芯联集成电路制造股份有限公司（以下简称"公司"）第一届董事会第二十 三次会议于 2024 年 6 月 4 日以现场结合通讯的方式召开。会议通知于 2024 年 5 月 30 日向全体董事发出。会议应出席董事 9 人，实际出席董事 9 人，会议由董 事长丁国兴先生主持。会议的召集和召开符合《中华人民共和国公司法》等法律 法规和《公司章程》的有关规定。 二、董事会会议审议表决情况 1、审议通过了《关于向激励对象首次授予限制性股票的议案》 经审议，公司 2023 年年度股东大会已批准实施公司 2024 年限制性股票激励 计划，并授权董事会具体办理本次限制性股票激励计划相关事宜。根据股东大会 的批准和授权，董事会认为公司本次激励计划规定的首次授予条件已经成就，同 意以 2024 年 6 月 4 日为首次授予日，向符合首次授予条件的 763 名激励对象授 予 9,166.40 万股第二类限制性股票。 证券代码：688469 证券简称：芯联集成 公告编号：2024-044 芯联集成电路制造股份有限公司 第一届董事会第二十三次会议决议公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-043 芯联集成电路制造股份有限公司 关于变更公司注册资本并修订《公司章程》 及授权办理工商变更登记的公告 一、变更公司注册资本的相关情况 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 芯联集成电路制造股份有限公司（以下简称"公司"）于 2024 年 6 月 4 日召开第一届董事会第二十三次会议，审议通过了《关于变更公司注册资 本并修订<公司章程>及授权办理工商变更登记的议案》，该议案尚需提交 公司股东大会审议。现将相关情况公告如下： 2023 年 9 月 7 日，公司第一期股票期权激励计划第一个行权期第一次 行权新增股份在中国证券登记结算有限责任公司上海分公司完成登记。本 次行权的激励对象为 358 人，行权股票数量为 20,767,475 股，自行权日起 三年后可上市流通，预计上市流通时间为 2026 年 9 月 7 日（如遇非交易日 则顺延）。行权后，公司总股本由 7,021,800,000 股变更为 7,042,567,475 股 。 上 述 内 容 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-039 芯联集成电路制造股份有限公司 重要内容提示： | 回购方案首次披露日 | 2024/4/15，由董事长丁国兴先生提议 | | --- | --- | | 回购方案实施期限 | 2024/4/13~2025/4/12 | | 预计回购金额 | 万元~40,000 万元 20,000 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 万股 1,778.5585 | | 累计已回购股数占总股本比例 | 0.2524% | | 累计已回购金额 | 万元 7,099.7443 | | 实际回购价格区间 | 元/股~4.08 元/股 3.88 | 一、 回购股份的基本情况 二、 回购股份的进展情况 上述回购进展符合既定的回购股份方案。 关于以集中竞价交易方式回购股份进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 2024 年 4 月 13 ...

Group 1: Business Model and Market Expansion - The company has transitioned to a "one-stop system foundry" model, enhancing flexibility and collaboration with clients [1] - In 2023, the company achieved external sales revenue of 561 million CNY, representing a year-on-year growth of 42.58% [1] - The automotive business has shown significant growth, contributing to the export market, primarily targeting Japan and the USA [1] Group 2: Product Development and Competitive Advantage - The company has developed multiple specialized BCD platforms, focusing on high-demand applications with low domestic replacement ratios [2] - The introduction of consumer-grade BCD technology is expected to contribute to revenue growth due to its high cost-performance ratio [2] - The company aims to leverage its technological advancements in BCD, embedded digital technology, and power devices to capture market share [2] Group 3: Financial Performance and Cost Management - The company aims for significant loss reduction in 2024 through technological innovation and production scale-up [3] - Key strategies include optimizing cost structures and enhancing production efficiency to lower operational costs [3] - The company anticipates achieving profitability by 2026, driven by steady revenue growth and effective cost management [3] Group 4: Localization and Supply Chain Strategy - The company has initiated localization verification for materials and equipment over the past four years [3] - Currently, the company has achieved localization verification for all categories of materials and aims for over 95% localization of equipment by the end of 2024 [3]

二、 回购股份的进展情况 根据《上市公司股份回购规则》《上海证券交易所上市公司自律监管指引第 7 号——回购股份》等相关规定，公司在回购股份期间，应当在首次回购股份事实发 生的次一交易日披露进展情况。 证券代码：688469 证券简称：芯联集成 公告编号：2024-038 芯联集成电路制造股份有限公司 关于以集中竞价交易方式首次回购股份进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/4/15，由董事长丁国兴先生提议 | | --- | --- | | 回购方案实施期限 | 2024/4/13~2025/4/12 | | 预计回购金额 | 万元~40,000 万元 20,000 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 万股 491.8982 | | 累计已回购股数占总股本比例 | 0.0698% | | 累计已回购金额 | 万元 1,999.9993 ...

