Important Notice This section provides key declarations from the board and management, outlines audit status, profit distribution plans, forward-looking statement risks, and details on fund occupation and external guarantees [I. Statement by the Board of Directors, Supervisory Board, and Senior Management](index=2&type=section&id=%E4%B8%80%E3%80%81%E8%91%A3%E4%BA%8B%E4%BC%9A%E3%80%81%E7%9B%91%E4%BA%8B%E4%BC%9A%E5%8F%8A%E9%AB%98%E7%AE%A1%E5%A3%B0%E6%98%8E) The company's Board of Directors, Supervisory Board, and all directors, supervisors, and senior management declare the semi-annual report content to be true, accurate, and complete, free from false statements, misleading representations, or major omissions, and assume legal responsibility - The company's Board of Directors, Supervisory Board, and all directors, supervisors, and senior management guarantee the truthfulness, accuracy, and completeness of the semi-annual report, free from false statements, misleading representations, or major omissions, and assume individual and joint legal responsibility[3](index=3&type=chunk) [II. Attendance at Board Meetings](index=2&type=section&id=%E4%BA%8C%E3%80%81%E8%91%A3%E4%BA%8B%E4%BC%9A%E4%BC%9A%E8%AE%AE%E5%87%BA%E5%B8%AD%E6%83%85%E5%86%B5) All directors of the company attended the Board of Directors meetings - All directors of the company attended the Board of Directors meetings[4](index=4&type=chunk) [III. Report Audit Status](index=2&type=section&id=%E4%B8%89%E3%80%81%E6%8A%A5%E5%91%8A%E5%AE%A1%E8%AE%A1%E6%83%85%E5%86%B5) This semi-annual report has not been audited - This semi-annual report has not been audited[4](index=4&type=chunk) [IV. Statement by the Head of Financial Reporting](index=2&type=section&id=%E5%9B%9B%E3%80%81%E8%B4%A2%E5%8A%A1%E6%8A%A5%E5%91%8A%E8%B4%9F%E8%B4%A3%E4%BA%BA%E5%A3%B0%E6%98%8E) The company's person in charge, the head of accounting work, and the head of the accounting department declare that the financial report in the semi-annual report is true, accurate, and complete - Company's person in charge Xu Huan, head of accounting work Liu Yuancheng, and head of accounting department (accounting supervisor) Qin Xiaoshuang declare: they guarantee the truthfulness, accuracy, and completeness of the financial report in the semi-annual report[5](index=5&type=chunk) [V. Profit Distribution Plan](index=2&type=section&id=%E4%BA%94%E3%80%81%E5%88%A9%E6%B6%A6%E5%88%86%E9%85%8D%E9%A2%84%E6%A1%88) The company will not carry out profit distribution or capital reserve capitalization during the reporting period - No profit distribution or capital reserve capitalization will be carried out during the reporting period[5](index=5&type=chunk) [VI. Risk Statement for Forward-Looking Statements](index=2&type=section&id=%E5%85%AD%E3%80%81%E5%89%8D%E7%9E%BB%E6%80%A7%E9%99%88%E8%BF%B0%E7%9A%84%E9%A3%8E%E9%99%A9%E5%A3%B0%E6%98%8E) Forward-looking statements in this report, such as future plans and development strategies, contain uncertainties and do not constitute a substantial commitment to investors, who are reminded to be aware of investment risks - This semi-annual report involves forward-looking statements such as future plans and development strategies, which contain uncertainties and do not constitute a substantial commitment by the company to investors; investors are kindly reminded to be aware of investment risks[6](index=6&type=chunk) [VII. Fund Occupation and External Guarantees](index=2&type=section&id=%E4%B8%83%E3%80%81%E8%B5%84%E9%87%91%E5%8D%A0%E7%94%A8%E4%B8%8E%E5%AF%B9%E5%A4%96%E6%8B%85%E4%BF%9D%E6%83%85%E5%86%B5) During the reporting period, the company had no non-operating fund occupation by controlling shareholders or other related parties, nor any external guarantees provided in violation of decision-making procedures - **No** non-operating fund occupation by controlling shareholders or other related parties[7](index=7&type=chunk) - **No** external guarantees provided in violation of decision-making procedures[7](index=7&type=chunk) [X. Major Risk Warning](index=2&type=section&id=%E5%8D%81%E3%80%81%E9%87%8D%E5%A4%A7%E9%A3%8E%E9%99%A9%E6%8F%90%E7%A4%BA) The company has elaborated on potential risks in its production and operations within the "Management Discussion and Analysis" section, reminding investors to pay attention - The company has detailed various risks it may face in its production and operations in this semi-annual report, specifically in Section III "Management Discussion and Analysis," "V. (I) Potential Risks," and other related descriptions; investors are kindly requested to pay attention[7](index=7&type=chunk) Section I. Definitions This section provides definitions of common terms used in the report, including company names, related parties, subsidiaries, industry terms (e.g., PCB, HDI, IPM), and the reporting period, to ensure accurate interpretation of the report [Definitions of Common Terms](index=4&type=section&id=%E5%B8%B8%E7%94%A8%E8%AF%8D%E8%AF%AD%E9%87%8A%E4%B9%89) This chapter defines common terms used in the report, such as company names, related parties, subsidiaries, industry jargon (e.g., PCB, HDI, IPM), and the reporting period, ensuring accurate report interpretation - **The Company, Company, Listed Company, Bomin Electronics** refers to Bomin Electronics Co., Ltd[12](index=12&type=chunk) - **PCB** refers to Printed Circuit Board[12](index=12&type=chunk) - **This Reporting Period, Reporting Period, During the Reporting Period, This Period** refers to January 1, 2025, to June 30, 2025[12](index=12&type=chunk) Section II. Company Profile and Key Financial Indicators This section provides an overview of the company's basic information, contact details, stock information, and key financial data and indicators for the reporting period [I. Company Information](index=5&type=section&id=%E4%B8%80%E3%80%81%E5%85%AC%E5%8F%B8%E4%BF%A1%E6%81%AF) This section lists the company's Chinese name, abbreviation, foreign name and abbreviation, and legal representative information - Company's Chinese Name: Bomin Electronics Co., Ltd.; Company's