Core Viewpoint - The company has demonstrated strong growth in its order backlog and is actively expanding its market presence in the semiconductor equipment industry, driven by technological advancements and product development [4][5]. Group 1: Order Backlog and Growth - As of September 29, 2025, the company's order backlog reached 9.072 billion yuan, representing a year-on-year increase of 34.10% [4]. - The semiconductor equipment demand in China has remained robust in 2025, allowing the company to deepen its existing market and explore new opportunities [4]. Group 2: Fundraising and Investment - The company announced a plan to issue A-shares to specific investors, aiming to raise 4.482 billion yuan through the issuance of 38.6013 million shares at a price of 116.11 yuan per share [4]. - The raised funds will primarily be allocated to three projects: the construction of R&D and process testing platforms, iterative R&D of high-end semiconductor equipment, and supplementing working capital [6]. Group 3: Product Development and Innovation - The company has placed significant emphasis on product R&D, with new products contributing to sustained order growth [5]. - In March 2025, the company successfully validated its self-developed single-wafer high-temperature SPM equipment with key customers, which is crucial for the manufacturing of next-generation semiconductor devices [5]. - The delivery of the 1500th electroplating chamber for ECP equipment in the first half of 2025 has achieved full coverage of electroplating technology across various applications [5].

点评： 公司重视产品研发，新产品的逐步放量带来公司订单持续增长。2025 年3 月，公司自主研发的单晶圆高 温 SPM 设备已成功通过关键客户验证，该工艺对下一代半导体器件制造具备重要价值。2025 年上半 年，公司ECP 设备第1500 电镀腔完成交付，实现电镀技术全领域覆盖（前道铜互连/后道晶圆级封 装/3D 堆叠/化合物半导体）。公司自主研发的面板级水平电镀设备荣获美国3D InCites 协会颁发 的"Technology Enablement Award"。新产品的不断完善，为公司长期快速增长打下基础。 公司募集资金主要用于研发项目及补充流动资金。公司募集资金主要投向三个项目：研发和工艺测试平 台建设项目、高端半导体设备迭代研发项目和补充流动资金。此次发行的发行对象认购的股份自发行结 束之日起六个月内不得上市交易。 盈利预测、估值与评级：公司产品不断迭代升级，新产品市场推广顺利，我们维持公司2025-2026 年归 母净利润预测分别为14.76、18.29 亿元，新增2027 年归母净利润预测为22.85 亿元，对应的PE 值为 59x、47x 和38x。公司是国内半导体清洗设备的领军企业，将持续受 ...

Investment Rating - The report maintains a "Buy" rating for the company [3][5]. Core Views - The company has seen a significant increase in its order backlog, reaching 9.072 billion yuan as of September 29, 2025, representing a year-on-year growth of 34.10% [1]. - The semiconductor equipment demand in China remains strong, and the company is leveraging its technological advantages and market recognition to expand its market presence [1]. - The company successfully raised 4.482 billion yuan through a private placement of shares, which will primarily be used for R&D projects and working capital [2]. Summary by Sections Company Orders and Financials - As of September 29, 2025, the company's order backlog is 9.072 billion yuan, a 34.10% increase year-on-year [1]. - The company reported a net profit forecast of 1.476 billion yuan for 2025, with projections of 1.829 billion yuan for 2026 and 2.285 billion yuan for 2027 [3]. Product Development and Market Position - The company emphasizes product R&D, with new products contributing to continuous order growth [2]. - The successful validation of the self-developed high-temperature SPM equipment in March 2025 is expected to add significant value to next-generation semiconductor device manufacturing [2]. Financial Projections and Valuation - Revenue projections for 2025 are set at 6.984 billion yuan, with a growth rate of 24.33% [4]. - The company is projected to maintain a P/E ratio of 59x for 2025, decreasing to 38x by 2027 [3][4].

Core Viewpoint - Semiconductor equipment company, Shengmei Shanghai, reported impressive performance in the first half of 2025, with significant revenue and profit growth driven by strong demand in the Chinese market and effective execution of its technology differentiation strategy [1][3][4]. Financial Performance - Shengmei Shanghai achieved operating revenue of 3.265 billion yuan, a year-on-year increase of 35.83% - The net profit attributable to shareholders reached 696 million yuan, up 56.99% year-on-year [1][3]. Market Demand and Strategy - The rapid growth in revenue and net profit is attributed to robust demand in the Chinese market, successful order accumulation, and efficient delivery and acceptance processes [3]. - The company has implemented a "product platformization" strategy, enhancing product technology and performance to meet diverse customer needs [3][4]. R&D Investment - In the first half of 2025, the company's R&D investment totaled 544 million yuan, a 39.47% increase year-on-year, representing 16.67% of operating revenue [5]. - The company has filed a total of 1,800 patents, with 494 granted, of which 489 are invention patents, indicating a strong focus on innovation [4][5]. Industry Position and Growth Potential - Shengmei Shanghai ranks fourth globally in semiconductor cleaning equipment with an 8.0% market share and third in semiconductor plating equipment with an 8.2% market share [7]. - The company is actively upgrading its products, including the Ultra C wb wet cleaning equipment, which utilizes patented nitrogen bubbling technology, enhancing its competitiveness in advanced chip manufacturing [7][8]. Future Outlook - The company anticipates full-year revenue for 2025 to be between 6.5 billion and 7.1 billion yuan, reflecting confidence in future growth based on industry trends and order forecasts [6]. - Shengmei Shanghai has developed a range of products, including cleaning, plating, and advanced packaging equipment, addressing a market potential of approximately 20 billion USD [9].

Group 1: Core Insights - The semiconductor industry is transitioning into the "post-Moore era," leading to a shift in technological innovation towards advanced packaging technologies, which are crucial for the development of AI, HPC, and 5G [1][7] - The demand for advanced packaging technologies, such as CoWoS, is surging due to the rapid penetration of domestic AI chips in large model training and terminal applications [1][5] Group 2: Advanced Packaging Technology Overview - Advanced packaging technology plays a critical role in semiconductor manufacturing, providing electrical interconnection, mechanical support, and thermal management [2] - The evolution of packaging technology has seen significant changes from through-hole mounting to surface mount technology, and now to advanced packaging techniques like BGA, CSP, and 2.5D/3D packaging [3][4] Group 3: Market Demand and Applications - Advanced packaging is increasingly applied in high-end fields such as AI, HPC, and 5G, with its market share in the overall packaging and testing market continuously rising [5] - The need for advanced packaging is particularly high in AI chips due to the demands for high performance and efficiency, driven by large model training and inference [6] Group 4: Domestic Equipment Development - The domestic semiconductor industry is making significant strides in the development of advanced packaging equipment, driven by the increasing adoption of technologies like CoWoS [8] - Companies like Huazhuo Precision and Pulaixin Intelligent are leading the way in developing high-end equipment for HBM chip manufacturing and CoWoS technology, respectively [9][11] Group 5: Future Prospects - The advanced packaging market is expected to experience explosive growth as the challenges in advanced process technology increase [7] - The advancements in domestic equipment and technology are likely to enhance the competitiveness of the domestic semiconductor industry in the global market [8][10]