Core Viewpoint - The company has demonstrated strong performance in the semiconductor equipment sector, achieving significant revenue and profit growth in the first half of 2025, driven by a focus on core business and technological differentiation [1][2]. Group 1: Financial Performance - In the first half of 2025, the company reported operating revenue of 3.265 billion yuan, a year-on-year increase of 35.83% [1]. - The net profit attributable to shareholders reached 696 million yuan, reflecting a year-on-year growth of 56.99% [1]. - The net profit excluding non-recurring gains and losses was 674 million yuan, up 55.17% year-on-year [1]. Group 2: Market Demand and Strategy - Strong domestic demand for semiconductor equipment has created significant market opportunities, allowing the company to capture a large number of orders [2]. - The company has successfully implemented a product platform strategy, optimizing technology and performance across a diverse product range, covering a market potential of approximately 20 billion USD [2]. - The company has established a presence in seven major product segments, including cleaning equipment and semiconductor plating equipment [2]. Group 3: Competitive Position - According to SEMI, global semiconductor manufacturing equipment sales are projected to grow by 7.4% in 2025, reaching a historical high of 125.5 billion USD [3]. - The company has become a competitive semiconductor equipment supplier, with a global market share of 8.0% in cleaning equipment, ranking fourth globally, and 8.2% in plating equipment, ranking third globally [3]. Group 4: Investor Confidence - The company has implemented a shareholder return plan, including cash dividends totaling approximately 288.25 million yuan, marking the third dividend distribution since its listing [4]. - As of August 4, 2025, the company completed a share buyback of 443,400 shares, representing 0.10% of total share capital, with a total expenditure of approximately 50.01 million yuan [5]. - The company aims to continue enhancing its product technology and expanding its customer base to sustain robust performance and return value to investors [5].

6 证券研究报告 点评报告 2025 年 8 月 7 日 晨会纪要 核[心Ta观bl点e_：Summary] 一、产业综合组： 美国总统特朗普表示，美国将对芯片和半导体征收约 100%的关税。虽然目前还没 有详细的规则披露，但是根据 2024 年中国对美国半导体出口总额约 30 亿美元，进 口约 22 亿美元分析，总体上半导体对美进出口金额占中国年度出口总额比例较小， 因此关税即使涉及中国芯片产业，对中国芯片产业的影响也不大。 盛美上海公布了 2025 年半年报，上半年营业收入 32.6 亿，同比增长 35.8%，毛利 率 50.7%，继续维持高位，实现归属母公司净利润 6.95 亿，同比增长 57%。二季度 公司收入 19.6 亿，同比增长 32%，净利润 4.5 亿，同比增长 23.8%，总体业绩继续 维持高增长。分项目看，公司在半导体清洗设备领域全球市场占有率达 8.0%，位 居全球第四，中国市场占有率超 30%，位列第二；在半导体电镀设备领域，公司全 球市场占有率达 8.2%，位列全球第三 。 由于公司电镀设备可供应半导体前道制 程和后道先进封装，而这些领域的国产设备竞争较弱，但需求前景较好，因此我们 ...

Core Viewpoint - The company reported significant growth in revenue and net profit for the first half of 2025, driven by strong market performance and continuous innovation in semiconductor equipment [1][2]. Financial Performance - The company achieved a revenue of 3.265 billion yuan, a year-on-year increase of 35.83% [1] - The net profit attributable to shareholders was 696 million yuan, reflecting a growth of 56.99% compared to the previous year [1] - The net profit excluding non-recurring items was 674 million yuan, up by 55.17% year-on-year [1] Product Development and Innovation - The company has focused on product platformization and enhancing technical performance, which contributed to its revenue growth [2] - In the semiconductor cleaning equipment sector, the company holds a global market share of 8.0% [3] - The company’s semiconductor plating equipment has a global market share of 8.2% [3] - The company invested 544 million yuan in R&D, a 39.47% increase year-on-year, and has filed a total of 1,800 patents, with 494 granted [3] Manufacturing and Operational Efficiency - The "Semiconductor Equipment R&D and Manufacturing Center" reached operational status in June 2025, enhancing production efficiency and capacity [4] - The center supports rapid business growth and timely order fulfillment [4] Industry Outlook - The company anticipates continued high demand in the semiconductor equipment market, supported by national policies and increased capital expenditure from major clients [5] - Global semiconductor equipment sales are projected to reach a record high of 117.1 billion USD in 2024, with a 10% year-on-year growth [5] - The domestic market is expected to grow by 35% to 49.6 billion USD, accounting for 42% of the global market [5] - The company has developed innovative cleaning technologies, including the SAPS/TEBO megasonic cleaning technology, positioning itself competitively in the market [5][6] New Product Launches - The company has introduced several new devices and processes with independent intellectual property rights, including the Ultra PmaxTM plasma-enhanced chemical vapor deposition equipment [6] - The company is also validating new ALD furnace tube technologies, further strengthening its competitive position in furnace equipment [7]