Chinese Abbreviation: Bomin Electronics; Company's Legal Representative: Xu Huan[14](index=14&type=chunk) [II. Contact Person and Contact Information](index=5&type=section&id=%E4%BA%8C%E3%80%81%E8%81%94%E7%B3%BB%E4%BA%BA%E5%92%8C%E8%81%94%E7%B3%BB%E6%96%B9%E5%BC%8F) This section provides contact details for the company's Board Secretary and Securities Affairs Representative, including names, addresses, phone numbers, fax numbers, and email addresses - Board Secretary: Huang Xiaodan; Securities Affairs Representative: Chen Si; Contact Address: Dongsheng Industrial Park B, Meizhou City, Guangdong Province; Phone: 0753-2329896; Email: xd_huang@bominelec.com / s_chen@bominelec.com[15](index=15&type=chunk) [III. Brief Introduction to Changes in Basic Information](index=5&type=section&id=%E4%B8%89%E3%80%81%E5%9F%BA%E6%9C%AC%E6%83%85%E5%86%B5%E5%8F%98%E6%9B%B4%E7%AE%80%E4%BB%8B) This section outlines the company's registered address, office address, postal code, website, and email, noting no changes during the reporting period - Company Registered Address: Dongsheng Industrial Park, Meizhou Economic Development Experimental Zone; Company Website: www.bominelec.com; Index for Changes during the Reporting Period: Not applicable[16](index=16&type=chunk) [IV. Brief Introduction to Changes in Information Disclosure and Document Storage Locations](index=5&type=section&id=%E5%9B%9B%E3%80%81%E4%BF%A1%E6%81%AF%E6%8A%AB%E9%9C%B2%E5%8F%8A%E5%A4%87%E7%BD%AE%E5%9C%B0%E7%82%B9%E5%8F%98%E6%9B%B4%E6%83%85%E5%86%B5%E7%AE%80%E4%BB%8B) This section discloses the company's designated newspapers for information disclosure, the website address for semi-annual reports, and document storage locations, confirming no changes during the reporting period - Company's designated newspapers for information disclosure: China Securities Journal, Shanghai Securities News, Securities Times, Securities Daily; Website address for semi-annual reports: www.sse.com.cn; No changes occurred during the reporting period[17](index=17&type=chunk) [V. Company Stock Overview](index=5&type=section&id=%E4%BA%94%E3%80%81%E5%85%AC%E5%8F%B8%E8%82%A1%E7%A5%A8%E7%AE%80%E5%86%B5) This section provides basic information about the company's stock, including its type, listing exchange, stock abbreviation, and stock code - Stock Type: A-share; Stock Exchange: Shanghai Stock Exchange; Stock Abbreviation: Bomin Electronics; Stock Code: 603936[18](index=18&type=chunk) [VII. Company's Key Accounting Data and Financial Indicators](index=5&type=section&id=%E4%B8%83%E3%80%81%E5%85%AC%E5%8F%B8%E4%B8%BB%E8%A6%81%E4%BC%9A%E8%AE%A1%E6%95%B0%E6%8D%AE%E5%92%8C%E8%B4%A2%E5%8A%A1%E6%8C%87%E6%A0%87) During the reporting period, the company's operating revenue increased by 12.71% year-on-year, but total profit, net profit attributable to shareholders, and net cash flow from operating activities all decreased, mainly due to increased selling and administrative expenses and higher deposits (I) Key Accounting Data During the reporting period, the company's operating revenue increased by 12.71% year-on-year, total assets and net assets attributable to shareholders both grew, but total profit, net profit attributable to shareholders, and net cash flow from operating activities all decreased year-on-year | Key Accounting Data (Jan-Jun 2025 vs. Prior Year Period) | This Reporting Period (Jan-Jun) (CNY) | Prior Year Period (CNY) | Change from Prior Year Period (%) | | :--- | :--- | :--- | :--- | | Operating Revenue | 1,704,946,070.91 | 1,512,684,997.27 | 12.71 | | Total Profit | 39,738,939.77 | 62,814,450.77 | -36.74 | | Net Profit Attributable to Shareholders of Listed Company | 37,894,392.93 | 55,222,795.03 | -31.38 | | Net Profit Attributable to Shareholders of Listed Company Excluding Non-Recurring Gains and Losses | 23,849,138.05 | 32,562,563.49 | -26.76 | | Net Cash Flow from Operating Activities | 176,347,130.23 | 269,405,913.56 | -34.54 | | Net Assets Attributable to Shareholders of Listed Company (Period-end) | 4,366,314,289.07 | 4,259,567,260.86 | 2.51 | | Total Assets (Period-end) | 9,633,209,439.27 | 9,043,075,245.92 | 6.53 | (II) Key Financial Indicators During the reporting period, the company's basic and diluted earnings per share both decreased by 33.33% year-on-year, and the weighted average return on net assets also declined, mainly due to a decrease in net profit | Key Financial Indicators (Jan-Jun 2025 vs. Prior Year Period) | This Reporting Period (Jan-Jun) | Prior Year Period | Change from Prior Year Period (%) | | :--- | :--- | :--- | :--- | | Basic Earnings Per Share (CNY/share) | 0.06 | 0.09 | -33.33 | | Diluted Earnings Per Share (CNY/share) | 0.06 | 0.09 | -33.33 | | Basic Earnings Per Share Excluding Non-Recurring Gains and Losses (CNY/share) | 0.04 | 0.05 | -20.00 | | Weighted Average Return on Net Assets (%) | 0.89 | 1.22 | -0.33 | | Weighted Average Return on Net Assets Excluding Non-Recurring Gains and Losses (%) | 0.56 | 0.72 | -0.16 | - The change in basic earnings per share was primarily due to a year-on-year decrease in net profit[22](index=22&type=chunk) - The change in diluted earnings per share was primarily due to a year-on-year decrease in net profit[23](index=23&type=chunk) - The change in total profit was primarily due to increased selling and administrative expenses[22](index=22&type=chunk) - The change in net cash flow from operating activities was primarily due to a year-on-year increase in various deposits paid for letters of credit, bank acceptance bills, and guarantees during this reporting period[22](index=22&type=chunk) [IX. Non-Recurring Gains and Losses Items and Amounts](index=6&type=section&id=%E4%B9%9D%E3%80%81%E9%9D%9E%E7%BB%8F%E5%B8%B8%E6%80%A7%E6%8D%9F%E7%9B%8A%E9%A1%B9%E7%9B%AE%E5%92%8C%E9%87%91%E9%A2%9D) During the reporting period, the company's total non-recurring gains and losses amounted to **14.05 million CNY**, primarily from government subsidies and other non-operating income and expenses Non-Recurring Gains and Losses Items and Amounts | Non-Recurring Gains and Losses Items | Amount (CNY) | | :--- | :--- | | Gains and losses from disposal of non-current assets | -92,658.37 | | Government subsidies recognized in current profit or loss | 12,989,658.64 | | Fair value changes and disposal gains/losses from financial assets and liabilities held by non-financial enterprises, excluding effective hedge accounting related to normal business operations | 1,157,795.58 | | Other non-operating income and expenses apart from the above | 2,433,222.01 | | Less: Income tax impact | 2,479,314.33 | | Minority interest impact (after tax) | -36,551.35 | | Total | 14,045,254.88 | - Total non-recurring gains and losses amounted to **14,045,254.88 CNY**[26](index=26&type=chunk) [X. Companies with Equity Incentive or Employee Stock Ownership Plans May Choose to Disclose Net Profit After Deducting Share-Based Payment Impact](index=7&type=section&id=%E5%8D%81%E3%80%81%E5%AD%98%E5%9C%A8%E8%82%A1%E6%9D%83%E6%BF%80%E5%8A%B1%E3%80%81%E5%91%98%E5%B7%A5%E6%8C%81%E8%82%A1%E8%AE%A1%E5%88%92%E7%9A%84%E5%85%AC%E5%8F%B8%E5%8F%AF%E9%80%89%E6%8B%A9%E6%8A%AB%E9%9C%B2%E6%89%A3%E9%99%A4%E8%82%A1%E4%BB%BD%E6%94%AF%E4%BB%98%E5%BD%B1%E5%93%8D%E5%90%8E%E7%9A%84%E5%87%80%E5%88%A9%E6%B6%A6) During the reporting period, the company's net profit after deducting the impact of share-based payments was **53.93 million CNY**, a year-on-year decrease of 10.63% Net Profit After Deducting Share-Based Payment Impact | Key Accounting Data | This Reporting Period (Jan-Jun) (CNY) | Prior Year Period (CNY) | Change from Prior Year Period (%) | | :--- | :--- | :--- | :--- | | Net Profit After Deducting Share-Based Payment Impact | 53,928,604.72 | 60,340,096.74 | -10.63 | - Net profit after deducting share-based payment impact was **53,928,604.72 CNY**, a year-on-year decrease of **10.63%**[28](index=28&type=chunk) Section III. Management Discussion and Analysis This section discusses the company's industry, main business operations, key financial performance, core competencies, and potential risks during the reporting period [I. Description of the Company's Industry and Main Business Operations During the Reporting Period](index=8&type=section&id=%E4%B8%80%E3%80%81%E6%8A%A5%E5%91%8A%E6%9C%9F%E5%86%85%E5%85%AC%E5%8F%B8%E6%89%80%E5%B1%9E%E8%A1%8C%E4%B8%9A%E5%8F%8A%E4%B8%BB%E8%90%A5%E4%B8%9A%E5%8A%A1%E6%83%85%E5%86%B5) The company has been deeply involved in the PCB industry for 31 years, focusing on high-end products like HDI boards, high-layer boards, and packaging substrates, while actively expanding into innovative businesses such as ceramic substrates and packaging substrates, forming a "main business + innovative business" model to capitalize on structural growth in the global PCB market and surging demand for high-end products [1. PCB Industry Development](index=8&type=section&id=1.%20PCB%20Industry%20Development) The global PCB market is projected to reach **78.56 billion USD** in 2025, with a **CAGR of 5.2%** from 2024-2029, with mainland China remaining the dominant manufacturing hub; servers, data centers, automotive electronics, and consumer electronics are key growth areas, driving surging demand for high-end products like 18-layer+ multi-layer boards, HDI boards, and packaging substrates - According to Prismark, the global PCB industry output value is expected to reach **78.56 billion USD** in 2025, a year-on-year increase of **6.8%**; by 2029, the global PCB industry output value is projected to grow to **94.66 billion USD**, corresponding to a **CAGR of 5.2%** from 2024-2029[31](index=31&type=chunk) - Mainland China's PCB output value accounts for **56%** of the global total and will continue to maintain its dominant manufacturing hub status in the industry[31](index=31&type=chunk) 2024-2029 PCB Industry Development Forecast (by Application Area) | Type/Year | 2023 Output Value (Million USD) | 2024 Output Value (Million USD) | 2025F Growth Rate (%) | 2029F Output Value (Million USD) | 2024-2029F CAGR Forecast (%) | | :--- | :--- | :--- | :--- | :--- | :--- | | Servers/Data Storage | 8,201 | 10,916 | 28.32% | 18,921 | 11.6% | | Mobile Phones | 13,085 | 13,886 | 2.64% | 17,329 | 4.5% | | Automotive Electronics | 9,153 | 9,195 | 2.37% | 11,205 | 4.0% | | 18-layer boards and above | 1,726 | 2,421 | 40.3% | 5,020 | 15.7% | | HDI | 10,536 | 12,518 | 18.8% | 17,037 | 6.4% | | Packaging Substrates | 12,498 | 12,602 | 0.8% | 17,985 | 7.4% | [2. Company's Product Segmentation and Industry Position](index=9&type=section&id=2.%20Company's%20Product%20Segmentation%20and%20Industry%20Position) The company has been a leading PCB supplier in China for 31 years, ranking **52nd globally** in 2023, with mass production of HDI boards and as a rare domestic AMB ceramic substrate producer, ranking second in capacity, poised to benefit from high-growth sectors like AI and new energy vehicles - Established in 1994, the company has been deeply involved in the PCB industry for **31 years**, diversifying its product structure while focusing on high-end products such as HDI boards, high-layer boards, and packaging substrates to accelerate mass production[36](index=36&type=chunk) - In 2023, the company ranked **16th** among domestic PCB enterprises in China's electronic circuit industry and **30th** among comprehensive PCB enterprises; according to Prismark's 2023 global top 100 PCB enterprise ranking, the company was ranked **52nd**[36](index=36&type=chunk) - The company is a rare domestic ceramic substrate producer that has achieved mass production; according to incomplete statistics from Aibang Ceramic Exhibition, there are **15 domestic AMB ceramic substrate enterprises**, and the company ranks **second** in AMB capacity scale[37](index=37&type=chunk) [3. Main Business, Main Products, and Uses](index=9&type=section&id=3.