证券代码：002916 证券简称：深南电路 公告编号：2025-019 深南电路股份有限公司 关于注销非公开发行股票募集资金账户的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 一、募集资金基本情况 经中国证券监督管理委员会《关于核准深南电路股份有限公司非公开发行股 票的批复》（证监许可〔2021〕4151 号）核准，深南电路股份有限公司（以下简 称"公司"）非公开发行人民币普通股 23,694,480 股，共计募集资金总额 2,549,999,937.60 元，扣除与发行有关的费用人民币 20,335,154.66 元，实际募集 资金净额为人民币 2,529,664,782.94 元。 上述募集资金的到位情况已经立信会计师事务所（特殊普通合伙）审验并出 具《深南电路股份有限公司验资报告》（信会师报字[2022]第 ZI10015 号）。公司 募集资金用于下列项目： 单位：万元 | 序号 | 项目名称 | 实施主体 | 项目 总投资 | 拟使用 募集资金 | | --- | --- | --- | --- | --- | | | 高阶倒装芯片用 IC | ...

Group 1: Company Operations and Capacity Utilization - The company's overall business operations are normal, with a comprehensive capacity utilization rate remaining relatively high. The PCB business benefits from sustained demand in computing power and automotive electronics, maintaining high capacity utilization [1] - The packaging substrate business has seen improved demand in the storage sector, with capacity utilization increasing compared to Q4 2024 and Q1 2025 [1] Group 2: Product Development and Project Progress - The company has achieved mass production capability for packaging substrates with up to 20 layers, and the technical development for products with over 20 layers is progressing as scheduled [1] - The Guangzhou packaging substrate project has entered its first phase, with production capacity steadily increasing and batch orders for BT and some FC-BGA products being accepted, although it is still in the early stages of capacity ramp-up [1][2] Group 3: Client Base and Market Position - The packaging substrate business serves a diverse client base, including IDM (Integrated Device Manufacturers), Fabless (semiconductor design companies), and OSAT (Outsourced Semiconductor Assembly and Test) manufacturers [3] Group 4: Expansion Plans and Technological Capabilities - The PCB business is expanding with factories located in Shenzhen, Wuxi, Nantong, and a new facility under construction in Thailand. The company is upgrading existing PCB factories to enhance capacity and is progressing with the Nantong Phase IV project to establish an HDI technology platform [4] - The company’s PCB business utilizes HDI technology, which allows for high-density wiring, primarily applied in communication, data centers, industrial control medical, and automotive electronics sectors [5] Group 5: Investment and Market Strategy - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule. The factory will have capabilities in high-layer and HDI PCB technologies, aiding in expanding overseas market reach [6] Group 6: Raw Material Price Trends - Key raw materials include copper-clad laminates, prepregs, copper foil, gold salts, and inks. In Q1 2025, prices for some raw materials, such as gold salts, increased year-on-year and compared to Q4 2024 due to commodity price fluctuations [7] Group 7: Compliance and Disclosure - The company adhered to the "Information Disclosure Management System" during the research process, ensuring no significant undisclosed information leaks occurred [8]

二、本次实施的利润分配及资本公积金转增股本方案 证券代码：002916 证券简称：深南电路 公告编号：2025-018 深南电路股份有限公司 2024 年年度权益分派实施公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 深南电路股份有限公司（以下简称"公司"），2024 年年度权益分派方案已获 2025 年 4 月 2 日召开的 2024 年年度股东大会审议通过，现将权益分派事宜公告 如下： 一、股东大会审议通过利润分配及资本公积金转增股本方案等情况 1、公司 2024 年年度股东大会审议通过的 2024 年度利润分配预案为：以利 润分配方案未来实施时股权登记日的股本总数为基数，向全体股东每 10 股派现 金人民币 15.00 元（含税）。同时，以资本公积金转增股本，向全体股东每 10 股 转增 3 股，不送股。若在分配方案披露后至实施前发生其他导致股本变动的情 形，公司将按照分配比例固定的原则对分配总额进行调整。 2、本次实施的分配方案与股东大会审议通过的分配方案一致；本分配方案 自披露至实施期间，公司股本总额未发生变化；本次权益分派距离股东大会通过 该 ...

