证券代码：603005 证券简称：晶方科技 公告编号：临 2023-052 苏州晶方半导体科技股份有限公司 第五届董事会第三次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 一、董事会会议召开情况 苏州晶方半导体科技股份有限公司（以下简称"公司"）第五届董事会第三 次会议于 2023 年 10 月 23 日以通讯和邮件方式发出通知，于 2023 年 10 月 30 日在公司会议室召开。会议应到董事 7 人，实际出席 7 人。会议的召集和召开符 合《公司法》和《公司章程》。 二、董事会会议审议情况 本次会议审议表决，通过了相关议案，形成决议如下： （一）会议审议通过了《关于公司 2023 年三季度报告的议案》 表决结果：同意 7 票，反对 0 票，弃权 0 票。 《晶方科技 2023 年三季度报告》 详 见 上 海 证 券 交 易 所 网 站 ： http://www.sse.com.cn。 （二）会议审议通过了《关于选举公司第五届董事会专业委员会的议案》 董事何鲲先生因工作调整变动原因提请辞去董事及董事会专 ...

地址：上海市长宁区仙霞路 99 号尚嘉中心 12、22 层 （200051） Add: 12/22,L'Avenue No.99 XianXia Rd,Changning District,Shanghai,PRC 电话 Tel: +86 21 23563298 传真Fax: +86 21 23563299 网址 Website：http://www.guantao.com 邮箱 Email: guantaosh@guantao.com 北京观韬中茂（上海）律师事务所 关于 观韬中茂 （上海）律师事务所 G UA NT AO L AW F IR M 苏州晶方半导体科技股份有限公司 2023 年第二次临时股东大会 的 法律意见书 北京 上海 广州 深圳 香港 天津 杭州 苏州 成都 厦门 大连 济南 西安 武汉 南京 福州 郑州 海口 重庆 合肥 悉尼 多伦多 Beijing︱Shanghai︱Guangzhou︱Shenzhen︱Hong Kong︱Tianjin︱Hangzhou︱Suzhou︱Chengdu︱Xiamen︱Dalian︱Jinan︱Xi'an︱Wuhan︱Nanjing︱Fuzhou︱Zh ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2023-051 苏州晶方半导体科技股份有限公司 2023 年第二次临时股东大会决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 本次会议是否有否决议案：无 重要内容提示： 一、 会议召开和出席情况 | 1、出席会议的股东和代理人人数 | 11 | | --- | --- | | 2、出席会议的股东所持有表决权的股份总数（股） | 134,847,071 | | 3、出席会议的股东所持有表决权股份数占公司有表决权股 | | | 份总数的比例（%） | 20.6625 | (四) 表决方式是否符合《公司法》及《公司章程》的规定，大会主持情况等。 本次会议由公司董事会召集，采用现场投票与网络投票相结合的方式，符合 《公司法》、《上海证券交易所股票上市规则》、《上市公司股东大会规则》及《公 司章程》的规定。本次会议由董事长兼总经理王蔚先生主持。 (一) 股东大会召开的时间：2023 年 10 月 11 日 (二) 股东大会召开的地点：江苏省苏州工业园区长阳街 133 ...

