Core Viewpoint - The company plans to acquire a 97.4988% stake in Shanghai Huali Microelectronics Co., Ltd. through a combination of issuing shares and cash payments to four transaction parties, including Huahong Group [1] Group 1 - The company will issue shares to no more than 35 qualified specific objects to raise matching funds for the acquisition [1] - The company's stock is set to resume trading on September 1, 2025 [1]

Core Viewpoint - Huahong Semiconductor Co., Ltd. is planning to acquire a 97.4988% stake in Shanghai Huahong Microelectronics Co., Ltd. from its controlling shareholder, Huahong Group, through a combination of issuing shares and cash payment, while also raising supporting funds from specific qualified investors [1][2] Group 1 - The acquisition is a fulfillment of Huahong Group's commitment made at the time of Huahong Semiconductor's IPO to inject Huahong Micro into the company within three years [1] - The total assets of the target company are estimated to be 7.58 billion yuan by the end of June 2025, which will enhance the total assets within the listed company [1] - This transaction is a key measure to address competition within the same industry and is expected to inject strong development momentum into Huahong Semiconductor [2] Group 2 - The integration of Huahong Micro's business, technology, and products is anticipated to optimize the company's industrial layout and improve its competitiveness [2] - The company aims to achieve deep integration in internal management, process platforms, custom design, and supply chains, leading to cost reduction and efficiency improvement [2] - The expected outcome of the transaction includes enhanced market share and profitability for Huahong Semiconductor [2]

Core Viewpoint - The company plans to acquire a 97.4988% stake in Huahong Microelectronics Co., Ltd. from four shareholders through a combination of issuing shares and cash payment, while also raising supporting funds [1] Group 1: Transaction Details - The acquisition involves shareholders from Shanghai Huahong (Group) Co., Ltd., Shanghai Integrated Circuit Industry Investment Fund Co., Ltd., National Integrated Circuit Industry Investment Fund Phase II Co., Ltd., and Shanghai Guotou Xian Dao Integrated Circuit Private Investment Fund Partnership (Limited Partnership) [1] - The company's stock is set to resume trading on September 1, 2025, following the completion of the transaction [1] Group 2: Approval and Uncertainty - The transaction is subject to approval by the company's shareholders and requires authorization, review, and registration from relevant regulatory authorities, indicating significant uncertainty surrounding the deal [1]

Group 1 - The company plans to acquire 97.4988% equity of Shanghai Huali Microelectronics Co., Ltd. for a total consideration that includes issuing shares at a price of RMB 43.34 per share, which represents a discount of approximately 44.79% compared to the last trading price of RMB 78.50 per share [1][2] - Following the acquisition, the company will directly and indirectly hold 100% of the target company's equity, as its wholly-owned subsidiary already holds approximately 2.5012% of the target's shares [1] - The company intends to conduct a non-public issuance of RMB shares to raise funds not exceeding 100% of the total consideration for the acquisition, with the number of shares issued not exceeding 30% of the company's total issued share capital at the time of completion [1] Group 2 - The target company primarily engages in 12-inch integrated circuit wafer foundry services in China, focusing on developing logic processes and providing comprehensive technical solutions for clients in communications and consumer electronics [2] - The acquisition is expected to enhance the company's 12-inch wafer foundry capacity, leveraging complementary advantages in process platforms to develop a broader range of foundry and supporting services [2] - The funds raised from the non-public issuance are intended for operational funding, debt repayment, cash consideration payment, and project funding for the target company, which will improve the overall financial condition of the group and promote future development [2]

