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和林微纳(688661) - 关于拟购买土地使用权并投资建设项目的公告
2026-01-05 10:45
苏州和林微纳科技股份有限公司 关于拟购买土地使用权并投资建设项目的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏,并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提醒: 本次投资事项已经 2026 年 1 月 5 日召开的第三届董事会第六次会议审议通 过,待股东会审议通过后生效。本次交易不构成关联交易,亦不构成《上市公司 重大资产重组管理办法》所规定的重大资产重组情形。 "和林微纳手机光学镜头组件及半导体封测业务扩产项目"为 Mems 光学精 微零组件业务及半导体芯片 FT 测试探针业务,以上项目为公司已有业务不涉及 开展新业务。 证券代码:688661 证券简称:和林微纳 编号:2026-001 相关风险提示: 1、本次拟购买土地使用权事项尚需通过公开竞拍方式进行,竞拍成功后公 司还需与交易对手方苏州市自然资源和规划局签署《国有建设用地使用权出让合 同》,土地使用权能否竞得、土地使用权的最终成交价格及取得时间尚存在不确 定性。 2、本投资建设项目的实施,尚需向政府有关主管部门办理项目备案、环评 审批、建设规划许可、施工许可等前置审批工作,如因国家或地方有 ...
和林微纳:拟开展“和林微纳手机光学镜头组件及半导体封测业务扩产项目”
Ge Long Hui· 2026-01-05 10:45
Core Viewpoint - The company, Helin Micro-Nano (688661.SH), has approved a proposal to purchase land use rights and invest in the expansion of its MEMS optical micro-components and semiconductor testing business, pending shareholder approval [1] Group 1: Project Details - The expansion project aims to enhance the production capacity and market competitiveness of MEMS optical micro-components and semiconductor testing probes to meet increasing market demand [1] - The project is strategically located at the intersection of Kunlun Mountain Road North and Jinsha River Road East, providing easy access to major transportation routes for raw material procurement, product transportation, and talent acquisition [1] - The project will cover an area of approximately 50 acres with a total construction area of about 91,493.48 square meters, and will be executed in three phases: preparation, main construction, and equipment installation and trial production [1] Group 2: Investment and Implementation - The company plans to implement the project using a self-built model, allowing for flexibility and sustainability based on market demand and funding availability [1] - The total investment for the project is capped at 760.5 million yuan [1]
和林微纳股价涨5.02%,广发基金旗下1只基金重仓,持有8328股浮盈赚取2.17万元
Xin Lang Cai Jing· 2026-01-05 02:25
Group 1 - The core viewpoint of the news is that He Lin Wei Na's stock price increased by 5.02% to 54.36 CNY per share, with a total market capitalization of 8.257 billion CNY as of January 5 [1] - He Lin Wei Na Technology Co., Ltd. specializes in the research, design, production, and sales of micro-precision electronic components and devices, with its main revenue sources being precision structural parts (44.34%), semiconductor chip test probes (32.73%), micro-shielding covers (15.36%), and others [1] - The company was established on June 18, 2012, and went public on March 29, 2021 [1] Group 2 - According to data, Guangfa Fund holds a significant position in He Lin Wei Na, with Guangfa CSI 2000 ETF (560220) owning 8,328 shares, representing 0.65% of the fund's net value, making it the fourth-largest holding [2] - The Guangfa CSI 2000 ETF has achieved a return of 40.27% this year, ranking 1066 out of 4189 in its category [2] - The fund was established on September 8, 2023, with a total size of 66.3294 million CNY [2] Group 3 - The fund manager of Guangfa CSI 2000 ETF is Xia Haoyang, who has been in the position for 4 years and 232 days, managing assets totaling 15.223 billion CNY [3] - During Xia Haoyang's tenure, the best fund return was 84.99%, while the worst was -28.15% [3]
2026年中国MEMS微纳米制造零部件行业产业链、市场规模、竞争格局及发展趋势研判:随着MEMS技术在多个领域加速渗透,市场规模有望达到77亿元[图]
Chan Ye Xin Xi Wang· 2026-01-03 02:50
Core Insights - The MEMS micro-nano manufacturing components industry is experiencing rapid growth due to increased penetration in consumer electronics, automotive electronics, industrial automation, and healthcare sectors, with the global market expected to reach 7.3 billion yuan by 2025 and 7.7 billion yuan by 2026 [1][5][10] Industry Definition and Classification - MEMS (Micro-Electro-Mechanical Systems) combines electronic and mechanical technologies to create devices at micro or nano scales, enabling smart and integrated systems [2][3] - Key components include sensors, acoustic modules, optical modules, pressure sensors, and inertial sensors, characterized by miniaturization, integration, and mass production [3][4] Current Industry Status - The MEMS micro-nano manufacturing components market is expanding, driven by technological advancements and increasing demand for miniaturized and intelligent devices [4][5] - The largest segment within this market is sensors, followed by acoustic modules, with significant growth projected in various subcategories [5] Industry Chain - The