Core Viewpoint - The company has demonstrated strong growth in its order backlog and is actively expanding its market presence in the semiconductor equipment industry, driven by technological advancements and product development [4][5]. Group 1: Order Backlog and Growth - As of September 29, 2025, the company's order backlog reached 9.072 billion yuan, representing a year-on-year increase of 34.10% [4]. - The semiconductor equipment demand in China has remained robust in 2025, allowing the company to deepen its existing market and explore new opportunities [4]. Group 2: Fundraising and Investment - The company announced a plan to issue A-shares to specific investors, aiming to raise 4.482 billion yuan through the issuance of 38.6013 million shares at a price of 116.11 yuan per share [4]. - The raised funds will primarily be allocated to three projects: the construction of R&D and process testing platforms, iterative R&D of high-end semiconductor equipment, and supplementing working capital [6]. Group 3: Product Development and Innovation - The company has placed significant emphasis on product R&D, with new products contributing to sustained order growth [5]. - In March 2025, the company successfully validated its self-developed single-wafer high-temperature SPM equipment with key customers, which is crucial for the manufacturing of next-generation semiconductor devices [5]. - The delivery of the 1500th electroplating chamber for ECP equipment in the first half of 2025 has achieved full coverage of electroplating technology across various applications [5].

Core Viewpoint - The company reported a significant increase in its order backlog, reaching 9.072 billion yuan as of September 29, 2025, representing a year-on-year growth of 34.10% due to strong demand in the semiconductor equipment sector [1] Group 1: Order Backlog and Market Demand - As of September 29, 2025, the company's order backlog totaled 9.072 billion yuan, marking a 34.10% increase compared to the same period last year [1] - The semiconductor equipment demand in China has remained robust since the beginning of 2025, allowing the company to deepen its existing market presence and explore new markets [1] Group 2: Fundraising and Investment - On September 30, 2025, the company announced a plan to issue A-shares to specific investors, aiming to raise 4.482 billion yuan by issuing 38.6013 million shares at a price of 116.11 yuan per share [1] - The raised funds will primarily be allocated to three projects: research and development, high-end semiconductor equipment iteration, and supplementing working capital [2] Group 3: Product Development and Innovation - The company emphasizes product research and development, with new products contributing to sustained order growth [2] - In March 2025, the company’s self-developed high-temperature SPM equipment successfully passed key customer validation, which is crucial for the manufacturing of next-generation semiconductor devices [2] - The company’s ECP equipment has achieved full coverage in electroplating technology, with the 1500th electroplating chamber delivered in the first half of 2025 [2] - The company’s panel-level horizontal electroplating equipment received the "Technology Enablement Award" from the 3D InCites Association, highlighting its innovation [2] Group 4: Profit Forecast and Valuation - The company maintains profit forecasts for 2025 and 2026 at 1.476 billion yuan and 1.829 billion yuan, respectively, with a new forecast for 2027 at 2.285 billion yuan [3] - Corresponding PE ratios are projected at 59x, 47x, and 38x for the respective years [3] - The company is positioned as a leading player in the domestic semiconductor cleaning equipment market, expected to benefit from performance growth driven by domestic production [3]

Investment Rating - The report maintains a "Buy" rating for the company [3][5]. Core Views - The company has seen a significant increase in its order backlog, reaching 9.072 billion yuan as of September 29, 2025, representing a year-on-year growth of 34.10% [1]. - The semiconductor equipment demand in China remains strong, and the company is leveraging its technological advantages and market recognition to expand its market presence [1]. - The company successfully raised 4.482 billion yuan through a private placement of shares, which will primarily be used for R&D projects and working capital [2]. Summary by Sections Company Orders and Financials - As of September 29, 2025, the company's order backlog is 9.072 billion yuan, a 34.10% increase year-on-year [1]. - The company reported a net profit forecast of 1.476 billion yuan for 2025, with projections of 1.829 billion yuan for 2026 and 2.285 billion yuan for 2027 [3]. Product Development and Market Position - The company emphasizes product R&D, with new products contributing to continuous order growth [2]. - The successful validation of the self-developed high-temperature SPM equipment in March 2025 is expected to add significant value to next-generation semiconductor device manufacturing [2]. Financial Projections and Valuation - Revenue projections for 2025 are set at 6.984 billion yuan, with a growth rate of 24.33% [4]. - The company is projected to maintain a P/E ratio of 59x for 2025, decreasing to 38x by 2027 [3][4].

Core Insights - The company reported a significant increase in revenue and profit for the first half of 2025, driven by strong demand in the mainland China market and effective operational execution [2][3]. Financial Performance - Revenue for the first half of 2025 reached 3.27 billion yuan, a year-on-year increase of 35.83% [3]. - Total profit amounted to 820 million yuan, reflecting a 75.27% increase compared to the previous year [3]. - Net profit attributable to shareholders was 696 million yuan, up 56.99% year-on-year [3]. - The net profit after deducting non-recurring gains was 674 million yuan, representing a 55.17% increase [3]. - The company’s net cash flow from operating activities was -131 million yuan, a decline of 129.54% year-on-year, primarily due to increased employee compensation and slower accounts receivable collection [4]. Market Position and Product Performance - The company holds an 8% global market share in semiconductor cleaning equipment, ranking fourth worldwide [5]. - In the Chinese market, the company has over 30% market share in single-wafer cleaning equipment, ranking second among all suppliers [5]. - The company’s self-developed high-temperature SPM equipment successfully passed key customer validation, indicating its importance for next-generation semiconductor device manufacturing [5]. - The company also holds an 8.2% global market share in semiconductor plating equipment, ranking third globally [5].