与会董事经过认真审议，通过了以下议案： 证券代码：002636 证券简称：金安国纪 公告编号：2025-052 金 安 国纪 集团 股 份有 限公 司 金安国纪集团股份有限公司 第六届董事会第九次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误 导性陈述或重大遗漏。 一、董事会会议召开情况 金安国纪集团股份有限公司（以下简称"公司"）第六届董事会第九次会议 于2025年7月31日在上海以现场结合通讯表决的形式召开，为提高决策效率，全 体董事一致同意豁免本次会议通知时限，会议通知于会议召开当日以通讯或口头 形式发出。应参加董事九名，实参加董事九名，会议由董事长韩涛先生主持。本 次会议的召集、召开符合《公司法》和《公司章程》的规定。 二、董事会会议审议情况 议案一：《关于签订 <业绩承诺补偿协议> 的补充协议的议案》 二〇二五年八月二日 表决结果：赞成票 9 票，反对票 0 票，弃权票 0 票。 。 同意公司与朱晓东及杭州富坤电子有限公司签订的《 <业绩承诺补偿协议> 的补充协议》 详细内容请参见巨潮资讯网（http://www.cninfo.com.cn）。 三、备查文件 ...

证券日报网讯 8月1日晚间，金安国纪发布公告称，公司第六届董事会第九次会议审议通过了《关于签 订<业绩承诺补偿协议> 的补充协议的议案》。 （文章来源：证券日报） ...

金安国纪集团股份有限公司 关于出售控股子公司股权的进展公告 证券代码：002636 证券简称：金安国纪 公告编号：2025-053 金安国纪集团股份有限公司 关于出售控股子公司股权的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误 导性陈述或重大遗漏。 一、交易概述 金安国纪集团股份有限公司（以下简称"公司"）于 2025 年 2 月 28 日、3 月 17 日召开了第六届董事会第四次会议及 2025 年第一次临时股东大会，审议通 过了《关于拟出售控股子公司股权的议案》，同意公司在上海联合产权交易所或 同类型交易平台通过公开挂牌竞价的方式，出售所持控股子公司上海金板科技有 限公司（以下简称"上海金板"）60%的股权（以下简称"标的股权"），以评 估价人民币 12,666.018 万元为首次挂牌价、并将根据上海联合产权交易所或同类 型交易平台的规则调整挂牌价格，最终交易价格以公开挂牌后竞价的结果为准。 股东大会授权公司管理层全权办理本次交易相关事宜，包括但不限于制定及调整 本次公开挂牌出售的具体方案(含挂牌价格)、签署交易协议、办理产权过户手续、 根据挂牌情况决定继续或终止挂 ...

证券代码：002636 证券简称：金安国纪 公告编号：2025-052 金 安 国 纪 集 团 股 份 有 限 公 司 金安国纪集团股份有限公司 第六届董事会第九次会议决议公告 议案一：《关于签订<业绩承诺补偿协议>的补充协议的议案》 表决结果：赞成票 9 票，反对票 0 票，弃权票 0 票。 同意公司与朱晓东及杭州富坤电子有限公司签订的《<业绩承诺补偿协议> 的补充协议》。 详细内容请参见巨潮资讯网（http://www.cninfo.com.cn）。 三、备查文件 第六届董事会第九次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误 导性陈述或重大遗漏。 一、董事会会议召开情况 金安国纪集团股份有限公司（以下简称"公司"）第六届董事会第九次会议 于2025年7月31日在上海以现场结合通讯表决的形式召开，为提高决策效率，全 体董事一致同意豁免本次会议通知时限，会议通知于会议召开当日以通讯或口头 形式发出。应参加董事九名，实参加董事九名，会议由董事长韩涛先生主持。本 次会议的召集、召开符合《公司法》和《公司章程》的规定。 二、董事会会议审议情况 与会董事经过认真审议，通过 ...

证券日报网讯金安国纪7月31日在互动平台回答投资者提问时表示，公司的主要产品覆铜板是电子行业 的基础材料，主要客户为PCB工厂，目前没有直接供货给英伟达。 （文章来源：证券日报） ...

