N2工艺

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1.4nm,提前启动,台积电杀疯了
半导体行业观察· 2025-08-28 01:14
Core Viewpoint - TSMC is advancing its 1.4nm process technology with significant investments and plans for new facilities, positioning itself as a leader in the semiconductor industry [2][3][12]. Group 1: Investment and Expansion Plans - TSMC's new factory in Central Taiwan is set to begin construction in October, with an estimated total investment of between NT$1.2 trillion (approximately RMB 233.8 billion) and NT$1.5 trillion (approximately RMB 350.8 billion) [2]. - The new facility will include four buildings, with the first expected to complete risk trial production by the end of 2027 and commence mass production in the second half of 2028, potentially generating over NT$500 billion (approximately RMB 116.9 billion) in revenue [2][3]. - TSMC is also planning to build a 1nm advanced process base in Nansha Lun, with an estimated land area of 500 hectares, capable of accommodating up to 10 wafer fabs [3]. Group 2: Technological Advancements - TSMC's A14 process technology, based on second-generation nanosheet gate-all-around transistors, is expected to achieve up to 15% speed improvement at the same power level or a 30% reduction in power consumption at the same speed compared to the N2 process [5][7]. - The A14 technology will enhance logic density by over 20%, showcasing TSMC's commitment to maintaining technological leadership [5][7]. - TSMC plans to introduce the A14 technology in 2028, with potential future versions (A14P and A14X) expected to be released in 2029 [9][11]. Group 3: Competitive Landscape - TSMC's 2nm process is on track for mass production in Q4 2025, with significant demand from major clients such as Apple, AMD, Qualcomm, and Intel, indicating a strong market position [13][14]. - Despite competition from companies like Samsung and Japan's Rapidus, TSMC continues to advance its process technology without disruption, maintaining a leading edge in the semiconductor market [14][16]. - TSMC's production capabilities and customer diversity allow it to support the development and mass production of advanced technologies, further solidifying its market dominance [16].
英特尔18A,关键突破!
半导体芯闻· 2025-05-09 11:08
Core Viewpoint - Intel's 18A process technology has garnered significant interest from major tech companies, positioning it as a potential competitor to TSMC's N2 process, especially in the context of U.S. manufacturing and supply chain dynamics [1][2]. Group 1: Intel's 18A Process - The 18A process is being discussed with major clients like NVIDIA, Microsoft, and Google, indicating its potential as a viable alternative to TSMC's offerings [1]. - Intel's 18A process is touted as "the most advanced process made in America," showcasing its competitive edge over previous generations and its alignment with customer expectations [1]. - The 18A process is reported to have similar SRAM density and performance/efficiency metrics compared to TSMC's N2 process, suggesting a strong competitive position [1]. Group 2: Leadership and Strategic Shifts - The interest in the 18A process is partly attributed to the leadership changes at Intel, particularly the appointment of new CEO Pat Gelsinger, who is expected to shift focus towards semiconductor design automation, packaging, and foundry services [2]. - There is speculation that Intel may abandon its "IDM 2.0" strategy, which could lead to growth in its consumer business, particularly in CPU products [2]. - The current congestion in TSMC's production lines is driving other companies to seek alternatives, giving Intel a favorable position in the competition against TSMC's 2nm node [2].