重要内容提示： 本次行权股票数量：893,850 股，占行权前公司总股本的比例为 0.01%。 证券代码： 688469 证券简称：芯联集成 公告编号：2024-037 芯联集成电路制造股份有限公司 关于第一期股票期权激励计划第一个行权期 第四次行权结果暨股份变动的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误 导性陈述或者重大遗漏，并对其内容的真实性、准确性和完整性依法承 担法律责任。 本次行权股票上市流通时间：本次行权股票自行权日起满三年可上市流通， 预计上市流通时间为 2027 年 5 月 7 日（如遇非交易日则顺延）。 一、本次股票期权行权的决策程序及相关信息披露 芯联集成电路制造股份有限公司（以下简称"公司"）于 2021 年 9 月制定 并实施《绍兴中芯集成电路制造股份有限公司第一期股票期权激励计划》，合计 向 568 名激励对象授予 6800 万份股票期权，行权价格为 2.78 元/股。 1、2021 年 9 月 13 日，公司召开第一届董事会第三次会议并形成董事会决 议，审议通过了《关于公司第一期股票期权激励计划的议案》等与本次激励计划 相关的议案。同日，公司召开第一届监事会 ...

证券代码：688469 证券简称：芯联集成 公告编号：2024-036 芯联集成电路制造股份有限公司 关于以集中竞价交易方式回购股份进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈 述或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： | 回购方案首次披露日 | 2024/4/15，由董事长丁国兴先生提议 | | --- | --- | | 回购方案实施期限 | 2024/4/13~2025/4/12 | | 预计回购金额 | 万元~40,000 万元 20,000 | | 回购用途 | □减少注册资本 √用于员工持股计划或股权激励 | | | □用于转换公司可转债 | | | □为维护公司价值及股东权益 | | 累计已回购股数 | 万股 0 | | 累计已回购股数占总股本比例 | 0% | | 累计已回购金额 | 万元 0 | | 实际回购价格区间 | 元/股~0 元/股 0 | 一、 回购股份的基本情况 2024 年 4 月 13 日，公司召开第一届董事会第二十一次会议，审议通过了《关 于以集中竞价交易方式回购公司股份方案的议案》，同意公司以自有资金通 ...

Group 1: Financial Performance - In Q1 2024, the company achieved operating revenue of 1.353 billion RMB, a year-on-year increase of 17.2% [1] - The net profit attributable to shareholders was -242 million RMB, a significant reduction in losses by 257 million RMB year-on-year [1] - Operating cash flow reached 306 million RMB, up 40.68% year-on-year [1] - EBITDA for the quarter was 482 million RMB, representing a 112% increase year-on-year [1] Group 2: Market and Product Development - The company experienced a recovery in market demand, with production line utilization steadily increasing [1] - The installation volume of vehicle power modules grew over 8 times year-on-year, with nearly 280,000 units installed, ranking fourth in the industry [2] - The company is a leading domestic producer of SiC MOSFETs, with significant breakthroughs in new generation IGBT chips and various SiC products entering mass production [2] - The consumer electronics market showed signs of recovery, with revenue from consumer business doubling year-on-year [2] Group 3: Research and Development - R&D expenses for Q1 2024 were 470 million RMB, a year-on-year increase of 36.32%, accounting for 34.75% of operating revenue [2] - The company introduced over 50 new clients in Q1, covering major automotive manufacturers and leading companies in the wind and solar storage sectors [5] - The company plans to enhance its R&D efforts in high-voltage, high-current BCD technology and SiC MOSFETs to meet growing market demands [5] Group 4: Strategic Goals and Future Outlook - The company aims to achieve significant loss reduction in 2024 through technology iteration and cost optimization [4] - By 2026, the company targets an operating revenue of approximately 10 billion RMB, with a focus on achieving overall breakeven [4] - The company anticipates maintaining over 60% annual growth in its SiC business over the next two years [6]

芯联集成电路制造股份有限公司（以下简称"公司"）已于 2024 年 4 月 30 日披露公司《2024 年第一季度报告》，为便于广大投资者更全面深入地了解公 司 2024 年第一季度经营成果、财务状况、发展战略等情况，公司定于 2024 年 5 月 9 日（星期四）15:00-16:30 在"价值在线"（www.ir-online.cn）举办芯联 集成电路制造股份有限公司 2024 年第一季度业绩说明会，与投资者进行沟通和 交流，广泛听取投资者的意见和建议。 证券代码：688469 证券简称：芯联集成 公告编号：2024-034 芯联集成电路制造股份有限公司 关于召开 2024 年第一季度业绩说明会的公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或者 重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 一、说明会类型 本次投资者说明会以网络互动形式召开，公司将针对 2024 年第一季度的经 会议召开时间：2024 年 5 月 9 日（星期四）15:00-16:30 会议召开地点：价值在线（www.ir-online.cn） 会议召开方式：网络互动方式 投资者 ...