Group 1 - The core product of the company, copper-clad laminates, is a fundamental material in the electronics industry [1] - The main customers of the company are PCB factories [1] - The company does not supply directly to Nvidia [1]

Core Insights - The company Jin'an Guoji stated that its main product, copper-clad laminates, is a fundamental material in the electronics industry, primarily serving PCB factories [1] - Currently, the company does not supply directly to Nvidia [1]

Group 1 - The core product of the company, copper-clad laminates, is a fundamental material in the electronics industry [1] - The main customers of the company are PCB factories [1] - The company does not supply products directly to Nvidia [1]

Core Viewpoint - The PCB market is experiencing a structural transformation driven by the demand for high-end products, particularly in AI-related applications, leading to a significant increase in both demand and prices for high-end PCBs [1][3][4]. Group 1: Market Conditions - The current PCB market is characterized by a shortage of high-end products and pressure on low-end products, with overall market conditions improving compared to last year [1][2]. - Many PCB companies have reported positive earnings forecasts for the first half of the year, with some companies experiencing significant growth, such as a 3.7 times increase in net profit for certain firms [2][3]. - The demand for high-end PCBs is being driven by the rapid growth of AI server hardware, which requires advanced PCB technologies [3][9]. Group 2: Company Performance - Major companies like Pengding Holdings and Huadian Electronics are seeing substantial increases in net profits, with expected growth rates exceeding 40% year-on-year [3][6]. - Companies involved in the production of electronic-grade fiberglass and copper-clad laminates are also reporting significant increases in sales and profitability due to rising demand [2][6]. - The overall order saturation for PCB manufacturers is reported to be over 90%, indicating strong market demand [6][7]. Group 3: Future Projections - The global PCB market is projected to grow significantly, with estimates suggesting a market value of $78.6 billion by 2025, driven by advancements in AI and high-performance computing [4][8]. - The demand for high-layer and high-density interconnect (HDI) boards is expected to grow at rates of 14.2% and 18.5%, respectively, indicating a shift towards more complex PCB designs [8][10]. - The industry is likely to face challenges related to potential overcapacity as more companies announce expansion plans to meet the surging demand for high-end PCBs [10][12]. Group 4: Technological Advancements - The shift towards high-end PCBs is accompanied by increased technical barriers, with only a few manufacturers capable of producing advanced PCBs that meet the requirements of AI servers and high-speed data transmission [9][11]. - Companies are investing heavily in new technologies and production capabilities to meet the evolving demands of the market, including investments in low-loss materials and advanced manufacturing processes [5][10]. - The regulatory environment is also pushing companies to focus on high-quality production and green manufacturing practices, further raising the competitive bar in the industry [11][12].

Industry Overview - The high-frequency copper clad laminate (HFCCL) industry in China is experiencing rapid growth, driven by increasing demand in sectors such as 5G base station construction, autonomous driving millimeter-wave radar, and satellite navigation [1][13] - The market size of the HFCCL industry is projected to grow from 950 million yuan in 2017 to 4.334 billion yuan in 2024, with a compound annual growth rate (CAGR) of 24.21% [1][13] - HFCCL is essential for 5G communication due to its low dielectric constant and low dielectric loss, making it a key material for base station antennas and RF modules [1][11] Industry Chain - The upstream of the HFCCL industry includes raw materials such as copper foil, resin, fiberglass cloth, and silica powder, with copper foil being critical for signal transmission efficiency [7][9] - The midstream involves the manufacturing of HFCCL, while the downstream applications span across 5G communication, wireless networks, and automotive radar [7] Key Companies - Leading companies in the HFCCL industry include Shengyi Technology, Zhongying Technology, and Huazheng New Materials, which leverage their technological expertise and manufacturing scale to drive industry development [16] - Other notable companies include Nanya New Materials, Jinan Guoji, and Baoding Technology, which focus on niche markets and product differentiation [16] Market Trends - The HFCCL industry is moving towards miniaturization, with demands for smaller sizes and thinner thicknesses driven by 5G millimeter-wave communication and consumer electronics [23] - There is a trend towards higher-layer structures, evolving to more than 16 layers to meet the complex interconnection needs of high-performance computing and AI chips [24] - Flexibility is becoming a key focus, with innovations in bendable materials to cater to the growing market for wearable devices and flexible displays [26] - The integration of smart technologies is also on the rise, with HFCCL incorporating passive components and sensors for enhanced functionality [27]