%20Main%20Business,%20Main%20Products,%20and%20Uses) The company specializes in R&D, production, and sales of high-precision printed circuit boards, including HDI, high-frequency high-speed, and multi-layer boards, focusing on new energy (including automotive electronics), data/communication, smart terminals, and industrial security, while actively developing innovative businesses like ceramic substrates and packaging substrates for new growth drivers - The company specializes in the R&D, production, and sales of high-precision printed circuit boards, with main products including high-density interconnect (HDI) boards, high-frequency high-speed boards, multi-layer boards, rigid-flex boards (including flexible circuit boards), and other special specification boards[39](index=39&type=chunk) - Strategically focusing on four core sectors: new energy (including automotive electronics), data/communication, smart terminals, industrial security, and others[39](index=39&type=chunk) - Innovative businesses primarily include ceramic substrate business, packaging substrate business, and full supply chain value-added services[41](index=41&type=chunk) [4. Company's Main Business Model](index=11&type=section&id=4.%20Company's%20Main%20Business%20Model) The company operates on a make-to-order production model, utilizing a highly integrated digital system (ERP+EAS+MES+QMS+EAP) for production quality management; procurement is centralized with separated powers, and sales are customer-centric, employing a regional and departmental organizational structure to expand domestic and international premium clients - The company operates on a **make-to-order** production model[44](index=44&type=chunk) - The company has established a highly integrated digital system for production quality management, encompassing **ERP+EAS+MES+QMS+EAP**[44](index=44&type=chunk) - The group has established a procurement management headquarters, implementing a centralized procurement model with separated powers, and a procurement management committee[46](index=46&type=chunk) - The company consistently adheres to the philosophy of "customer-centricity and value creation for customers," actively developing domestic and international industry benchmark clients in its core development areas[47](index=47&type=chunk) - Established in 1994, the company has been deeply involved in the PCB industry for **31 years**, diversifying its product structure while focusing on high-end products such as HDI boards, high-layer boards, and packaging substrates to accelerate mass production[36](index=36&type=chunk) - With PCB as its core, the company extends its business (PCB+) both horizontally and vertically, continuously increasing R&D and market development efforts for high-value-added products such as customized electronic components, modular products, and micro-chip devices, forming a "main business + innovative business" model[38](index=38&type=chunk)[39](index=39&type=chunk) - Innovative businesses primarily include ceramic substrate business, packaging substrate business, and full supply chain value-added services[41](index=41&type=chunk) [II. Discussion and Analysis of Operations](index=12&type=section&id=%E4%BA%8C%E3%80%81%E7%BB%8F%E8%90%A5%E6%83%85%E5%86%B5%E7%9A%84%E8%AE%A8%E8%AE%BA%E4%B8%8E%E5%88%86%E6%9E%90) During the reporting period, the company's operating revenue increased by 12.71% year-on-year, driven by high-value-added products in AI and automotive electronics; however, net profit attributable to shareholders decreased by 31.38% due to share-based payment expenses and increased period expenses from new product promotion, while subsidiary Jiangsu Bomin achieved a turnaround with gradually releasing high-end capacity - In the first half of 2025, operating revenue reached **1,704.95 million CNY**, a year-on-year increase of **12.71%**, primarily due to the company actively seizing industry development opportunities, intensifying efforts in high-value-added product areas such as AI and automotive electronics, and promoting the release of high-end capacity across its factories[48](index=48&type=chunk) - Net profit attributable to shareholders of the listed company was **37.89 million CNY**, a year-on-year decrease of **31.38%**, mainly due to **16.03 million CNY** in share-based payment expenses for the employee stock ownership plan implemented during the reporting period and increased period expenses from new product promotion[48](index=48&type=chunk) - Subsidiary Jiangsu Bomin achieved a **turnaround**, with its Phase I factory operating at full capacity and stable profitability; the Phase II factory's capacity utilization rate steadily increased, leading to improved operating performance[48](index=48&type=chunk) [I) Gradual Release of HDI Capacity Helps Jiangsu Bomin Achieve Turnaround](index=12&type=section&id=(%E4%B8%80)%20HDI%20%E4%BA%A7%E8%83%BD%E9%80%90%E6%AD%A5%E9%87%8A%E6%94%BE%E5%8A%A9%E6%8E%A8%E6%B1%9F%E8%8B%8F%E5%8D%9A%E6%95%8F%E5%AE%9E%E7%8E%B0%E6%89%AD%E4%BA%8F%E4%B8%BA%E7%9B%88) During the reporting period, the company's PCB business saw a slight recovery through refined operations and product structure optimization; subsidiary Jiangsu Bomin achieved a turnaround, with its Phase I factory operating at full capacity and stable profitability, and Phase II factory's capacity utilization steadily increasing, expected to be on track in the second half of the year - During the reporting period, the company implemented refined operational management to achieve cost reduction and efficiency improvement, and through continuous optimization of product structure, high-end factory capacity was gradually released, leading to a slight recovery in the PCB business[48](index=48&type=chunk) - Notably, subsidiary Jiangsu Bomin achieved a **turnaround**, with its Phase I factory operating at full capacity and stable profitability; after efforts during the capacity ramp-up period, the Phase II factory made significant progress in technology, products, customers, and operational management, with steadily increasing capacity utilization and corresponding improvement in operating performance[48](index=48&type=chunk) [II) Focusing on High-Value-Added Areas, Seizing Structural Opportunities](index=12&type=section&id=(%E4%BA%8C)%20%E5%8F%91%E5%8A%9B%E9%AB%98%E9%99%84%E5%8A%A0%E5%80%BC%E9%A2%86%E5%9F%9F%EF%BC%8C%E7%B4%A7%E6%8A%93%E7%BB%93%E6%9E%84%E6%80%A7%E6%9C%BA%E4%BC%9A) The