Group 1 - The company plans to acquire 97.4988% equity of Shanghai Huali Microelectronics Co., Ltd. from several investors for a total consideration that includes issuing shares at a price of RMB 43.34 per share, which represents a discount of approximately 44.79% compared to the last trading price of RMB 78.50 per share [1][2] - Following the acquisition, the company expects to enhance its 12-inch wafer foundry capacity, leveraging complementary advantages in process platforms with the target company to provide comprehensive foundry services across various applications and technical specifications [2] - The proposed private placement of shares aims to raise funds not exceeding 100% of the total consideration for the acquisition, with the number of shares issued not exceeding 30% of the company's total issued share capital at the time of completion [1][2] Group 2 - The target company primarily engages in 12-inch integrated circuit wafer foundry services in China, focusing on developing logic processes and providing technical solutions for clients in communications and consumer electronics [2] - The acquisition is expected to generate synergies that will lower costs, increase market share, and achieve economies of scale through integrated management, process platforms, R&D resources, customized design, and supply chain collaboration [2] - The company has received a commitment from Huahong Group to inject the target company into the firm within three years post-listing, aligning with national strategic deployment and market expectations [2]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 唐均君先生 中國上海，二零二五年八月三十一日 於本公告日期，本公司董事分別為： 執行董事： 海外監管公告 本公告乃根據《香港聯合交易所有限公司證券上市規則》第13.10B條而作出。 茲載列華虹半導體有限公司（「本公司」）於上海證券交易所網站刊發的以下文件， 僅供參閱： 1. 《董事會決議公告》 2. 《關於籌劃發行股份及支付現金購買資產並募集配套資金暨關聯交易事項的停 牌前一個交易日前十大股東和前十大流通股股東持股情況的公告》 3. 《關於暫不召開股東大會審議本次發行股份及支付現金購買資產並募集配套資 金暨關聯交易事項的公告》 4. 《董事會關於公司不存在《上市公司證券發行註冊管理辦法》第十一條規定的 不得向特定對象發行股票的情形的說明》 5. 《董事會關於本次交易相 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 海外監管公告 本公告乃根據《香港聯合交易所有限公司證券上市規則》第13.10B條而作出。 茲載列華虹半導體有限公司（「本公司」）於上海證券交易所網站刊發的《華虹半 導體有限公司關於披露重組預案的一般風險提示暨公司股票復牌的公告》，僅供 參閱。 承董事會命 華虹半導體有限公司 董事會主席兼執行董事 唐均君先生 中國上海，二零二五年八月三十一日 於本公告日期，本公司董事分別為： 執行董事： 唐均君 （董事會主席） 白鵬 （總裁） 非執行董事： 葉峻 孫國棟 陳博 熊承艷 证券代码：688347 证券简称：华虹公司 公告编号：2025-025 港股代码：01347 港股简称：华虹半导体 华虹半导体有限公司 关于披露重组预案的一般风险提示暨公司股票复牌的 公告 本公司董事会及 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 海外監管公告 本公告乃根據《香港聯合交易所有限公司證券上市規則》第13.10B條而作出。 茲載列華虹半導體有限公司（「本公司」）於上海證券交易所網站刊發的《華虹半 導體有限公司發行股份及支付現金購買資產並募集配套資金暨關聯交易預案（摘 要）》，僅供參閱。 承董事會命 華虹半導體有限公司 董事會主席兼執行董事 唐均君先生 中國上海，二零二五年八月三十一日 於本公告日期，本公司董事分別為： 執行董事： 唐均君 （董事會主席） 白鵬 （總裁） 非執行董事： 葉峻 孫國棟 陳博 熊承艷 獨立非執行董事： 張祖同 王桂壎太平紳士 封松林 股票代码：688347 股票简称：华虹公司 上市地点：上海证券交易所 股票代码：1347 股票简称：华虹半导体 上市地点：香港联合交易所 华虹 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 （於香港註冊成立之有限公司） （股份代號：01347） 海外監管公告 本公告乃根據《香港聯合交易所有限公司證券上市規則》第13.10B條而作出。 茲載列華虹半導體有限公司（「本公司」）於上海證券交易所網站刊發的《華虹半導 體有限公司發行股份及支付現金購買資產並募集配套資金暨關聯交易預案》，僅供 參閱。 承董事會命 華虹半導體有限公司 董事會主席兼執行董事 唐均君先生 中國上海，二零二五年八月三十一日 於本公告日期，本公司董事分別為： 執行董事： 唐均君 （董事會主席） 白鵬 （總裁） 非執行董事： 葉峻 孫國棟 陳博 熊承艷 獨立非執行董事： 張祖同 王桂壎太平紳士 封松林 股票代码：688347 股票简称：华虹公司 上市地点：上海证券交易所 股票代码：1347 股票简称：华虹半导体 上市地点：香港联合交易所 华虹半导体有 ...

香港交易及結算所有限公司及香港聯合交易所有限公司對本公告的內容概不負責，對其準確性 或完整性亦不發表任何聲明，並明確表示，概不對因本公告全部或任何部份內容而產生或因倚 賴該等內容而引致的任何損失承擔任何責任。 本公告僅供參考，並不構成收購、購買或認購本公司任何證券的邀請或要約。 （於香港註冊成立的有限公司） （股份代號：01347） (1) 主要及關連交易－涉及 根據特別授權發行代價股份的收購標的公司股本； HUA HONG SEMICONDUCTOR LIMITED 華虹半導體有限公司 (2) 申請清洗豁免； (3)建議非公開發行人民幣股份以募集配套資金； 及 (4) 人民幣股份恢復買賣 主要及關連交易－涉及根據特別授權發行代價股份的收購標的公司股本 董事會欣然宣佈，於二零二五年八月二十九日，本公司與賣方訂立收購協議， 據此，本公司有條件同意購買而賣方有條件同意出售標的公司總計97.4988%的 股本，代價為(i)部分以每股人民幣股份人民幣43.34元的價格配發及發行代價股 份及(ii)部分由本公司向賣方支付現金代價。建議收購事項的最終代價將由訂約 方經公平磋商後，參考將由中國合資格資產評估機構編製的標的資 ...