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金安国纪(002636) - 关于出售控股子公司股权的进展公告
2025-08-01 09:15
金安国纪集团股份有限公司 关于出售控股子公司股权的进展公告 证券代码:002636 证券简称:金安国纪 公告编号:2025-053 金安国纪集团股份有限公司 关于出售控股子公司股权的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记载、误 导性陈述或重大遗漏。 一、交易概述 金安国纪集团股份有限公司(以下简称"公司")于 2025 年 2 月 28 日、3 月 17 日召开了第六届董事会第四次会议及 2025 年第一次临时股东大会,审议通 过了《关于拟出售控股子公司股权的议案》,同意公司在上海联合产权交易所或 同类型交易平台通过公开挂牌竞价的方式,出售所持控股子公司上海金板科技有 限公司(以下简称"上海金板")60%的股权(以下简称"标的股权"),以评 估价人民币 12,666.018 万元为首次挂牌价、并将根据上海联合产权交易所或同类 型交易平台的规则调整挂牌价格,最终交易价格以公开挂牌后竞价的结果为准。 股东大会授权公司管理层全权办理本次交易相关事宜,包括但不限于制定及调整 本次公开挂牌出售的具体方案(含挂牌价格)、签署交易协议、办理产权过户手续、 根据挂牌情况决定继续或终止挂 ...
金安国纪(002636) - 第六届董事会第九次会议决议公告
2025-08-01 09:15
证券代码:002636 证券简称:金安国纪 公告编号:2025-052 金 安 国 纪 集 团 股 份 有 限 公 司 金安国纪集团股份有限公司 第六届董事会第九次会议决议公告 议案一:《关于签订<业绩承诺补偿协议>的补充协议的议案》 表决结果:赞成票 9 票,反对票 0 票,弃权票 0 票。 同意公司与朱晓东及杭州富坤电子有限公司签订的《<业绩承诺补偿协议> 的补充协议》。 详细内容请参见巨潮资讯网(http://www.cninfo.com.cn)。 三、备查文件 第六届董事会第九次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记载、误 导性陈述或重大遗漏。 一、董事会会议召开情况 金安国纪集团股份有限公司(以下简称"公司")第六届董事会第九次会议 于2025年7月31日在上海以现场结合通讯表决的形式召开,为提高决策效率,全 体董事一致同意豁免本次会议通知时限,会议通知于会议召开当日以通讯或口头 形式发出。应参加董事九名,实参加董事九名,会议由董事长韩涛先生主持。本 次会议的召集、召开符合《公司法》和《公司章程》的规定。 二、董事会会议审议情况 与会董事经过认真审议,通过 ...
金安国纪(002636.SZ):目前没有直接供货给英伟达
Ge Long Hui· 2025-07-31 07:12
格隆汇7月31日丨金安国纪(002636.SZ)在互动平台表示,公司的主要产品覆铜板是电子行业的基础材 料,主要客户为PCB工厂,目前没有直接供货给英伟达。 ...
金安国纪:目前没有直接供货给英伟达
Xin Lang Cai Jing· 2025-07-31 04:13
金安国纪7月31日在互动平台上表示,公司的主要产品覆铜板是电子行业的基础材料,主要客户为PCB 工厂,目前没有直接供货给英伟达。 ...