Group 1: Company Operations and Capacity Utilization - The company's overall business operations are normal, with a comprehensive capacity utilization rate remaining relatively high. The PCB business benefits from sustained demand in computing power and automotive electronics, maintaining high capacity utilization [1] - The packaging substrate business has seen an improvement in capacity utilization due to a relative recovery in the storage sector, with increases compared to Q4 2024 and Q1 2025 [1] Group 2: FC-BGA Packaging Substrate Technology and Project Progress - The company has achieved mass production capability for FC-BGA packaging substrates with 20 layers and below, with ongoing sample certification processes. R&D and sampling for products with over 20 layers are progressing as scheduled [1] - The first phase of the Guangzhou packaging substrate project was connected in Q4 2023, with production capacity steadily increasing. The project has begun to receive bulk orders for BT and some FC-BGA products, although it is still in the early stages of capacity ramp-up, impacting profits negatively [1] Group 3: PCB Business Expansion Plans - The PCB business has factories in Shenzhen, Wuxi, Nantong, and a factory under construction in Thailand. The company is enhancing capacity through technological upgrades at existing factories and is advancing the Nantong Phase IV project to establish an HDI technology platform [2] - The company plans to rationally allocate business capacity based on its operational plans and market demand [2] Group 4: Thailand Factory Investment and Business Positioning - The total investment for the Thailand factory is 1.274 billion RMB (approximately equivalent in foreign currency), with basic engineering construction progressing on schedule. The production timeline will depend on future construction progress and market conditions [3] - The Thailand factory will have capabilities in high-layer and HDI PCB technologies, aiding the company in expanding its overseas market and meeting international customer demands [3] Group 5: Raw Material Price Changes and Impact - Key raw materials include copper-clad laminates, prepregs, copper foil, gold salt, and inks. In Q1 2025, prices for some raw materials, such as gold salt, increased year-on-year and also showed a rise compared to Q4 2024 due to commodity price fluctuations [4] - The company will continue to monitor international commodity price changes and maintain active communication with suppliers and customers regarding raw material price transmission [4] Group 6: Compliance and Disclosure - The company adhered strictly to the "Information Disclosure Management System" during the research process, ensuring no significant undisclosed information leakage occurred [5]

Investment Rating - The report does not explicitly state an investment rating for the industry or specific companies [1]. Core Insights - The report highlights a significant increase in social financing in China, with an increment of 16.34 trillion yuan in the first four months of the year, which is 3.61 trillion yuan more than the same period last year [3]. - The broad money supply (M2) reached 325.17 trillion yuan, reflecting an 8% year-on-year growth, while the narrow money supply (M1) increased by 1.5% to 109.14 trillion yuan [3]. - A reduction in the reserve requirement ratio by 0.5 percentage points is expected to inject approximately 1 trillion yuan of long-term liquidity into the market [3]. - The establishment of a "National Venture Capital Guidance Fund" aims to support high-level technological self-reliance and innovation [3]. Summary by Sections Market Performance - The Hang Seng Index closed at 23,640.65, up by 2.30% [2]. - The US Dow Jones Index decreased by 0.21% to 42,051.06, while the Nasdaq Index increased by 0.72% to 19,146.81 [2]. Company News - Tencent reported a net profit of 478.21 billion yuan for the first quarter, marking a 14.2% year-on-year increase [5]. - Weida's annual revenue was reported at 2.177 billion USD, a 1.5% increase year-on-year, while net profit decreased by 5.9% to 157 million USD [5]. - The demand for storage chips has surged, leading to rapid growth in the packaging substrate business [5].

Group 1: PCB Business Overview - The company's PCB business focuses on communication equipment, particularly in data centers and automotive electronics, with a slight recovery in wireless communication orders compared to Q4 2024 [1] - The demand for wired communication orders remains strong, with a higher proportion than wireless communication [1] - The data center sector continues to see growth in orders, driven by the demand for AI acceleration cards and servers [1] Group 2: Packaging Substrate Business - The packaging substrate products cover a wide range, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [2] - There has been a noticeable improvement in demand for packaging substrates in Q1 2025 compared to Q4 2024, mainly due to increased demand for storage products [2] Group 3: Production Capacity and Utilization - The overall production capacity utilization remains high, particularly in the PCB business due to sustained demand in computing power and automotive electronics [3] - The packaging substrate business has also seen an increase in capacity utilization due to improved demand in the storage sector compared to Q4 2024 [3] Group 4: FC-BGA Packaging Substrate Technology - The company has achieved batch production capability for FC-BGA packaging substrates with 20 layers or fewer, while R&D for products with more than 20 layers is progressing on schedule [4] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with a reduction in losses in Q1 2025 compared to previous quarters [4] Group 5: Expansion Plans - The company has PCB factories in Shenzhen, Wuxi, Nantong, and a factory under construction in Thailand, focusing on technological upgrades to enhance capacity [5] - The Nantong Phase IV project is underway to establish an HDI technology platform and capacity [5] Group 6: Thailand Factory Investment - The total investment for the Thailand factory is 1.274 billion RMB, with construction progressing on schedule [6] - The factory will have capabilities for high-layer and HDI PCB technologies, aiding in the expansion of overseas markets [6] Group 7: Raw Material Price Changes - Key raw materials include copper-clad laminates and gold salts, with prices increasing year-on-year and compared to Q4 2024 due to commodity price fluctuations [7][8] - The company is monitoring international commodity prices and maintaining communication with suppliers and customers [8]

