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外汇交易员· 2025-08-06 00:31
刚测试了下,OpenAI的GPT OSS 120B在Apple M3 Ultra 512G本地运行大概是43-45t/s,属于相当不错且可用的速度。并且让GPT-4.5出题来测试性能,GPT-4.5评估GPT OSS回答后,给出了相当不错的评价。 https://t.co/b6shhCm0mGSam Altman (@sama):gpt-oss is out!we made an open model that performs at the level of o4-mini and runs on a high-end laptop (WTF!!)(and a smaller one that runs on a phone).super proud of the team; big triumph of technology. ...
苹果最强芯片,深度剖析
半导体芯闻· 2025-05-27 10:21
2025年3月,苹果发布高端电脑Mac Studio。顶级型号配备了名为"M3 Ultra"的新处理器,并结合 了 512GB 的统一内存。苹果将于 2024 年 11 月发布搭载 M4 Pro 和 M4 Max 的 MacBook Pro 机型,而基于 M3 Max 打造的 M3 Ultra 则基于上一代处理器。 M3 Max 于 2023 年 11 月首次发布,并搭载于当时最高端的 MacBook Pro 中。 Techanalye 在 M4 Max 和 M3 Max 发布时就获得了这两款芯片,并且已经打开芯片、剥离布线层,并分析了芯 片内部结构的细节。 M3 Max 和 M4 Max 都没有接口(苹果称之为"Ultra Fusion")来并排连接 两块相同的硅片。苹果公布了M1 Max和M2 Max芯片的照片,其中M1 Ultra和M2 Ultra采用了并 排排列两片硅片的接口。然而,在 2023 年发布时,亮相的 M3 Max(互联网上有很多它的图片) 并没有 Ultra Fusion 这种用于将芯片连接在一起的接口。如上所述,我们获得的实际 M3 Max 硅 片也没有任何接口。我还想提一下 512G ...
苹果芯片,太多了!
半导体行业观察· 2025-03-18 01:36
Core Viewpoint - Apple is set to continue its strong product launches in 2025, with a focus on semiconductor technology as a backbone for its products, including the iPhone 16e and Mac Studio [1][3]. Group 1: Product Launches and Specifications - The iPhone 16e is scheduled for release on February 28, 2025, featuring Apple's proprietary modem chipsets [1]. - The Mac Studio will be launched on March 12, 2025, with options for "M3 Ultra" or "M4 Max" versions, supporting up to 512GB of unified memory [1]. - The new Mac mini, set to release on November 8, 2024, will utilize the 3nm technology-based M4 Pro chip, significantly reducing its size and weight compared to the previous generation [3][8]. Group 2: Chip Development and Integration - Apple is actively developing not only its digital processors but also peripheral chips (power ICs and interfaces) to enhance processor performance, creating a complete system in chipsets [2][3]. - The integration of power ICs with processors has been a focus since Apple's acquisition of Dialog Semiconductor's power IC business in 2018, allowing for improved power management and performance [6][7]. - The upcoming products will feature Thunderbolt 5 interfaces, which offer double the speed of Thunderbolt 4, showcasing Apple's commitment to in-house chip development [7][9]. Group 3: Design and Efficiency - The design of the new Mac mini's circuit board has been optimized, resulting in a smaller footprint while maintaining processor packaging size, thanks to advancements in semiconductor technology [8]. - Apple's M4 Pro and M4 Max chips will share a significant amount of silicon, indicating a strategy of standardizing design assets to enhance development efficiency [12][13]. - The company emphasizes the use of its proprietary silicon and control chips across its product range, ensuring consistent performance and functionality [10][11].
苹果新芯片,太猛了
半导体行业观察· 2025-03-06 01:28
"M3 Ultra 是我们具有扩展性的 SoC 架构的巅峰之作,专为需要运行超多线程与极高带宽应用的用 户而打造。"Apple 硬件技术高级副总裁 Johny Srouji 表示,"M3 Ultra 集成了 32 核中央处理器和 核心数量庞大的图形处理器、支持个人电脑内存容量新高的统一内存,提供雷雳 5 连接端口,且具 备业界领先的能效,堪称登峰造极。" | | CPU P/E- | GPU | | MEMORY | | --- | --- | --- | --- | --- | | | CORES | CORES | RAM OPTIONS | BANDWIDTH | | Apple M3 Ultra (low) | 20/8 | 60 | 96/256GB | 819.2GB/s | | Apple M3 Ultra (high) | 24/8 | 80 | 128GB/256GB/512GB | 819.2GB/s | | Apple M2 Ultra (high) | 16/8 | 76 | Up to 192GB | 819.2GB/s | | Apple M1 Ultra (high) | 16/ ...