company capitalized on structural opportunities in AI and automotive electronics, increasing orders for AI computing PCB products, extending server PCBs to AI servers, and benefiting from deeper client collaboration in optical module business, while expanding into new energy vehicle manufacturers, overseas automakers, and Tier1 suppliers in automotive electronics - The company fully seized structural opportunities, achieving positive progress in multiple downstream application markets[49](index=49&type=chunk) - In the data center sector, during the reporting period, the company actively deployed in the PCB product sub-segment for AI computing power, with a further increase in relevant order volumes; specifically, server PCB products are gradually extending to AI servers, with stable batch deliveries to customers including high-end server motherboards, and AI server accelerator cards[49](index=49&type=chunk) - In the automotive electronics sector, the company seized growth opportunities in intelligent mobility, developing new clients including global leading Tier1 manufacturers like Faurecia, domestic LiDAR leaders, and domestic automakers' chassis domain and smart cockpit segments[50](index=50&type=chunk) [III) Adhering to Localization and Independent Development, Seizing Opportunities in Ceramic Substrate Business](index=12&type=section&id=(%E4%B8%89)%20%E5%9D%9A%E6%8C%81%E8%B5%B0%E5%9B%BD%E4%BA%A7%E5%8C%96%E3%80%81%E8%87%AA%E4%B8%BB%E5%8C%96%E9%81%93%E8%B7%AF%EF%BC%8C%E6%8A%8A%E6%8F%A1%E9%99%B6%E7%93%B7%E8%A1%AC%E6%9D%BF%E4%B8%9A%E5%8A%A1%E5%8F%91%E5%B1%95%E6%9C%BA%E9%81%87) The company achieved mass production of **65W localized silicon nitride AMB ceramic substrates** and became a primary supplier of DPC substrates for domestic LiDAR leader RoboSense, also supplying DPC ceramic substrates to Micro TEC manufacturers, with future expansion into AI and humanoid robotics - During the reporting period, the company achieved mass production application of **65W localized silicon nitride AMB ceramic substrates**[51](index=51&type=chunk) - The company's DPC substrate business, while maintaining stable market share with core clients in the automotive sector, achieved new heights in application areas such as Micro TEC and T/R modules[52](index=52&type=chunk) - It has now become a primary supplier of DPC ceramic substrates for RoboSense, a leading domestic LiDAR manufacturer, with related products already applied in multiple new energy vehicles[52](index=52&type=chunk) [IV) Continuously Deepening Specialty Products Business, Adhering to Customer-Oriented Approach](index=13&type=section&id=(%E5%9B%9B)%20%E6%8C%81%E7%BB%AD%E6%B7%B1%E8%80%95%E7%89%B9%E8%89%B2%E5%93%81%E4%B8%9A%E5%8A%A1%EF%BC%8C%E5%9D%9A%E6%8C%81%E4%BB%A5%E5%AE%A2%E6%88%B7%E9%9C%80%E6%B1%82%E4%B8%BA%E5%AF%BC%E5%90%91) Leveraging its technical expertise in high-quality, high-precision PCBs, the company obtained specialty product certifications and expanded from PCB customization to offering one-stop services like PCBA assembly and module assembly, establishing stable partnerships with ten major group clients in the specialty product sector - The company has cultivated the specialty product sector for many years, possessing multiple intellectual property rights and achievement appraisals, and has obtained certifications for specialty product qualifications based on its extensive technical accumulation and expertise in high-quality, high-precision PCB fields[54](index=54&type=chunk) - Evolving from initial PCB customization, it has gradually developed the capability to provide one-stop services for specialty product clients, including PCBA assembly, module assembly, and semiconductor component OEM[54](index=54&type=chunk) [V) Fund-raising Projects Steadily Advancing, High-Layer and HDI High-End PCB Capacity Expected to Be Strengthened](index=13&type=section&id=(%E4%BA%94)%20%E5%8B%9F%E6%8A%95%E9%A1%B9%E7%9B%AE%E7%A8%B3%E6%AD%A5%E6%8E%A8%E8%BF%9B%EF%BC%8C%E9%AB%98%E5%A4%9A%E5%B1%82%E5%92%8C%20HDI%20%E7%AD%89%E9%AB%98%E7%AB%AF%20PCB%20%E4%BA%A7%E8%83%BD%E6%9C%89%E6%9C%9B%E8%A1%A5%E5%BC%BA) The company's new-generation electronic information industry investment and expansion project (Phase I) has gradually put its first smart manufacturing factory into operation, producing high-end PCB products like high-layer and high-reliability HDI boards, with capabilities for **52 layers**, **30:1 aspect ratio through-holes**, and **7-stage HDI**, yielding **360,000 square meters annually**, enhancing product structure optimization; the project's expected operational date is adjusted to December 31, 2026 - The company's new-generation electronic information industry investment and expansion project (Phase I) is adopting a phased construction and production approach, with the expected operational date adjusted to **December 31, 2026**[55](index=55&type=chunk) - The first smart manufacturing factory of the fund-raising project has gradually commenced production, primarily manufacturing high-end PCB products such as high-layer and high-reliability HDI, which are the fastest-growing in their respective sub-segments[55](index=55&type=chunk) - It possesses capabilities for **52 layers**, **30:1 aspect ratio through-holes**, and **7-stage HDI production**, with an annual output capacity of **360,000 square meters** for high-end products[55](index=55&type=chunk) [III. Analysis of Core Competitiveness During the Reporting Period](index=13&type=section&id=%E4%B8%89%E3%80%81%E6%8A%A5%E5%91%8A%E6%9C%9F%E5%86%85%E6%A0%B8%E5%BF%83%E7%AB%9E%E4%BA%89%E5%8A%9B%E5%88%86%E6%9E%90) The company's core competitiveness stems from its unique upstream and downstream integrated solutions, strong customer base, robust technical and R&D capabilities, efficient operational management, and a stable management team, all supported by its "PCB+" strategy, numerous patents, and continuous smart factory development - As one of the few companies in the industry with integrated upstream and downstream solution capabilities, the