upstream of the MEMS industry includes high-grade metals, silicon-based materials, polymers, and precision equipment, with high technical barriers and reliance on imports for some high-end materials [6] - The midstream focuses on the production of MEMS components, characterized by high technology barriers and added value [6] - The downstream applications span aerospace, automotive, biomedical, and consumer electronics sectors [6] Competitive Landscape - The MEMS micro-nano manufacturing components market in China is primarily dominated by foreign companies, with domestic firms accelerating their efforts to replace imports and enhance core technologies [7] - Key players include AAC Technologies, Huazhong University of Science and Technology, Goertek, and others, with ongoing advancements in various segments [7][8] Development Trends - The MEMS industry is evolving towards micro-nano precision manufacturing of integrated functional components, emphasizing miniaturization, integration, and mass production [9][10] - Future growth is anticipated as technological advancements lower production costs and expand applications across various sectors, including IoT, consumer electronics, and automotive industries [10]
328只科创板股融资余额环比增加
Zheng Quan Shi Bao Wang· 2025-12-24 01:59
| 688135 | 利扬 | 22576.92 | 11.14 | 0.00 | | 0.96 | | --- | --- | --- | --- | --- | --- | --- | | | 芯片 | | | | | | | 688150 | 莱特 | 31931.18 | 11.08 | 157.65 | 29.33 | 0.83 | | | 光电 | | | | | | | 688629 | 华丰 | 112440.72 | 10.23 | 377.00 | 125.88 | 14.27 | | | 科技 | | | | | | | 688290 | 景业 智能 | 25501.99 | 10.14 | 26.00 | -11.64 | -7.80 | | | 德科 | | | | | | | 688205 | 立 | 112346.95 | 9.84 | 172.30 | 31.46 | 2.52 | | 688651 | 盛邦 安全 | 1 1136.94 | 9.38 | 0.00 | | -4.78 | | 68831 1 | 盟升 电子 | 19413.49 | 8.99 | 0.00 | ...
今日143只个股突破五日均线
Zheng Quan Shi Bao Wang· 2025-12-23 06:34
Group 1 - The Shanghai Composite Index closed at 3919.67 points, above the five-day moving average, with a slight increase of 0.06% [1] - The total trading volume of A-shares reached 156.62 billion yuan [1] - A total of 143 A-shares have surpassed the five-day moving average, with notable stocks including Suzhou Tianmai, Guofeng New Materials, and Fuxin Technology, showing significant deviation rates of 12.16%, 8.29%, and 8.28% respectively [1] Group 2 - The top stocks with the highest deviation rates from the five-day moving average include: - Suzhou Tianmai (16.63% increase, 12.16% deviation) - Guofeng New Materials (10.00% increase, 8.29% deviation) - Fuxin Technology (11.27% increase, 8.28% deviation) [1] - Other notable stocks with significant increases and their respective deviation rates include: - Xunxing Co., Ltd. (9.97% increase, 7.56% deviation) - Huasheng Lithium (11.73% increase, 7.47% deviation) - Penghui Energy (8.51% increase, 5.93% deviation) [1]
和林微纳最新股东户数环比下降6.78% 筹码趋向集中
Zheng Quan Shi Bao Wang· 2025-12-22 14:11
和林微纳12月22日披露,截至12月20日公司股东户数为8045户,较上期(12月10日)减少585户,环比 降幅为6.78%。 证券时报·数据宝统计,截至发稿,和林微纳收盘价为52.49元,上涨1.94%,本期筹码集中以来股价累 计下跌1.80%。具体到各交易日,4次上涨,4次下跌。 融资融券数据显示,该股最新(12月19日)两融余额为2.02亿元,其中,融资余额为2.02亿元,本期筹 码集中以来融资余额合计减少5683.10万元,降幅为21.95%。 公司发布的三季报数据显示,前三季公司共实现营业收入6.79亿元,同比增长81.77%,实现净利润 3677.99万元,同比增长447.10%,基本每股收益为0.2422元,加权平均净资产收益率3.01%。(数据 宝) (文章来源:证券时报网) ...
和林微纳:截至2025年12月10日公司股东数为8630户
Zheng Quan Ri Bao Wang· 2025-12-22 11:40
证券日报网讯12月22日,和林微纳在互动平台回答投资者提问时表示,截至2025年12月10日,公司股东 数为8630户。 ...
公司问答丨和林微纳:公司所属半导体芯片测试探针主要应用于中高端制程芯片测试
Ge Long Hui A P P· 2025-12-22 10:17
Core Viewpoint - The company, Helin Weina, is engaged in the semiconductor chip testing probe industry, focusing on high-end process chip testing, particularly for high pin count, high current, and high frequency characteristics [1] Group 1 - The company has been asked by investors about its application in HBM (High Bandwidth Memory) chip production processes [1] - Helin Weina confirmed that its semiconductor chip testing probes are primarily used for mid-to-high-end process chip testing [1] - The company is currently inquiring about whether it has received bulk equipment orders [1]
和林微纳:第三届董事会第五次会议决议
Zheng Quan Ri Bao Wang· 2025-12-18 14:12
Core Points - Helin Micro-Nano announced the approval of two proposals during the fifth meeting of its third board of directors on December 18 [1] - The first proposal involves the conclusion of certain fundraising projects and the permanent allocation of surplus raised funds to supplement working capital [1] - The second proposal pertains to the establishment of a compensation management system for directors and senior management [1]