Financial Performance - The company's operating revenue for Q1 2024 was ¥1,352,995,972.16, representing a year-on-year increase of 17.19%[4] - The net profit attributable to shareholders was -¥242,117,693.08, indicating a loss compared to the previous year[4] - EBITDA for the quarter reached ¥481,619,248.91, a significant increase of 111.97% due to rising market demand and cost control measures[5] - The net loss for Q1 2024 was ¥650,028,206.01, worsening from a net loss of ¥620,302,243.50 in Q1 2023[18] - Total operating revenue for Q1 2024 reached ¥1,352,995,972.16, an increase from ¥1,154,539,275.25 in Q1 2023, representing a growth of approximately 17.2%[17] - Total operating costs for Q1 2024 were ¥2,039,548,677.57, up from ¥1,594,028,971.57 in Q1 2023, indicating an increase of about 28.0%[17] Cash Flow and Liquidity - The net cash flow from operating activities increased by 40.68% to ¥306,117,266.28, attributed to enhanced market position and government subsidies[7] - Cash inflow from operating activities totaled approximately RMB 1.64 billion, slightly down from RMB 1.67 billion in the same period last year[20] - Net cash outflow from operating activities was RMB 1.33 billion, compared to RMB 1.45 billion in Q1 2023[21] - The company experienced a net cash inflow from financing activities of approximately RMB 3.78 billion, up from RMB 2.34 billion in Q1 2023[22] - The cash and cash equivalents at the end of Q1 2024 amounted to approximately RMB 5.76 billion, significantly higher than RMB 1.69 billion at the end of Q1 2023[22] Assets and Liabilities - Total assets at the end of the reporting period were ¥34,947,660,076.07, up 10.70% from the end of the previous year[5] - The total assets as of Q1 2024 were ¥34,947,660,076.07, compared to ¥31,570,366,445.66 in Q1 2023, showing an increase of about 10.5%[16] - Total liabilities for Q1 2024 were ¥18,776,856,382.87, up from ¥15,721,987,469.96 in Q1 2023, representing an increase of approximately 19.0%[16] - Long-term borrowings increased to ¥9,923,668,814.92 in Q1 2024 from ¥6,718,717,801.43 in Q1 2023, marking a significant rise of approximately 47.0%[16] Research and Development - R&D investment totaled ¥470,149,903.00, accounting for 34.75% of operating revenue, an increase of 4.88 percentage points year-on-year[5] - R&D expenses in Q1 2024 amounted to ¥470,149,903.00, compared to ¥344,876,451.72 in Q1 2023, reflecting a rise of approximately 36.4%[17] Shareholder and Equity Information - The total number of ordinary shareholders at the end of the reporting period was 188,533, with the top ten shareholders holding significant stakes[8] - The company has established relationships with several major shareholders, including Zhang Yuejun and Goldman Sachs, with significant holdings in ordinary shares[10] - The company's equity totaled ¥16,170,803,693.20 in Q1 2024, compared to ¥15,848,378,975.70 in Q1 2023, indicating a growth of about 2.0%[16] Strategic Initiatives - The company introduced new products in the automotive sector, including high-voltage BCD and IGBT chips, which have begun mass production[7] - The company added over 50 new clients during the reporting period, covering various industries including automotive and renewable energy[7] - The company plans to repurchase shares with a total amount not less than RMB 200 million and not exceeding RMB 400 million, with a repurchase price capped at RMB 7 per share[11] - The company has set ambitious performance targets for its 2024 restricted stock incentive plan, aiming for a cumulative revenue growth rate of 60% for the first vesting period[12] - The first vesting period's revenue growth target is based on the average revenue from 2021 to 2023, with subsequent periods targeting 254% and 508% growth respectively[12] - The company is focused on enhancing employee engagement through stock repurchase and incentive plans, aligning interests between shareholders and employees[11] - The company disclosed that it has no significant changes in the lending or borrowing of shares among major shareholders[10] - The company is committed to maintaining transparency and will provide timely updates on the progress of its share repurchase and incentive plans[11] Other Financial Metrics - The company reported non-recurring gains of ¥56,470,389.90, primarily from government subsidies and other income[6] - The company reported a decrease in cash and cash equivalents, with short-term borrowings at ¥2,261,845,611.91, down from ¥2,596,241,971.10 in Q1 2023, a decline of about 12.9%[16] - Deferred income for Q1 2024 was recorded at ¥856,750,585.06, an increase from ¥665,117,481.87 in Q1 2023, reflecting a growth of approximately 28.8%[16] - The company reported a significant increase in cash received from customers, totaling approximately RMB 1.28 billion, compared to RMB 1.43 billion in Q1 2023[20] - The company’s total tax payments in Q1 2024 were approximately RMB 450 million, compared to RMB 57 million in the same period last year[21]