证券代码：603005 证券简称：晶方科技 公告编号：临2023-050 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 苏州晶方半导体科技股份有限公司（以下简称"公司"）于2023年9月25日 上 午 11:00-12:00 通 过 上 海 证 券 交 易 所 上 证 路 演 中 心 （ 网 址 ： http://roadshow.sseinfo.com/）以网络文字互动的方式召开了2023年半年度业绩说 明会，针对公司2023年半年度经营成果、财务指标、发展战略等具体情况与投资 者进行互动交流和沟通，在遵循信息披露规则的前提下，就投资者普遍关注的问 题进行了回答交流。现将有关事项公告如下： 一、本次说明会召开情况 2023年9月16日，公司在《中国证券报》、《上海证券报》、《证券时报》 和上海证券交易所网站（www.sse.com.cn）披露了公司《关于召开2023年半年度 业绩说明会的公告》（公告编号：临2023-044），并向广大投资者征集大家所关 心的问题。 公司于2023年9月25日上午11:00-12:00 ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2023-044 苏州晶方半导体科技股份有限公司 重要内容提示： https://roadshow.sseinfo.com/） 会议召开方式：上证路演中心网络互动 关于召开 2023 年半年度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 投资者可于 2023 年 09 月 18 日(星期一) 至 09 月 22 日(星期五)16:00 前 登录上证路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 info@wlcsp.com 进行提问。公司将在说明会上对投资者普遍关注的问题进行回 答。 苏州晶方半导体科技股份有限公司（以下简称"公司"）已于 2023 年 8 月 26 日发布公司 2023 年半年度报告，为便于广大投资者更全面深入地了解公司 2023 年半度经营成果、财务状况，公司计划于 2023 年 09 月 25 日 上午 11:00-12:00 举行 2023 年半年度业绩说明会，就投资者关心的问题进行交流。 一、 说明会类型 本次投资者说 ...

证券代码：603005 证券简称：晶方科技 公告编号：临 2023-043 苏州晶方半导体科技股份有限公司 股权激励限制性股票回购注销实施公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： | 回购股份数量 | 注销股份数量 | 注销日期 | | --- | --- | --- | | 597,120 | 597,120 | 2023年9月7日 | 一、本次限制性股票回购注销的决策与信息披露 苏州晶方半导体科技股份有限公司（以下简称"公司"）于 2022 年 8 月 26 日召开了第五届董事会第一次临时会议及第五届监事会第一次临时会议，审议通 过了《关于回购注销部分激励对象已获授但尚未解锁的限制性股票的议案》。公 司于 2022 年 9 月 14 日召开了 2022 年第二次临时股东大会，审议通过了《关于 回购注销部分激励对象已获授但尚未解锁的限制性股票的议案》，同意对已离职 的激励对象持有的已获授但尚未解锁的合计 96,000 股限制性股票进行回购注销。 详细内容请见公司于2022年8月27日在上海证 ...

Financial Performance - The net profit for the first half of 2023 was -4,350,861.55 RMB for the controlling company, indicating a significant loss compared to previous periods[13]. - The net profit for the first half of 2023 was CNY 70,230,848.16, a decrease from CNY 185,172,115.84 in the same period of 2022, representing a decline of approximately 62%[71]. - Total operating income for the first half of 2023 was CNY 84,423,125.20, compared to CNY 209,009,933.49 in the previous year, indicating a decrease of about 60%[71]. - The company reported a net loss attributable to owners of CNY 92,262.00, indicating challenges in profitability[80]. - Net profit for the first half of 2023 was CNY 79,682,852.66, a decline of 58.9% compared to CNY 193,773,651.81 in the first half of 2022[93]. - The company's total assets as of June 30, 2023, amounted to CNY 4,726,219,509.32, an increase from CNY 4,484,199,713.25 at the end of 2022[91]. - The total comprehensive income for the first half of 2023 was CNY 69,515,173.68, down from CNY 178,799,676.44 in the same period last year, representing a decrease of approximately 61%[71]. - Total operating revenue for the first half of 2023 was CNY 481,761,633.82, a decrease of 22.3% compared to CNY 620,367,260.44 in the same period of 2022[91]. - Total comprehensive income for the period was CNY 84,335,657.80, compared to CNY 185,248,304.42 in the previous year, reflecting a decline of about 54%[98]. Assets and Liabilities - The total assets as of June 30, 2023, amounted to 437,287,438.17 RMB for the controlling company, with net assets of 437,287,438.17 RMB[13]. - Total assets increased to $4,836,170,590.96 from $4,587,328,386.14, representing a growth of approximately 5.4%[60]. - Current liabilities rose to $619,789,583.19, up from $426,245,082.53, reflecting an increase of approximately 45.5%[60]. - Total liabilities