Group 1 - The core argument is that China's chip industry has made significant advancements despite facing challenges from Western sanctions, leading to a shift in the global chip market dynamics [1][5][9] - The price of 6-inch silicon carbide wafers has dropped from $1500 to $500, forcing American companies to engage in a price war, resulting in a 96% decline in their stock prices over three years [3][11] - China's chip industry has benefitted from long-term government support, with initiatives dating back to 2000, leading to the establishment of companies like SMIC and Huahong Semiconductor [7][11] Group 2 - Since 2019, Chinese chip companies have focused on independent research and development, achieving a monthly production capacity of 750,000 mature chips, surpassing TSMC's capacity of 450,000 [11][15] - The average export price of domestically produced mature chips is about 60% of that of international counterparts, indicating a significant price advantage for Chinese products [17] - While advancements have been made, the Chinese chip industry still faces challenges in advanced process technologies and must continue to strive for self-sufficiency [19]

Core Viewpoint - The article discusses the escalating trade tensions between the United States and China, highlighting China's firm opposition to U.S. tariffs and the broader implications for global trade dynamics [1][3]. Group 1: U.S. Tariff Strategy - Trump's "reciprocal tariffs" are characterized as a gamble, with a sudden increase of 10% tariffs on all trade partners and a 34% tariff on Chinese goods, aiming to reshape global trade rules through unilateral actions [4]. - The U.S. strategy involves a "divide and conquer" approach, attempting to isolate trade partners and force them into unequal agreements, as evidenced by the announcement of potential agreements with select countries while sidelining others [4][6]. - The European Union faces a dilemma, with leaders warning against accepting unequal agreements while preparing for potential high tariffs [4]. Group 2: China’s Response and Strategy - China has established a counter-strategy, including significant price reductions in semiconductor manufacturing and strengthening regional trade agreements, such as the China-ASEAN Free Trade Area [9]. - The Chinese government emphasizes its control over strategic resources, particularly rare earth elements, which are crucial for U.S. military applications, indicating a strategic leverage point in the trade conflict [7][11]. - China's response mechanisms have evolved, with quicker reaction times and a more sophisticated array of countermeasures, including tariffs and legal actions through the WTO [11]. Group 3: Global Trade Dynamics - The article highlights the shifting trade landscape, with ASEAN's trade with China surpassing that with the U.S., indicating a realignment of global trade relationships [9]. - The establishment of a cross-border payment system in RMB and various currency swap agreements signifies China's efforts to enhance its financial influence globally [9]. - The ongoing negotiations and strategic maneuvers reflect a broader struggle for dominance in global trade, with both nations seeking to secure their interests amid rising tensions [3][9].

Core Viewpoint - The article provides an in-depth analysis of SMIC (Semiconductor Manufacturing International Corporation), focusing on its financial model and growth prospects, particularly in the context of China's semiconductor policies and market dynamics [1]. Financial Indicators - Revenue is projected to grow from $2.07 billion in 2017 to $23.04 billion in 2028, with a compound annual growth rate (CAGR) of 24.8%, driven by the expansion of 28nm and above mature process capacities, especially post-2020 due to global chip shortages and domestic semiconductor policies [2]. - Gross margin is expected to increase from 21.2% in 2017 to 26.1% in 2028, benefiting from scale effects in mature processes, although it remains significantly lower than TSMC's 55% during the same period [2]. - EBITDA is forecasted to rise from $730 million to $12.17 billion, with EBITDA margin improving from 35.5% to 48.5%, indicating enhanced operational efficiency [2]. Capital Expenditure - Capital expenditures (Capex) are set to reach $7.326 billion in 2024, increasing to $8.69 billion in 2025 and peaking at $9.622 billion in 2026, reflecting a CAGR of 18.4% from 2017 to 2028, which is higher than the revenue growth rate [3]. - 90% of Capex is allocated to equipment procurement, primarily for mature process technologies, with 10% for wafer fab infrastructure [4]. - High Capex leads to significant depreciation costs, projected to reach $3.742 billion in 2024, which will pressure profit margins [4]. Business Structure - The wafer business is the core revenue driver for SMIC, contributing approximately 93.2% of total revenue in 2018, expected to rise to 95% by 2024 [7]. - Revenue from the 12/14nm nodes has shown rapid growth, from nearly negligible in 2019 to an estimated $838 million in 2024, driven by increasing market demand [8]. - The 28nm node remains a significant revenue contributor, with expected revenue of approximately $1.145 billion in 2024, despite facing competitive pressures [9]. Capacity and Market Competitiveness - Total capacity is projected to reach 884,000 wafers per month in 2024, increasing to 941,000 in 2025, with major production bases in Shanghai, Beijing, Shenzhen, and Tianjin [13]. - The Shanghai facility focuses on advanced processes, while the Beijing plant targets mature processes, with a significant portion of Capex directed towards expanding capacity in response to rising automotive electronics demand [13]. - Risks include potential impacts from U.S. sanctions on equipment maintenance and over-reliance on policy subsidies, which could lead to price competition [13]. R&D Investment and Technological Innovation - R&D expenditures are expected to rise to $1.031 billion in 2024, accounting for 9.4% of revenue, with a focus on optimizing 14nm FinFET processes and developing IoT chips [16]. - Despite increased R&D spending, challenges remain due to U.S. sanctions limiting access to advanced equipment, resulting in lower yield rates for 14nm processes [16]. - The company aims to balance high R&D intensity with policy requirements, although the return on investment in R&D is projected to be below the cost of capital, indicating diminishing marginal returns [17][18].

Core Viewpoint - SBI Holdings has terminated its partnership with Powerchip Semiconductor Manufacturing Corporation (PSMC) for the construction of a semiconductor fab in Miyagi Prefecture, Japan, and is now seeking collaboration with United Microelectronics Corporation (UMC) and SK Hynix for the same project [2]. Group 1: SBI Holdings and Semiconductor Factory Plans - SBI Holdings announced the cancellation of its collaboration with PSMC on September 27, 2024, but will continue with the plan to build the semiconductor factory in Miyagi [2]. - The Miyagi fab will be developed in two phases, with the first phase expected to start production in 2027, targeting a monthly capacity of 10,000 12-inch wafers for 40nm and 55nm chips [2]. - The second phase is projected to begin production in 2029, expanding the product range to include 28nm chips and utilizing Wafer-on-Wafer (WoW) technology, with a full capacity of 40,000 wafers per month [2]. Group 2: UMC's Financial Performance - UMC reported a consolidated revenue of NT$18.193 billion in February, a decrease of 8.15% month-over-month, marking the lowest level in nearly eight months, but still a year-on-year increase of 4.25% [4]. - The cumulative revenue for the first two months reached NT$38 billion, reflecting a year-on-year growth of 4.21%, also the second-highest for the same period since 2022 [4]. - UMC anticipates that its wafer shipment volume will stabilize compared to the fourth quarter of the previous year, with a capacity utilization rate around 70% [4]. Group 3: Future Outlook for UMC - UMC has noted strong customer interest in upgrading to the 22nm special process platform, which offers significant advantages in power consumption and performance over the 28nm process, aimed at next-generation communication technologies and display driver ICs [5]. - The company is accelerating the production of 22nm products, expecting them to contribute significantly to revenue starting in 2025 [5]. - Key expansion projects are progressing as planned, including a third fab in Singapore to enhance supply chain resilience and a collaboration with U.S. partners to develop a 12nm process platform to meet customer demands for upgrades below 22nm [5].