Investment Rating - The report initiates coverage with a "Buy" rating for the company, setting a target price of 136.08 CNY based on a 42x PE ratio for 2025 [2][5]. Core Insights - The company is a leading player in the domestic semiconductor cleaning and plating equipment market, with a strong focus on platformization and differentiation to drive growth [1][9]. - The company is expected to achieve revenue between 6.5 billion to 7.1 billion CNY in 2025, reflecting a year-on-year growth of approximately 16% to 26% [9]. - The semiconductor equipment industry is experiencing significant growth, with China's semiconductor equipment spending projected to reach 49.6 billion USD in 2024, a 35% increase year-on-year [9]. Financial Forecast and Investment Recommendations - The company is projected to have earnings per share of 3.24 CNY, 4.04 CNY, and 4.63 CNY for the years 2025, 2026, and 2027 respectively [2]. - Revenue forecasts for 2023 to 2027 show a consistent upward trend, with total revenue expected to grow from 3.888 billion CNY in 2023 to 9.156 billion CNY in 2027 [4]. - The company’s net profit is anticipated to increase from 911 million CNY in 2023 to 2.045 billion CNY in 2027, indicating a robust growth trajectory [4]. Company Overview - The company has established itself as a leader in the semiconductor equipment sector, with a comprehensive product range that includes cleaning, plating, and advanced packaging equipment [19][24]. - The company has a strong focus on R&D, with a significant increase in R&D expenditure from 141 million CNY in 2020 to 729 million CNY in 2024, supporting its innovation-driven strategy [33][49]. - The company has a well-defined strategic roadmap, transitioning from a single-product focus to a diversified platform strategy that includes six major product lines [23][48]. Market Position and Competitive Advantage - The company aims to capture 55% to 60% of the domestic semiconductor cleaning equipment market, leveraging its technological differentiation and strong R&D capabilities [10]. - The company has developed proprietary technologies such as SAPS and TEBO, which enhance its competitive edge in the cleaning equipment market [46][47]. - The company has established stable relationships with major semiconductor manufacturers, enhancing its market presence and customer base [36][37]. Growth Drivers - The ongoing shift towards high-end semiconductor equipment and the increasing domestic demand for advanced packaging solutions are key growth drivers for the company [9][10]. - The company’s platformization strategy is expected to open new revenue streams and enhance its market competitiveness across various semiconductor equipment segments [11][12]. - The anticipated growth in global semiconductor production capacity and the increasing trend of localization in semiconductor manufacturing will further benefit the company [9][19].

Group 1 - The core viewpoint of the articles highlights that Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. is moving forward with a private placement of A-shares to raise up to 4.482 billion yuan for R&D and operational needs, marking its first refinancing since its listing in November 2021 [1][2] - The company plans to allocate approximately 922 million yuan for R&D and process testing platform construction, 2.255 billion yuan for high-end semiconductor equipment iterative R&D, and 1.304 billion yuan for working capital [1] - Shengmei Shanghai has developed advanced semiconductor manufacturing equipment and is recognized for its leading position in the domestic market, particularly in wet cleaning equipment [2][3] Group 2 - The company has shown stable growth in its performance over the past three years, with projected revenues for 2025 expected to be between 6.5 billion yuan and 7.1 billion yuan, and an average gross margin anticipated to remain between 42% and 48% [2] - The semiconductor equipment industry is characterized by rapid technological upgrades and high R&D investment, necessitating the company to enhance its R&D efforts through the private placement to keep pace with international competitors [2][3] - The global semiconductor equipment market is expanding rapidly, driven by demand from AI and automotive electronics, prompting domestic companies, including Shengmei Shanghai, to adopt platform development strategies to enhance competitiveness and market share [3]

Fundraising Plan - The company plans to issue up to 44,129,118 shares to raise a total of no more than 448,200 million yuan, with the net proceeds allocated to R&D and process testing platform construction, high-end semiconductor equipment iterative R&D projects, and supplementing working capital [1][2] R&D and Process Testing Platform Construction - The project aims to establish an integrated circuit equipment R&D and process testing platform, enhancing the company's R&D testing capabilities and shortening product verification cycles, thereby improving efficiency and competitiveness [4][6][28] - The platform will utilize existing cleanroom environments and necessary testing instruments, including lithography machines and ion implanters, to support the R&D process from design to product finalization [4][5][6] High-End Semiconductor Equipment Iterative R&D Project - This project focuses on acquiring R&D hardware and software to enhance the company's capabilities in high-end semiconductor equipment, ensuring that key technologies possess differentiated global intellectual property rights [11][12][28] - The project is expected to accelerate the iterative development of cleaning equipment, high-end electroplating equipment, and advanced packaging wet process equipment, positioning the company among the top global semiconductor equipment suppliers [12][14][28] Working Capital Supplement - The company intends to use 130,418.07 million yuan of the raised funds to supplement working capital, addressing the increasing financial demands due to business expansion and ensuring sustainable development [23][26] Market Environment and Competitive Position - The semiconductor equipment market is experiencing significant growth, with China's market size reaching 366 billion USD in 2023, making it the largest globally [17][28] - The company has established a strong customer base and maintains stable relationships with leading semiconductor manufacturers, which supports its project initiatives [18][28] Technological and Talent Foundation - The company has a robust R&D foundation, with 931 R&D personnel, representing 46.50% of total employees, and a high level of educational qualifications among its staff [10][9][28] - The company has accumulated significant technological expertise, holding 470 patents, including 468 invention patents, which underpins its competitive edge in the semiconductor equipment sector [19][20][28]