increased to $752,226,792.52 from $566,772,177.87, marking a growth of around 32.8%[61]. - The total liabilities of the company have been managed effectively, with a focus on reducing debt levels in the upcoming quarters[83]. - The company's total liabilities reached CNY 644,592,679.58, up from CNY 472,542,695.19 at the end of 2022[91]. Cash Flow - Cash flow from operating activities was CNY 130,300,545.84, down from CNY 173,203,599.02 in the first half of 2022, reflecting a decline of approximately 25%[73]. - The company reported a decrease in cash inflow from operating activities, totaling CNY 310,109,190.19, compared to CNY 530,024,543.78 in the previous year, indicating a decline of about 41%[76]. - The company experienced a significant cash outflow in investment activities, with a net cash flow of -CNY 1,448,639,956.87, compared to -CNY 386,703,889.83 in the previous year[76]. - Cash and cash equivalents at the end of the period were CNY 466,432,177.68, a decrease from CNY 1,524,161,314.02 at the end of the first half of 2022[77]. - Net cash flow from investing activities was negative CNY 1,491,594,817.20, compared to negative CNY 404,606,559.68 in the prior year, indicating a worsening cash outflow situation[98]. Research and Development - The company reported a decrease in R&D expenses due to the progress of research projects, reflecting a strategic focus on cost management[6]. - Research and development expenses for the first half of 2023 were CNY 55,444,608.29, a decrease of 37.1% from CNY 88,168,850.76 in the first half of 2022[91]. - Research and development expenses amounted to CNY 40,411,300.60, a significant reduction from CNY 72,374,504.49, representing a decrease of about 44%[98]. Strategic Initiatives - The company established a subsidiary in Singapore to enhance its international business strategy and better meet overseas customer demands[5]. - The company is actively pursuing international mergers and acquisitions to strengthen its product technology development and supply chain layout[5]. - The company plans to focus on improving operational efficiency and exploring new market opportunities to enhance future performance[78]. - The company plans to expand its market presence and is focusing on new product development to drive future growth[83]. - The company is exploring potential mergers and acquisitions to enhance its competitive position in the market[83]. Shareholder Information - The total number of ordinary shareholders at the end of the reporting period was 1,709,996, reflecting a stable shareholder base[84]. - The total equity attributable to shareholders of the parent company was CNY 3,851,776,182.04, a decrease from CNY 3,945,235,140.81, reflecting a decline of approximately 2.4%[98]. - The total equity of the company as of June 30, 2023, was CNY 4,081,626,829.74, slightly up from CNY 4,011,657,018.06 at the end of 2022[91].

证券代码：603005 证券简称：晶方科技 公告编号：临 2023-036 苏州晶方半导体科技股份有限公司 关于召开 2022 年度业绩暨现金分红说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担个别及连带责任。 重要内容提示： 本次投资者说明会以网络互动形式召开，公司将针对 2022 年度 的经营成果及财务指标的具体情况与投资者进行互动交流和沟通，在 信息披露允许的范围内就投资者普遍关注的问题进行回答。 二、 说明会召开的时间、地点 （一） 会议召开时间：2023 年 05 月 31 日 上午 11:00-12:00 （二） 会议召开地点：上证路演中心 （三） 会议召开方式：上证路演中心网络互动 http://roadshow.sseinfo.com/） 会议召开方式：上证路演中心网络互动 投资者可于 2023 年 05 月 24 日(星期三) 至 05 月 30 日(星期 二)16:00 前登录上证路演中心网站首页点击"提问预征集"栏目或 通过公司邮箱 info@wlcsp.com 进行提问。公司将在说明会上对投资 者普遍 ...

