致：香港交易及結算所有限公司 股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2026年1月31日 狀態: 新提交 公司名稱: 盈利時控股有限公司 FF301 II. 已發行股份及/或庫存股份變動及足夠公眾持股量的確認 1. 股份分類 普通股 股份類別 不適用 於香港聯交所上市 (註1) 是 證券代號 (如上市) 06838 說明 普通股 已發行股份（不包括庫存股份）數目 庫存股份數目 已發行股份總數 上月底結存 600,000,000 0 600,000,000 增加 / 減少 (-) 本月底結存 600,000,000 0 600,000,000 足夠公眾持股量的確認(註4) 呈交日期: 2026年2月4日 I. 法定/註冊股本變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | | 於香港聯交所上市 (註1) | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 06838 | 說明 | 普通股 | | | | | | | ...

香港交易及結算所有限公司與香港聯合交易所有限公司對本公告的內容槪不負責， 對其準確性或完整性亦不發表任何聲明，並明確表示槪不就因本公告全部或任何部 份內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 WINOX HOLDINGS LIMITED 盈 利 時 控 股 有 限 公 司 （於開曼群島註冊成立的有限公司） （股份代號：6838） 與截至二零一二年十二月三十一日、 二零一三年十二月三十一日及二零一四年十二月三十一日 止年度的年報有關的補充公告 1 茲提述盈利時控股有限公司（「本公司」）分別截至二零一二年十二月 三十一日（「二零一二年度」）、二零一三年十二月三十一日（「二零 一三年度」）及二零一四年十二月三十一日（「二零一四年度」）止年 度的年報（「該等年報」）。除文義另有指明外，本公告所用詞彙與該 等年報所界定者具有相同涵義。 據董事作出一切合理查詢後所知、所悉及所信， 李先生於 二零一二年 度、二零一三年度及二零一四年度以行政總裁身份獲得的薪酬如下： | | | 薪金及 | | 退休福利 | | | --- | --- | --- | --- | --- | --- | | | 袍金 | 其他 ...

盈利时(06838)发布公告，本集团截至2025年11月30日止11个月取得亏损约5400万港元(2024年全年：亏 损为2032.9万港元)。该亏损主要归因于收入因需求疲弱较去年同期减少约20%;整体毛利率因市场竞争 激烈而下跌;及根据精简人力计划支付的离职补偿约1200万港元。 ...

格隆汇1月8日丨盈利时(06838.HK)公布，集团截至2025年11月30日止11个月录得亏损约5400万港元 (2024年全年：亏损为2032.9万港元)。该亏损主要归因于(1)收入因需求疲弱较去年同期减少约20%；(2) 整体毛利率因市场竞争激烈而下跌；及(3)根据精简人力计划支付的离职补偿约12,000,000港元。 ...

智通财经APP讯，盈利时(06838)发布公告，本集团截至2025年11月30日止11个月取得亏损约5400万港元 (2024年全年：亏损为2032.9万港元)。该亏损主要归因于收入因需求疲弱较去年同期减少约20%;整体毛 利率因市场竞争激烈而下跌;及根据精简人力计划支付的离职补偿约1200万港元。 ...

香港交易及結算所有限公司與香港聯合交易所有限公司對本公告的內容槪不負責， 對其準確性或完整性亦不發表任何聲明，並明確表示槪不就因本公告全部或任何部 份內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 WINOX HOLDINGS LIMITED 盈 利 時 控 股 有 限 公 司 本公告所載之資料僅根據董事會於本公告日期所獲取的資料而作出的初 部評估，有關資料或數字尚未經本公司之核數師審閱。 （於開曼群島註冊成立的有限公司） （股份代號：6838） 盈利警告 本公告乃由本公司根據上巿規則第 13.09(2)(a)條及證券及期貨條例 第 XIVA 部之內幕消息條文（定義見上市規則）而作出。 董事會謹此通知本公司股東及有意投資者，本集團截至二零二五年十 一月三十日止十一個月錄得虧損約 54,000,000 港元。本公告所載之 資料僅根據董事會於本公告日期所獲取的資料而作出的初部評估，有 關資料或數字尚未經本公司之核數師審閱。 本公司股東及有意投資者於買賣本公司的證券時務須審慎行事。 本公告乃由盈利時控股有限公司（「本公司」，連同其附屬公司統稱為 「本集團」）根據香港聯合交易所有限公司證券上市規則（「 上市 ...

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2025年12月31日 狀態: 新提交 致：香港交易及結算所有限公司 公司名稱: 盈利時控股有限公司 呈交日期: 2026年1月2日 I. 法定/註冊股本變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | | 於香港聯交所上市 (註1) | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 06838 | 說明 | 普通股 | | | | | | | | | | 法定/註冊股份數目 | | | 面值 | | | 法定/註冊股本 | | | 上月底結存 | | | 4,000,000,000 | HKD | | 0.1 | HKD | | 400,000,000 | | 增加 / 減少 (-) | | | | | | | HKD | | | | 本月底結存 | | | 4,000,000,000 | HKD | | 0.1 | HKD | | 400,000,000 | 本月底法定/ ...