company operates both a **PCB Business Unit** and a **Solutions Business Unit**[56](index=56&type=chunk) - The company's main business has cultivated an excellent client base in high-tech fields such as new energy/automotive electronics, data/communication, smart terminals, and industrial control security, with end customers including industry leaders like Huawei, iFlytek, ZTE, Samsung Electronics, and BYD[58](index=58&type=chunk) - The company is a **National High-Tech Enterprise**, having successively established **7 provincial-level R&D platforms** and undertaken multiple provincial and municipal scientific and technological projects[61](index=61&type=chunk) - The company has cultivated the PCB sector for **31 years**, possessing advanced process production technology, establishing a comprehensive and effective quality management system, and forming a high-quality, efficient, stable, and cost-advantageous supply chain system[69](index=69&type=chunk) - Founder Mr. Xu Huan possesses years of management experience and extensive PCB technical expertise; under his leadership, the company has deep overall technological accumulation and a stable operating style, with a scientific and sound organizational structure and a stable management team[70](index=70&type=chunk) [I) Unique Upstream and Downstream Integrated Solution Capability](index=13&type=section&id=(%E4%B8%80)%20%E7%8B%AC%E7%89%B9%E7%9A%84%E4%B8%8A%E4%B8%8B%E6%B8%B8%E4%B8%80%E4%BD%93%E5%8C%96%E8%A7%A3%E5%86%B3%E8%83%BD%E5%8A%9B) The company, with its PCB and Solutions Business Units, possesses a complete product structure and PCB process technology, offering one-stop "PCB + components + solutions" services, expanding its industrial chain through a "PCB+" transformation, and demonstrating significant synergistic effects across its business segments - As one of the few companies in the industry with integrated upstream and downstream solution capabilities, the company operates both a **PCB Business Unit** and a **Solutions Business Unit**[56](index=56&type=chunk) - The company possesses the capability to provide customers with one-stop "PCB + components + solutions" services, meeting customer needs across the entire supply chain, including electronic assembly, functional testing, module/product assembly, and EMS/ODM[56](index=56&type=chunk) - Since its "PCB+" transformation in 2020, the company has continuously expanded its industrial chain and product application areas through both organic growth and external expansion, from both industry depth and breadth; currently, based on the stable development of its main business, the company is expanding into innovative businesses, with increasingly prominent synergistic effects across its various segments[57](index=57&type=chunk) [II) Customer Structure Advantage](index=14&type=section&id=(%E4%BA%8C)%20%E5%AE%A2%E6%88%B7%E7%BB%93%E6%9E%84%E4%BC%98%E5%8A%BF) The company has accumulated extensive customer resources, maintaining strong partnerships with renowned domestic and international brands and industry benchmark clients, forming a differentiated competitive advantage; its main business focuses on high-tech fields, while innovative businesses expand into military, new energy, and other sectors, with a reserve of high-quality potential clients - The company has accumulated extensive customer resources during its operations, maintaining good cooperative relationships with well-known domestic and international brand clients or industry benchmark clients, forming a differentiated competitive advantage within the industry, with increasing customer loyalty and number of clients year by year[58](index=58&type=chunk) - End customers include high-quality industry clients such as Huawei, iFlytek, ZTE, Samsung Electronics, Jabil, Knowles, Goertek, BYD, GAC, Faurecia, Foxconn, Lenovo, Hisense, Great Wall Computer, BOE, Wingtech Technology, Amazon, Hyundai, MOBIS, Rihai IoT, Huaqin Telecom, Osram, Merry Electronics, and Tianma Microelectronics[58](index=58&type=chunk) - Innovative business clients include industry leaders such as Midea, Gree, TCL, Aux, smart meter terminals, Luxshare Precision, Honeywell, Sunmi, and Baidu, and have also deepened cooperation with clients like Huawei Technologies, RoboSense, new energy vehicle manufacturers, the Second Academy of Aerospace Science and Industry, NARI Group, and CRRC[58](index=58&type=chunk) [III) Technology and R&D Advantage](index=14&type=section&id=(%E4%B8%89)%20%E6%8A%80%E6%9C%AF%E5%92%8C%E7%A0%94%E5%8F%91%E4%BC%98%E5%8A%BF) As a National High-Tech Enterprise, the company boasts **7 provincial-level R&D platforms** and participates in national key R&D programs, holding numerous proprietary patents in HDI, high-frequency high-density integrated PCBs, ceramic substrates, server motherboards, composite substrates, rigid-flex boards, optical module PCBs, and packaging substrates, with R&D expenses accounting for **3.93% of operating revenue** - The company is a **National High-Tech Enterprise**, having successively established **7 provincial-level R&D platforms**[61](index=61&type=chunk) - In 2024, through Meizhou City's "Hongyan Program," the company introduced an "innovation team" centered around experts from the University of Electronic Science and Technology of China, primarily to tackle key technical challenges in the "High-Speed Printed Circuit Key Technology and Industrialization for Big Data Interconnection" project[61](index=61&type=chunk) - The company has developed a series of proprietary patented technologies, including "Method for embedding capacitors in printed circuit boards and their printed circuit boards," high-precision embedded resistor technology, CPCA/T 6046-2022 "Specification for Printed Circuit Boards with Embedded or Integrated Copper Blocks," Birch Stream platform technology layout in the server domain, composite substrate technology, unequal thickness rigid-flex boards, mass production capability for 800G optical module PCB products, packaging substrate mSAP, Coreless&ETS process technology, and AMB