Core Viewpoint - NVIDIA has revised its plans for the low-power DRAM (LPDDR) module SOCAMM, abandoning the SOCAM1 project in favor of SOCAM2, which is currently being tested with three memory manufacturers [1][2]. Group 1: SOCAMM Development - NVIDIA has started sample testing for SOCAMM2 with Samsung, SK Hynix, and Micron, shifting focus from SOCAM1 due to technical issues that prevented large-scale orders [1][2]. - SOCAMM aims to provide high-capacity memory at lower costs and power consumption compared to high bandwidth memory (HBM) [1]. Group 2: Technical Specifications - SOCAMM2 features the same 694 I/O ports as SOCAM1 but offers a data transfer speed of 9,600 MT/s, surpassing SOCAM1's 8,533 MT/s [2]. - The power consumption of SOCAMM is reported to be one-third lower than that of standard DRAM-based RDIMM server memory modules [2]. Group 3: Market Implications - The delay in SOCAMM1's launch has created opportunities for Samsung and SK Hynix, as they are now on equal footing with Micron in the development of SOCAMM2 [3]. - SOCAMM2 is expected to begin mass production in early next year, with increasing adoption anticipated as the demand for memory solutions to address data bottlenecks in AI computing rises [3].