27.1% [1][10]. - The net profit is expected to rise from 179 million yuan in 2023 to 470 million yuan in 2027, with a notable increase of 74.2% in 2025 [1][10]. - The company's return on equity (ROE) is projected to improve from 8.8% in 2023 to 15.5% in 2027, indicating enhanced profitability [1][10]. Market Trends and Strategic Focus - The report highlights the acceleration of high-end PCB trends and the company's strategic focus on high-end markets such as HDI boards and IC substrates, which are expected to drive future growth [3][9]. - The company is also benefiting from the domestic substitution trend in the semiconductor sector, with its IC substrate products achieving international standards [3][9].