金安国纪:公司主要客户为PCB工厂 没有直接供货给英伟达
Zheng Quan Shi Bao Wang· 2025-07-31 03:57
Group 1 - The core product of the company, copper-clad laminates, is a fundamental material in the electronics industry [1] - The main customers of the company are PCB factories [1] - The company does not supply products directly to Nvidia [1]
AI硬件升级引爆高端PCB需求
财联社· 2025-07-29 14:35
Core Viewpoint - The PCB market is experiencing a structural transformation driven by the demand for high-end products, particularly in AI-related applications, leading to a significant increase in both demand and prices for high-end PCBs [1][3][4]. Group 1: Market Conditions - The current PCB market is characterized by a shortage of high-end products and pressure on low-end products, with overall market conditions improving compared to last year [1][2]. - Many PCB companies have reported positive earnings forecasts for the first half of the year, with some companies experiencing significant growth, such as a 3.7 times increase in net profit for certain firms [2][3]. - The demand for high-end PCBs is being driven by the rapid growth of AI server hardware, which requires advanced PCB technologies [3][9]. Group 2: Company Performance - Major companies like Pengding Holdings and Huadian Electronics are seeing substantial increases in net profits, with expected growth rates exceeding 40% year-on-year [3][6]. - Companies involved in the production of electronic-grade fiberglass and copper-clad laminates are also reporting significant increases in sales and profitability due to rising demand [2][6]. - The overall order saturation for PCB manufacturers is reported to be over 90%, indicating strong market demand [6][7]. Group 3: Future Projections - The global PCB market is projected to grow significantly, with estimates suggesting a market value of $78.6 billion by 2025, driven by advancements in AI and high-performance computing [4][8]. - The demand for high-layer and high-density interconnect (HDI) boards is expected to grow at rates of 14.2% and 18.5%, respectively, indicating a shift towards more complex PCB designs [8][10]. - The industry is likely to face challenges related to potential overcapacity as more companies announce expansion plans to meet the surging demand for high-end PCBs [10][12]. Group 4: Technological Advancements - The shift towards high-end PCBs is accompanied by increased technical barriers, with only a few manufacturers capable of producing advanced PCBs that meet the requirements of AI servers and high-speed data transmission [9][11]. - Companies are investing heavily in new technologies and production capabilities to meet the evolving demands of the market, including investments in low-loss materials and advanced manufacturing processes [5][10]. - The regulatory environment is also pushing companies to focus on high-quality production and green manufacturing practices, further raising the competitive bar in the industry [11][12].
研判2025!中国高频覆铜板行业制备工艺、产业链、市场规模、重点企业及未来前景展望:下游需求旺盛驱动,高频覆铜板规模达43亿元[图]
Chan Ye Xin Xi Wang· 2025-07-22 01:27
Industry Overview - The high-frequency copper clad laminate (HFCCL) industry in China is experiencing rapid growth, driven by increasing demand in sectors such as 5G base station construction, autonomous driving millimeter-wave radar, and satellite navigation [1][13] - The market size of the HFCCL industry is projected to grow from 950 million yuan in 2017 to 4.334 billion yuan in 2024, with a compound annual growth rate (CAGR) of 24.21% [1][13] - HFCCL is essential for 5G communication due to its low dielectric constant and low dielectric loss, making it a key material for base station antennas and RF modules [1][11] Industry Chain - The upstream of the HFCCL industry includes raw materials such as copper foil, resin, fiberglass cloth, and silica powder, with copper foil being critical for signal transmission efficiency [7][9] - The midstream involves the manufacturing of HFCCL, while the downstream applications span across 5G communication, wireless networks, and automotive radar [7] Key