Business Overview - The company focuses on PCB business expansion in communication equipment, data centers, automotive electronics, and industrial control sectors, with a slight recovery in wireless communication orders compared to Q4 2024 [1] - The packaging substrate business has seen a continuous increase in demand, particularly for storage products, contributing to improved order volume [2] Production Capacity and Utilization - The overall production capacity utilization remains high, with PCB business benefiting from sustained demand in computing and automotive electronics [3] - The packaging substrate business has improved capacity utilization due to enhanced demand in the storage sector compared to Q4 2024 [3] Sales and Market Impact - Direct sales to the U.S. account for a low percentage of total revenue, minimizing the impact of U.S. tariff policies on overall operations [4] - The company is actively monitoring changes in the international trade environment and maintaining communication with industry stakeholders [4] Technology and Product Development - The FC-BGA packaging substrate has achieved mass production capabilities for products with 20 layers or fewer, while R&D for products with more than 20 layers is progressing as scheduled [5] - The company is expanding its PCB business through technological upgrades and new projects in various locations, including Thailand, with a total investment of RMB 1.274 billion [7][8] Strategic Positioning - The electronic assembly business is positioned as a downstream segment of PCB manufacturing, focusing on communication, data centers, medical, and automotive electronics [9] - The company aims to leverage its technology platform to provide integrated solutions and enhance customer loyalty [9] Raw Material Costs - The prices of key raw materials, such as copper foil and gold salt, have increased due to fluctuations in commodity prices, impacting overall costs [10] - The company is committed to monitoring raw material price trends and maintaining proactive communication with suppliers [10] AI and High-Performance Computing - The demand for high-performance PCB products is rising due to the acceleration of AI technology and the need for high-speed networks [11] - The company is focusing on developing PCB products for high-performance applications, including AI accelerators and data center switches [11] Client Base - The packaging substrate business serves a diverse client base, including IDM, Fabless, and OSAT manufacturers, both domestically and internationally [12]

Core Viewpoint - The market is highly focused on the development of Shennan Circuit, a leading company in the PCB industry, as evidenced by over a hundred institutions conducting on-site research [1] Group 1: Business Performance - In Q1 2023, Shennan Circuit achieved revenue of approximately 48 billion yuan and a net profit attributable to shareholders of about 5 billion yuan, both showing over 20% year-on-year growth [1][2] - The company's revenue for the first three months was 47.83 billion yuan, a 20.75% increase year-on-year, while the net profit was 4.91 billion yuan, up 29.47% year-on-year [2] - The growth in revenue and profit is attributed to increased demand in high-speed network communication, computing power, and the automotive electronics sector [2] Group 2: Product and Market Strategy - Shennan Circuit's PCB business focuses on communication devices, data centers, and automotive electronics, with a notable increase in orders from the wireless communication sector [2] - The company has a diverse range of packaging substrate products, which have seen improved demand, particularly in storage products [3] - The company is expanding its overseas market presence with a factory in Thailand, investing approximately 12.74 billion yuan to enhance global supply capabilities [1][7] Group 3: Financial Health and Expansion - As of the end of 2024, Shennan Circuit's total assets increased from 207.27 billion yuan in 2022 to 253.02 billion yuan [7] - The company maintains a healthy financial position with a debt ratio of 42.14% and cash reserves of 17.08 billion yuan as of March 2023 [7] - Shennan Circuit has a history of steady dividends, proposing a cash dividend of 7.69 billion yuan for 2024, with a payout ratio of 40.97% [8][9] Group 4: Industry Position - According to Prismark, Shennan Circuit is expected to rank fourth among global PCB manufacturers in 2024, an improvement of four positions from 2023 [6] - The company has demonstrated resilience in the PCB industry, achieving continuous revenue and profit growth since 2016, except for a decline in 2023 due to market fluctuations [3][4]