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2025年11月30日 狀態: 新提交 致：香港交易及結算所有限公司 公司名稱: 盈利時控股有限公司 呈交日期: 2025年12月1日 I. 法定/註冊股本變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | | 於香港聯交所上市 (註1) | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 06838 | 說明 | 普通股 | | | | | | | | | | 法定/註冊股份數目 | | | 面值 | | | 法定/註冊股本 | | | 上月底結存 | | | 4,000,000,000 | HKD | | 0.1 | HKD | | 400,000,000 | | 增加 / 減少 (-) | | | | | | | HKD | | | | 本月底結存 | | | 4,000,000,000 | HKD | | 0.1 | HKD | | 400,000,000 | 本月底法定 ...

Core Viewpoint - The semiconductor market is experiencing robust growth driven by emerging technologies such as AI, 5G, IoT, and automotive electronics, leading to a strong demand for high-performance, low-power chips [1] Industry Overview - The global semiconductor packaging and testing market is projected to grow from 649.4 billion RMB in 2024 to 933 billion RMB by 2029, with a compound annual growth rate (CAGR) of 7.5% [1] - The trend of vertical specialization is deepening within the industry, with more companies adopting a fabless model to focus on complex chip design while outsourcing manufacturing and testing [1] Company Profile - Jiangsu Xinde Semiconductor Technology Co., Ltd. (Xinde Semiconductor) was established in September 2020 and has accumulated significant experience in packaging technology, covering advanced packaging capabilities such as QFN, BGA, LGA, WLP, and 2.5D/3D [2] - Xinde Semiconductor has received recognition from several well-known clients, contributing to its revenue growth, although its profitability remains a concern as it seeks to enter the capital market [2] Financial Performance - Xinde Semiconductor's revenue has shown rapid growth, with figures of 269 million RMB in 2022, 509 million RMB in 2023, and a projected 827 million RMB in 2024, reflecting a strong upward trend [3] - For the first half of this year, the company reported revenue of 475 million RMB, a year-on-year increase of 20% [3] - The majority of Xinde Semiconductor's revenue comes from packaging products and testing services, which accounted for over 99% during the reporting period [4] Revenue Breakdown - The revenue from QFN and BGA products has consistently been the largest, with their respective shares being 31.1% and 31.8% in the first half of 2025 [4] - The company has seen an increase in revenue from LGA and WLP products, with their shares rising from 17.9% and 10.6% in 2022 to 20.1% and 17% in the first half of 2025 [4] Market Position - Xinde Semiconductor ranks seventh in the Chinese general-purpose semiconductor OSAT market, with a market share of approximately 0.6% as of 2024 [8] - The company is one of the few providers in China that has integrated all advanced packaging technologies, positioning itself for growth despite being a newer entrant in the market [3][8] Strategic Initiatives - Xinde Semiconductor plans to strategically expand into overseas markets, targeting regions such as Taiwan, South Korea, Japan, Southeast Asia, the United States, and Germany to establish a solid business foundation [10] - The company aims to enhance its competitive edge through a comprehensive R&D strategy focused on high-performance packaging solutions and innovative technologies [9]

Core Viewpoint - The semiconductor market is experiencing robust growth driven by emerging technologies such as AI, 5G, IoT, and automotive electronics, leading to a strong demand for high-performance, low-power chips [1] Industry Overview - The global semiconductor packaging and testing market is projected to grow from 649.4 billion RMB in 2024 to 933.0 billion RMB by 2029, with a compound annual growth rate (CAGR) of 7.5% [1] - The trend towards vertical specialization in the semiconductor industry is deepening, with more companies adopting a fabless model to focus on complex chip design while outsourcing manufacturing and testing [1] Company Profile - Jiangsu Xinde Semiconductor Technology Co., Ltd. (referred to as "Xinde Semiconductor") was established in September 2020 and has accumulated extensive experience in packaging technology, covering advanced packaging capabilities such as QFN, BGA, LGA, WLP, and 2.5D/3D [2] - Xinde Semiconductor has received recognition from several well-known clients, contributing to its revenue growth [2] Financial Performance - Xinde Semiconductor's revenue has shown rapid growth, with figures of 269 million RMB in 2022, 509 million RMB in 2023, and a projected 827 million RMB in 2024, reflecting a strong upward trend [3] - For the first half of this year, the company's revenue reached 475 million RMB, a year-on-year increase of 20% [3] Revenue Structure - Over 99% of Xinde Semiconductor's revenue comes from packaging products and testing services, with QFN and BGA products being the primary revenue contributors [4] - The revenue share from LGA and WLP products has been increasing, with their respective contributions rising from 17.9% and 10.6% in 2022 to 18.2% and 18.5% in 2024 [4] Market Position - Xinde Semiconductor ranks seventh in the Chinese general-purpose semiconductor OSAT market, holding a market share of approximately 0.6% as of 2024 [8] - The company is the newest player among the top eight competitors in this field, which collectively dominate over 50% of the market share [8] R&D Strategy - The company focuses on R&D as a key strategy to enhance its competitive edge, covering high-performance 2.5D/3D packaging solutions, high-precision optical sensing solutions, automotive-grade packaging technology, innovative glass substrate technology, and iterative development of existing technologies [9] Market Expansion Plans - Xinde Semiconductor plans to strategically expand into overseas markets, targeting regions such as Taiwan, South Korea, Japan, Southeast Asia, the United States, and Germany to establish a solid business foundation [10] - The upcoming listing on the Hong Kong Stock Exchange is expected to attract more attention to Xinde Semiconductor, presenting both opportunities and challenges for the company [10]