Companies - Leading companies in the HFCCL industry include Shengyi Technology, Zhongying Technology, and Huazheng New Materials, which leverage their technological expertise and manufacturing scale to drive industry development [16] - Other notable companies include Nanya New Materials, Jinan Guoji, and Baoding Technology, which focus on niche markets and product differentiation [16] Market Trends - The HFCCL industry is moving towards miniaturization, with demands for smaller sizes and thinner thicknesses driven by 5G millimeter-wave communication and consumer electronics [23] - There is a trend towards higher-layer structures, evolving to more than 16 layers to meet the complex interconnection needs of high-performance computing and AI chips [24] - Flexibility is becoming a key focus, with innovations in bendable materials to cater to the growing market for wearable devices and flexible displays [26] - The integration of smart technologies is also on the rise, with HFCCL incorporating passive components and sensors for enhanced functionality [27]
8家PCB上市公司披露上半年业绩预告 生益电子预计上半年净利同比最高增超450%
news flash· 2025-07-20 13:19
Core Viewpoint - Eight PCB listed companies have disclosed their performance forecasts for the first half of the year, with significant profit increases expected, particularly for Shengyi Electronics, which anticipates a net profit increase of over 450% year-on-year [1] Group 1: Company Performance Forecasts - Shengyi Electronics expects a net profit of 511 million to 549 million yuan, representing a year-on-year increase of 432% to 471% and a quarter-on-quarter increase of 55.34% to 74.33% [2] - Guanghua Technology forecasts a net profit of 51 million to 58 million yuan, with a year-on-year increase of 375.05% to 440.26% and a quarter-on-quarter increase of 4% to 32% [2] - Pengding Holdings anticipates a net profit of 1.198 billion to 1.26 billion yuan, reflecting a year-on-year increase of 52.79% to 60.62% and a quarter-on-quarter increase of 45.49% to 57.99% [2] - Guanghe Technology expects a net profit of 485 million to 505 million yuan, with a year-on-year increase of 51.85% to 58.12% and a quarter-on-quarter increase of 2.08% to 10.42% [2] - Shengyi Technology forecasts a net profit of 1.4 billion to 1.45 billion yuan, indicating a year-on-year increase of 50% to 56% and a quarter-on-quarter increase of 48.23% to 57.09% [2] - Huadian Co. expects a net profit of 1.65 billion to 1.75 billion yuan, with a year-on-year increase of 44.63% to 53.40% and a quarter-on-quarter increase of 16.54% to 29.66% [2] - Zhongjing Electronics anticipates a net profit of 16 million to 20 million yuan, indicating a turnaround from losses year-on-year and a quarter-on-quarter increase of 28.57% to 85.71% [2] - Jin'an Guoji expects a net profit of 15 million to 22.5 million yuan, with a year-on-year decrease of 67.83% to 78.56% [2]
金安国纪(002636) - 第六届董事会第八次会议决议公告
2025-07-18 09:30
证券代码:002636 证券简称:金安国纪 公告编号:2025-050 金 安 国 纪 集 团 股 份 有 限 公 司 第六届董事会第八次会议决议公告 金安国纪集团股份有限公司 第六届董事会第八次会议决议公告 议案一:《关于调整出售控股子公司股权挂牌价格的议案》 表决结果:赞成票 9 票,反对票 0 票,弃权票 0 票。 董事会同意公司将所持控股子公司上海金板科技有限公司 60%股权转让之 挂牌价格调整为不低于 5,300 万元,重新提交上海联合产权交易所公开挂牌寻觅 受让方。 详细内容请参见巨潮资讯网(http://www.cninfo.com.cn)。 三、备查文件 金安国纪集团股份有限公司(以下简称"公司")第六届董事会第八次会议 通知于2025年7月15日发出,2025年7月18日在上海以现场结合通讯表决的形式召 开。应参加董事九名,实参加董事九名,会议由董事长韩涛先生主持。本次会议 的召集、召开符合《公司法》和《公司章程》的规定。 二、董事会会议审议情况 与会董事经过认真审议,通过了以下议案: 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记载、误 导性陈述或重大遗漏。 一、董事 ...
金安国纪(002636) - 关于调整出售控股子公司股权挂牌价格暨股权转让进展公告
2025-07-18 09:15
金安国纪集团股份有限公司 关于调整出售控股子公司股权挂牌价格暨股权转让进展公告 证券代码:002636 证券简称:金安国纪 公告编号:2025-051 金安国纪集团股份有限公司 关于调整出售控股子公司股权挂牌价格暨股权转让进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有虚假记载、误 导性陈述或重大遗漏。 公司于 2025 年 7 月 9 日召开第六届董事会第七次会议审议通过了《关于调 整出售控股子公司股权挂牌价格的议案》,同意将标的股权转让之挂牌价格调整 为不低于 7,100 万元,重新提交上海联合产权交易所公开挂牌寻觅受让方。具体 内容详见公司于 2025 年 7 月 9 日刊登于巨潮资讯网(www.cninfo.com.cn)上的 相关公告(公告编号:2025-045、2025-046)。 公司于 2025 年 7 月 9 日将标的股权在上海联合产权交易所进行第三次挂牌, 第三次挂牌底价为 7,100 万元,第三次挂牌公告期为五个工作日(即 2025 年 7 月 9 日至 2025 年 7 月 16 日),公告期满未征集到意向受让方的,在不变更信息 披露内容的情况下,按照 5 个工 ...