Group 1: Business Overview - The company focuses on PCB business applications primarily in communication equipment, with a significant emphasis on data centers and automotive electronics [1] - In Q1 2025, the wireless communication orders slightly rebounded compared to Q4 2024, while the demand for wired communication remains strong [1] - The data center orders continued to grow, driven by the demand for AI accelerator cards and servers [1] Group 2: Packaging Substrate Business - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, mainly used in mobile smart terminals and servers [2] - In Q1 2025, the demand for packaging substrates improved compared to Q4 2024, primarily due to increased demand for storage products [2] Group 3: Production Capacity and Utilization - The overall production capacity utilization remains high, with PCB business benefiting from sustained demand in computing and automotive electronics [3] - The packaging substrate business has seen an increase in capacity utilization due to improved demand in the storage sector compared to Q4 2024 [3] Group 4: U.S. Sales and Tariff Impact - Direct sales to the U.S. accounted for a low percentage of total revenue, indicating minimal impact from U.S. tariff policies [4] - The company is closely monitoring the evolving international trade environment and maintaining communication with industry stakeholders [4] Group 5: FC-BGA Packaging Substrate Development - The company has achieved mass production capability for FC-BGA packaging substrates with up to 20 layers, while R&D for products with more than 20 layers is progressing on schedule [5] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with a reduction in losses observed in Q1 2025 compared to previous quarters [5] Group 6: Expansion Plans - The company has factories in Shenzhen, Wuxi, Nantong, and a project under construction in Thailand, focusing on upgrading existing facilities to enhance capacity [6] - The total investment in the Thailand factory is approximately 1.274 billion RMB, aimed at expanding overseas market reach and improving global supply capabilities [7][8] Group 7: Raw Material Price Trends - In Q1 2025, prices for certain raw materials, such as gold salt, increased compared to both Q1 2024 and Q4 2024, influenced by commodity price fluctuations [8] - The company is actively monitoring raw material price changes and maintaining communication with suppliers and customers [8] Group 8: AI and PCB Business - The demand for high-performance PCBs is increasing due to the rapid evolution of AI technology and the need for high-speed networks [8] - The company's PCB business has benefited from trends in high-speed communication networks and data center applications since 2024 [8]

Group 1: Financial Performance - In Q1 2025, the company achieved revenue of 4.91 billion RMB, a year-on-year increase of 20.75% [1] - The net profit attributable to shareholders was 0.47 billion RMB, up 29.47% year-on-year [1] - The net profit excluding non-recurring gains and losses was 0.48 billion RMB, reflecting a growth of 44.64% [1] Group 2: PCB Business Development - The PCB business focuses on communication equipment, particularly in data centers and automotive electronics, with a slight recovery in wireless orders and continued growth in wired demand [2] - Orders in the data center sector continued to grow, driven by demand for AI accelerator cards and servers [2] - The automotive electronics sector is experiencing stable growth, particularly in new energy and ADAS directions [2] Group 3: Packaging Substrate Business - The company offers a wide range of packaging substrate products, including module packaging substrates and storage packaging substrates, primarily used in mobile smart terminals and servers [3] - Demand for packaging substrates improved in Q1 2025, mainly due to increased demand for storage products [3] Group 4: Production Capacity and Utilization - The overall production capacity utilization remains high, particularly in the PCB business due to sustained demand in computing power and automotive electronics [4] - The packaging substrate business has seen an increase in capacity utilization compared to Q4 2024 due to improved demand in the storage sector [4] Group 5: Impact of U.S. Sales and Tariff Policies - Direct sales to the U.S. accounted for a low proportion of total revenue, indicating limited impact from U.S. tariff policies [5] - The company is closely monitoring the evolving international trade environment and maintaining communication with industry stakeholders [5] Group 6: HDI Process Capability - The company possesses HDI process capabilities, applicable in communication, data centers, industrial control, medical, and automotive electronics sectors [6] Group 7: FC-BGA Packaging Substrate Development - The company has achieved batch production capability for FC-BGA packaging substrates with up to 20 layers, with ongoing development for products exceeding 20 layers [7] - The Guangzhou packaging substrate project is in the early stages of ramping up production, with some cost impacts on profits [7] Group 8: Expansion Plans - The PCB business is expanding with factories in Shenzhen, Wuxi, Nantong, and a project in Thailand, focusing on technology upgrades and capacity enhancement [8] - The Nantong Phase IV project is under construction to establish an HDI technology platform [8] Group 9: Thailand Factory Investment - The total investment for the Thailand factory is 1.274 billion RMB, aimed at enhancing overseas market reach and meeting international customer demands [9] Group 10: Raw Material Price Changes - Key raw materials have seen price increases in Q1 2025 due to commodity price fluctuations, impacting costs [10] - The company is actively monitoring raw material prices and maintaining communication with suppliers and customers [10]