ceramic substrate technology[62](index=62&type=chunk)[63](index=63&type=chunk)[64](index=64&type=chunk)[65](index=65&type=chunk)[66](index=66&type=chunk)[67](index=67&type=chunk)[68](index=68&type=chunk) - During the reporting period, the company's R&D expenses amounted to **67.00 million CNY**, accounting for **3.93%** of operating revenue, primarily invested in servers, new energy automotive electronics, high-end HDI, ceramic substrates, and packaging substrates[68](index=68&type=chunk) [IV) Operational Advantage](index=16&type=section&id=(%E5%9B%9B)%20%E8%BF%90%E8%90%A5%E4%BC%98%E5%8A%BF) With 31 years of experience in the PCB sector, the company possesses advanced processes and a comprehensive quality management system, fostering a high-quality, efficient, stable, and cost-effective supply chain, continuously enhancing operational efficiency and reducing overall costs through Costdown initiatives, lean production, and smart factory construction - The company has cultivated the PCB sector for **31 years**, possessing advanced process production technology, establishing a comprehensive and effective quality management system, strictly formulating various business standard operating procedures, and gradually integrating the requirements of "two strictnesses and three standardizations," providing effective assurance for continuous product reliability improvement[69](index=69&type=chunk) - It has formed a high-quality, efficient, stable, and cost-advantageous supply chain system, capable of effectively reducing product procurement costs and shortening production cycles[69](index=69&type=chunk) - The company consistently carries out Costdown, lean production as core cost reduction and efficiency improvement activities, and continuously invests in smart factory construction and technological upgrades of existing factories, reducing overall costs and continuously improving the company's operational efficiency[69](index=69&type=chunk) [V) Management Advantage](index=16&type=section&id=(%E4%BA%94)%20%E7%AE%A1%E7%90%86%E4%BC%98%E5%8A%BF) Founder Mr. Xu Huan's extensive management experience and PCB technical expertise have fostered a stable operating style and deep technological foundation for the company, which boasts a scientific and sound organizational structure, a stable "old, middle, and young" management team, and is implementing IPM management reforms to optimize processes and enhance management capabilities and factory manufacturing efficiency - Founder Mr. Xu Huan possesses years of management experience and extensive PCB technical expertise; under his leadership, the company has deep overall technological accumulation and a stable operating style; it has a scientific and sound organizational structure and a stable management team, forming a "senior, middle, and junior" combination of management personnel who leverage their management advantages in their respective fields[70](index=70&type=chunk) - The company implemented IPM management reforms, aiming to utilize advanced management concepts, processes, and tools to optimize company processes, reduce error costs, accelerate production circulation, enhance management capabilities, and integrate the marketing, R&D, and production systems to collaboratively improve factory manufacturing capabilities and achieve efficient operation[70](index=70&type=chunk) [IV. Major Operating Conditions During the Reporting Period](index=16&type=section&id=%E5%9B%9B%E3%80%81%E6%8A%A5%E5%91%8A%E6%9C%9F%E5%86%85%E4%B8%BB%E8%A6%81%E7%BB%8F%E8%90%A5%E6%83%85%E5%86%B5) During the reporting period, the company's operating revenue increased by 12.71% year-on-year, but selling, administrative, and financial expenses all grew significantly; total assets and net assets increased, with construction in progress surging by 52.10%; total investment decreased by 45.92% year-on-year, but derivative investments yielded profits, and key subsidiary Jiangsu Bomin achieved a turnaround with increased operating revenue (I) Analysis of Main Business During the reporting period, the company's operating revenue increased by 12.71% year-on-year, but selling, administrative, and financial expenses all grew significantly, with selling expenses increasing by 55.06% mainly due to intensified market expansion; net cash flow from operating activities decreased by 34.54% primarily due to increased deposits paid Financial Statement Items Change Analysis (Jan-Jun 2025 vs. Prior Year Period) | Item | Current Period Amount (CNY) | Prior Year Period Amount (CNY) | Change (%) | | :--- | :--- | :--- | :--- | | Operating Revenue | 1,704,946,070.91 | 1,512,684,997.27 | 12.71 | | Operating Cost | 1,479,066,340.46 | 1,303,543,543.85 | 13.47 | | Selling Expenses | 37,542,191.85 | 24,211,354.85 | 55.06 | | Administrative Expenses | 66,642,457.07 | 51,946,596.11 | 28.29 | | Financial Expenses | 25,468,467.22 | 19,704,816.40 | 29.25 | | R&D Expenses | 67,003,979.26 | 62,158,605.61 |

证券代码：603936 证券简称：博敏电子 公告编号：临 2025-067 博敏电子股份有限公司 关于召开 2025 年半年度业绩说明会的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重 大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 会议召开时间：2025 年 9 月 8 日（星期一）16:00-17:00 投资者可于 2025 年 9 月 1 日（星期一）至 9 月 5 日（星期五）16:00 前登录上证 路演中心网站首页点击"提问预征集"栏目或通过公司邮箱 BM@bominelec.com 进行 提问，公司将在说明会上对投资者普遍关注的问题进行回答。 博敏电子股份有限公司（以下简称"公司"）已于 2025 年 8 月 23 日在上海证券交 易所网站（www.sse.com.cn）披露了公司《2025 年半年度报告》，为便于广大投资者更 全面深入地了解公司 2025 年半年度经营成果、财务状况，公司计划于 2025 年 9 月 8 日 （星期一）16:00-17:00 举行 2025 年半年度业绩说明会，就投资者关心的问题进行交流。 一、说明会类型 ...

证券代码：603936 证券简称：博敏电子 公告编号：临 2025-066 博敏电子股份有限公司 关于2025年半年度募集资金存放与实际使用情况的专项报告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 根据中国证券监督管理委员会《上市公司募集资金监管规则》（证监会公告 〔2025〕10 号）《上海证券交易所上市公司自律监管指引第 1 号——规范运作》 （上证发〔2025〕68 号）及相关公告格式的规定，博敏电子股份有限公司（以下 简称"公司"）将 2025 年半年度募集资金存放与实际使用情况专项说明如下： 一、募集资金基本情况 （一）实际募集资金金额和资金到账时间 经中国证券监督管理委员会于 2022 年 9 月 15 日核发的《关于核准博敏电子 股份有限公司非公开发行股票的批复》（证监许可〔2022〕2134 号），公司采取向 特定对象发行的方式向 13 名特定投资者发行 127,011,007 股人民币普通股股票， 发行价格为 11.81 元/股。本次发行股份募集资金总额为人民币 150,000.00 万元， 扣除各项发 ...

博敏电子公告，2025年上半年营业收入17.05亿元，同比增长12.71%。净利润3789.44万元，同比下降 31.38%。 ...