Financial Performance - Total revenue for 2022 was CNY 1,106,070,998.70, a decrease of 21.6% from CNY 1,411,173,857.40 in 2021[12] - The net profit for the current period is 232,774,115.21 RMB, a decrease from 578,721,724.29 RMB in the previous period, representing a decline of approximately 59.8%[13] - The company reported a total comprehensive income of 214,322,264.42 RMB, compared to 550,367,121.83 RMB in the previous year, a decline of about 61.0%[16] - The net profit attributable to shareholders was approximately ¥227.85 million, down 60.45% from ¥576.05 million in the previous year[73] - The basic earnings per share decreased to ¥0.35, a decline of 60.23% from ¥0.88 in 2021[75] - The company's operating revenue for the period was ¥1,106,070,998.70, a decrease of 21.62% compared to ¥1,411,173,857.40 in the previous year[127] - Operating profit for 2022 was 258.003 million RMB, down 59.63% compared to the previous year[153] Assets and Liabilities - Current assets totaled approximately ¥2.51 billion, a decrease of 1.95% from ¥2.56 billion in the previous year[7] - Non-current assets increased to approximately ¥2.07 billion, a rise of 9.23% from ¥1.90 billion[8] - Total assets reached approximately ¥4.59 billion, an increase of 2.81% from ¥4.46 billion[8] - Total liabilities amounted to approximately ¥566.77 million, an increase of 9.66% from ¥516.79 million[9] - Shareholders' equity totaled approximately ¥4.02 billion, up 1.91% from ¥3.95 billion[9] - Total assets reached CNY 4,484,199,713.25, up from CNY 4,315,762,387.49, reflecting overall growth in the company's financial position[12] - Total liabilities increased to CNY 472,542,695.19 from CNY 422,628,143.87, indicating a rise in financial obligations[12] Cash Flow - The company reported a net cash flow from operating activities of approximately ¥391.75 million, down 36.10% from ¥613.10 million in 2021[73] - The net cash flow from operating activities decreased by 36.10% to ¥391,750,297.78 in 2022 from ¥613,101,286.33 in 2021[3] - The net cash flow from investing activities improved by 28.01%, reducing the outflow to ¥630,585,198.91 from ¥875,936,754.20[3] - The net cash flow from financing activities decreased significantly by 69.22% to ¥3,468,237.74 from ¥11,266,262.04, primarily due to cash dividends paid in 2021[3] Research and Development - Research and development expenses increased to 193,056,982.44 RMB, up from 179,966,040.55 RMB, reflecting a growth of about 7.5%[13] - The company's total R&D expenditure was ¥193 million, accounting for 17.45% of total revenue, reflecting ongoing investment in technology and process development[166] - The proportion of R&D personnel increased to 27.44%, with a total of 267 R&D staff members[8] - The company is actively involved in a national key R&D project for advanced packaging testing platforms for MEMS sensors, aiming to overcome key technical challenges[87] Market and Industry Trends - Global semiconductor sales reached $573.5 billion in 2022, a 3.2% increase from $555.9 billion in 2021, but the market growth slowed significantly in the second half of the year[82] - The automotive chip market saw significant growth, reaching $34.1 billion in sales, a 29.2% increase[89] - The global CIS market size was reported at $18.495 billion in 2022, marking a slight decline from the previous year, the first negative growth in seven years[111] - The global image sensor shipment volume grew from 4.14 billion units in 2016 to 7.72 billion units in 2020, with a projected CAGR of 8.5% from 2021 to 2025[90] Strategic Initiatives - The company is focusing on the development of advanced integrated circuit packaging technology and expanding its micro-optical components business[84] - The company is actively pursuing mergers and acquisitions of international advanced technologies to extend its industrial chain[84] - The company aims to enhance its competitive advantage through continuous technological innovation[84] - The company is investing in Israeli VisIC to expand its layout in high-power GaN technology for automotive applications, leveraging its advanced packaging capabilities[86] - The company aims to establish a research institute for automotive semiconductor technology in Suzhou, focusing on new processes, materials, and equipment to build an industrial ecosystem[86] Operational Challenges - The decline in electronic components revenue was primarily due to a downturn in the consumer electronics market, particularly in mobile phones, leading to reduced packaging orders and shipment volumes[131] - The company reported a significant decrease in sales from the domestic market, with revenue down 46.07% year-over-year, while foreign sales increased by 1.01%[158] - The production volume of wafer-level packaging products decreased by 39.12%, while sales volume dropped by 40.59%[160] - The company had a reliance on a few major customers, with the top five customers accounting for 72.58% of total sales, indicating potential risks in customer concentration[163]