如果您希望可以时常见面，欢迎标星收藏哦~ 三星电子即将于1月8日公布去年第四季度初步业绩，备受关注，人们的目光聚焦于其季度营业利 润能否首次突破20万亿韩元。随着大型科技公司加大对人工智能（AI）基础设施的投资，先进存 储半导体和通用存储半导体的需求都在同步增长。 据业内人士1月5日透露，三星电子去年第四季度有望实现史上最高的季度利润。根据金融信息公 司FnGuide的数据，三星电子去年第四季度的市场普遍预期（平均市场预测）显示，其营收为 89.217万亿韩元，营业利润为16.455万亿韩元，分别较上年同期增长17.7%和153.4%。 然而，证券公司近期提高了对三星电子的预期，预测其将实现史上最高的季度业绩。发布最新报告 的IBK证券预计，三星电子去年第四季度的营业利润将达到21.746万亿韩元。Daol投资证券也预 测三星电子的营业利润将突破20万亿韩元大关，达到20.4万亿韩元；现代汽车证券（19.543万亿 韩元）和NH投资证券（19.3万亿韩元）则预计其营业利润将达到19万亿韩元左右。这些预测均超 过了三星电子此前在2018年第三季度创下的季度最高营业利润纪录（17.570万亿韩元）。 三星电子性能 ...

Group 1 - The article highlights the increasing demand for low-power double data rate (LPDDR) memory, driven by the smartphone and AI server markets, leading companies like Samsung and SK Hynix to seek long-term agreements (LTA) for supply [1][2] - Oppo has recently proposed an LTA to Samsung and SK Hynix, requesting a guaranteed supply of LPDDR memory for at least four to six quarters, which is unusual as contracts are typically signed on a quarterly basis [1][2] - The memory shortage is affecting not only the Greater China smartphone industry but also major players like Samsung's MX division and Apple, who are struggling to fully mitigate the aggressive price increases from memory manufacturers [2][3] Group 2 - Memory manufacturers are planning to increase their share of high-value LPDDR server shipments starting in the first half of next year, as the demand for energy-efficient LPDDR rises with the AI industry's shift towards inference [2] - Samsung plans to begin shipping SOCAM2 products based on 1b (5th generation 10nm) DRAM in the first quarter of next year, while SK Hynix expects to start mass production of SOCAM2 products based on 1c (6th generation 10nm) DRAM in the second quarter [3] - The limited capacity of suppliers is expected to trigger a significant price increase for general DRAM in the first quarter of next year, as major smartphone manufacturers are actively procuring LPDDR [3]

Core Viewpoint - NVIDIA has revised its plans for the low-power DRAM (LPDDR) module SOCAMM, abandoning the SOCAM1 project in favor of SOCAM2, which is currently being tested with three memory manufacturers [1][2]. Group 1: SOCAMM Development - NVIDIA has started sample testing for SOCAMM2 with Samsung, SK Hynix, and Micron, shifting focus from SOCAM1 due to technical issues that prevented large-scale orders [1][2]. - SOCAMM aims to provide high-capacity memory at lower costs and power consumption compared to high bandwidth memory (HBM) [1]. Group 2: Technical Specifications - SOCAMM2 features the same 694 I/O ports as SOCAM1 but offers a data transfer speed of 9,600 MT/s, surpassing SOCAM1's 8,533 MT/s [2]. - The power consumption of SOCAMM is reported to be one-third lower than that of standard DRAM-based RDIMM server memory modules [2]. Group 3: Market Implications - The delay in SOCAMM1's launch has created opportunities for Samsung and SK Hynix, as they are now on equal footing with Micron in the development of SOCAMM2 [3]. - SOCAMM2 is expected to begin mass production in early next year, with increasing adoption anticipated as the demand for memory solutions to address data bottlenecks in AI computing rises [3].