Group 1 - The core viewpoint highlights a significant rise in the stock prices of computing hardware companies, particularly in sectors like CPO and copper connections [1] - Tengjing Technology experienced a 20% limit-up in stock price, indicating strong market interest and investor confidence [1] - Other companies such as Dekeli, Ruijie Network, Yidong Electronics, and Zhongfu Circuit saw stock increases exceeding 10%, reflecting a broader positive trend in the industry [1] Group 2 - Fangzheng Technology also hit the limit-up, showcasing robust performance among technology stocks [1] - Companies like Xingwang Ruijie, Cambridge Technology, Bomin Electronics, Guangku Technology, and Shenglan Co. experienced stock price increases of over 5%, further indicating a bullish sentiment in the computing hardware sector [1]

天眼查商业履历信息显示，博敏电子股份有限公司，成立于2005年，位于梅州市，是一家以从事计算 机、通信和其他电子设备制造业为主的企业。企业注册资本63039.8004万人民币，实缴资本63039.8004 万人民币。公司法定代表人为徐缓。 金融界消息 截至2025年7月30日收盘，博敏电子（603936）报收于10.45元，下跌1.23%，换手率7.0%， 成交量44.11万手，成交金额4.62亿元。 通过天眼查大数据分析，博敏电子股份有限公司共对外投资了13家企业，参与招投标项目28次，专利信 息191条，此外企业还拥有行政许可70个。 资金流向方面，今日主力资金净流出4456.38万元，占比成交额9.64%。其中，超大单净流出2002.69万 元、占成交额4.33%，大单净流出2453.70万元、占成交额5.31%，中单净流出流入1083.48万元、占成交 额2.34%，小单净流入3372.90万元、占成交额7.3%。 来源：金融界 博敏电子最新一期业绩显示，截至2025一季报，公司营业总收入8.23亿元、同比增长14.38%，归属净利 润2732.69万元，同比增长4.53%，扣非净利润2159.46万 ...

证券代码：603936 证券简称：博敏电子 公告编号：临 2025-063 博敏电子股份有限公司 一、现金管理概况 （一）前次使用部分闲置募集资金购买理财产品赎回的情况 关于使用部分闲置募集资金进行现金管理的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 投资种类：单位协定存款 投资金额：博敏电子股份有限公司（以下简称"公司"）与中国农业银 行股份有限公司梅州城区支行（以下简称"农业银行"）签署了《单位协定存款 协议》，签署初始金额为 4,853.16 万元。 已履行的审议程序：2025 年 3 月 18 日，公司召开第五届董事会审计委 员会第十二次会议、第五届董事会第十八次会议及第五届监事会第十四次会议审 议通过了《关于公司继续使用部分闲置募集资金进行现金管理的议案》，具体内 容详见公司于 2025 年 3 月 20 日在上海证券交易所网站（www.sse.com.cn）披露 的《关于继续使用部分闲置募集资金进行现金管理的公告》（公告编号：临 2025-024）。 特别风险提示：公司本次使用闲置募集 ...

证券代码：603936 证券简称：博敏电子 公告编号：临 2025-062 博敏电子股份有限公司 为子公司申请银行授信提供担保的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 担保对象及基本情况 | | 被担保人名称 | "江苏博敏"） | 江苏博敏电子有限公司（以下简称 | | --- | --- | --- | --- | | | 本次担保金额 | 12,000 万元 | | | 担保对象 | 实际为其提供的担保余额 | 105,013.40 | 万元（不含本次） | | | 是否在前期预计额度内 | 是 □否 | □不适用：_________ | | | 本次担保是否有反担保 | □是 否 | □不适用：_________ | 累计担保情况 为满足日常经营及业务发展资金需求，江苏博敏向江苏大丰农村商业银行股 份有限公司（以下简称"大丰农商行"）申请授信额度为人民币 12,000 万元， 期限为自 2025 年 7 月 16 日至 2028 年 7 月 28 日，博敏电子股份有限公司（以下 简称" ...

Mergers and Acquisitions - Dajia Weikang plans to acquire 60.85% equity of Anhui Dajia Weikang Health Pharmacy for a transaction price of 116 million yuan, making it a subsidiary post-transaction [1] - Jizhong Energy intends to purchase 49% equity of Jingneng Xilin Gol Energy for 669 million yuan, with the target company having a construction scale of 2×660MW efficient supercritical indirect air-cooled units [2] - Bomin Electronics has terminated its acquisition plan for Benchuang Electronics due to failure to reach consensus on key transaction terms [3] Shareholding Changes - Jingbeifang's employee shareholding platform plans to reduce its stake by up to 3% of the company's total shares, equating to a maximum of 26 million shares [4] - Sichuan Shuangma's major shareholders plan to collectively reduce their holdings by up to 2.92% of the company's total shares, amounting to approximately 1.11 million shares [5] - Chenghe Technology's shareholder, Shanghai Kehui Investment, intends to reduce its stake by up to 3% of the company's total shares, which is approximately 564,960 shares [6] Earnings Disclosure - China Merchants Heavy Industry expects a significant decline in net profit attributable to shareholders, projecting a decrease of 90.16% to 91.95%, with an estimated profit of 9 million to 11 million yuan [7] - Dongpeng Beverage anticipates a net profit increase of 33.48% to 41.57%, estimating a profit range of 2.31 billion to 2.45 billion yuan for the first half of 2025 [8] - Shuanglu Pharmaceutical forecasts a substantial net profit growth of 237.95% to 356.24%, estimating a profit of 100 million to 135 million yuan for the first half of 2025, primarily due to changes in the fair value of financial assets [10]

Core Viewpoint - Bomin Electronics has terminated its acquisition of Benchuang Electronics due to the inability to reach consensus on key transaction terms, and will recover the 28 million yuan deposit along with interest [1][5][6]. Group 1: Acquisition Details - The acquisition plan was initiated on September 20, 2024, with a proposed cash purchase of up to 250 million yuan for 86.8535% of Benchuang Electronics [3]. - The goal of the acquisition was to enhance procurement efficiency and quality through resource integration [1][5]. - Despite the potential synergies due to Benchuang's HDI technology and capacity, negotiations lasted 10 months without reaching a formal agreement [5]. Group 2: Financial Implications - Bomin Electronics will recover the 28 million yuan deposit and interest within 30 days following the termination agreement [6]. - The termination of the acquisition is not expected to adversely affect the company's normal operations or financial status [5]. Group 3: Company Performance - In Q1 2025, Bomin Electronics reported revenue of 823 million yuan, a year-on-year increase of 14.38%, and a net profit of 27.33 million yuan, up 4.53% [7]. - The company aims to continue its strategic goals and diversify its product offerings despite the acquisition's termination [7]. - As of July 11, Bomin Electronics' stock closed at 9.95 yuan per share, reflecting a decline of 5.6%, with a market capitalization of 6.272 billion yuan [7].