Group 1 - The core viewpoint of the article highlights that the company is positioned to benefit significantly from the growing demand for advanced packaging equipment driven by global AI and HPC trends, with a complete equipment matrix covering key processes [1] - The company holds the largest global market share in TCB and has successfully upgraded and mass-produced HB equipment, indicating strong competitive positioning in the advanced packaging sector [1] - The company has seen a continuous increase in new orders for six consecutive quarters, driven by the resonance of AI server demand and domestic market recovery, suggesting a positive outlook for revenue growth [1] Group 2 - The company is expected to experience a significant increase in advanced packaging revenue and global market share due to structural expansion in the industry, particularly with the ramp-up of HBM production and ongoing equipment procurement cycles [1] - The improvement in profit margins is attributed to a higher proportion of high-margin products, structural enhancements in SMT, and cost optimization, indicating a turning point in profitability [1] - The geopolitical landscape and domestic substitution trends are expected to enhance the company's market share in China, as it is the only packaging equipment manufacturer capable of supplying ECD, benefiting from local supply chain policies [1] Group 3 - The company is projected to achieve revenue of HKD 141.14 billion, 165.73 billion, and 189.05 billion for the years 2025-2027, representing year-on-year growth rates of 6.69%, 17.42%, and 14.07% respectively [2] - The expected net profit for the same period is HKD 4.19 billion, 11.13 billion, and 17.15 billion, with corresponding PE ratios of 85, 32, and 21 times, indicating a clear growth trajectory [2] - The investment recommendation is to "overweight" the stock based on the company's long-term growth logic, order recovery, and profit structure improvement [2]

Core Viewpoint - ASMPT is experiencing accelerated recovery in its SMT business driven by the resonance of AI server demand and domestic market needs, entering a new upcycle alongside HBM capacity expansion [1][2][3] Group 1: Advanced Packaging Equipment - The global AI and HPC markets are driving rapid penetration of advanced packaging processes such as TCB and Hybrid Bonding, leading to a sustained increase in equipment demand [1] - The company has a comprehensive equipment matrix in advanced packaging, covering key processes including deposition, TCB, HB, Fan-out, and SiP, with the highest global market share in TCB [1] - With the initiation of HBM capacity expansion and the continuation of advanced logic equipment procurement cycles, the company is expected to gain significant incremental growth during the structural expansion of the industry [1] Group 2: Orders and Profitability - The company has seen a continuous year-on-year increase in new orders for six consecutive quarters, with AI server and domestic demand driving the accelerated recovery of SMT [2] - The improvement in the proportion of advanced packaging, structural enhancements in SMT, and cost optimization have led to a turning point in gross margin and profitability, with significant earnings elasticity expected from 2025 to 2027 [2] Group 3: Market Share and Geopolitical Factors - In the context of U.S. export controls and accelerated domestic substitution, capital expenditure among domestic packaging and testing firms remains high, benefiting the company as the only vendor capable of supplying ECD in packaging equipment [3] - The company is expected to continue benefiting from supply chain autonomy and domestic policy dividends due to its deep local network and leading customer resources [3] Group 4: Investment Outlook - The company is expected to benefit from long-term trends in advanced packaging, order recovery, and improvements in profitability structure, with clear growth logic [3] - Projected revenues for 2025, 2026, and 2027 are estimated at HKD 141.14 billion, 165.73 billion, and 189.05 billion, representing year-on-year growth of 6.69%, 17.42%, and 14.07% respectively, with corresponding net profits of HKD 4.19 billion, 11.13 billion, and 17.15 billion [3]

Summary of Key Points from the Semiconductor Industry Research Industry Overview - The research focuses on the global semiconductor industry, particularly the front-end Wafer Fab Equipment (WFE) and back-end advanced packaging supply chains, highlighting the challenges posed by globalization and geopolitics [2][6][32]. Core Companies Involved - Major players in the semiconductor industry include TSMC, UMC, Samsung Electronics, Intel, ASML, Applied Materials (AMAT), Lam Research, Tokyo Electron (TEL), KLA, ASE, Amkor, JCET, Disco, Besi, ASMPT, K&S, Semes, Hanmi, Hanwha, EVG, SUSS, Teradyne, SCREEN, Canon, Nikon, and Lasertec [19][49]. Key Trends and Insights 1. **Advanced Packaging Demand**: The demand for advanced packaging technologies such as 2.5D/3D packaging, Hybrid Bonding, and CoWoS is surging due to the rise of AI and high-performance computing (HPC) applications [2][8][10]. 2. **Moore's Law and Packaging**: As Moore's Law slows, advanced packaging has become the primary pathway for sustaining semiconductor performance gains, with technologies like CoWoS and SoIC leading the way [3][38][49]. 3. **Geopolitical Challenges**: Geopolitical pressures and government policies, such as the CHIPS Act, are reshaping the supply chain dynamics, pushing companies to diversify their manufacturing and service locations [7][44][60]. 4. **Localization Trends**: There is a significant trend towards localization in the semiconductor supply chain, with companies establishing production bases in North America, Europe, Japan, and Southeast Asia to mitigate risks [7][32][60]. 5. **Material Innovation**: The shift from equipment-centric to materials-centric innovation is becoming critical, with new materials like UV resins, advanced thermal interface materials, and low-Dk dielectrics emerging as strategic differentiators [15][47][49]. Market Dynamics - The WFE market is projected to grow from approximately USD 13.3 billion in 2024 to USD 16.5 billion by 2029, with a significant portion of revenue coming from equipment shipments [49][72]. - The back-end packaging market is also expanding, with the TCB equipment market estimated at around USD 936 million and HB equipment projected at USD 397 million by 2030 [53]. Challenges and Opportunities 1. **Cost and Pricing Pressures**: Equipment suppliers face challenges related to cost, pricing, and sustainability, which are becoming critical factors in maintaining competitiveness [8][29][49]. 2. **Technological Integration**: The ability to integrate differentiated materials and technologies will increasingly define competitiveness in the semiconductor industry [39][49]. 3. **Sustainability Goals**: Companies are embedding sustainability into their operational metrics, with ESG (Environmental, Social, and Governance) goals becoming essential for process efficiency and cost competitiveness [45][49][69]. Conclusion - The semiconductor industry is undergoing significant transformations driven by technological advancements, geopolitical factors, and evolving market demands. Companies that can effectively navigate these challenges while innovating in materials and processes are likely to secure a competitive edge in the future [49][72].