证券代码：300236 证券简称：上海新阳 公告编号：2025-047 上海新阳半导体材料股份有限公司 关于芯征途（一期）持股计划第三个锁定期届满的提示性公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有 虚假记载、误导性陈述或重大遗漏。 上海新阳半导体材料股份有限公司(以下简称"公司") 于 2022 年 4 月 25 日召开第五届董事会第四次会议审议通过了《关于<上海新阳半导体材料股份有 限公司芯征途（一期）持股计划（草案）>及其摘要的议案》等相关议案。2022 年 5 月 18 日，上述议案经公司 2021 年度股东大会审议通过，同意公司实施芯征 途（一期）持股计划（以下简称"本次持股计划"），并授权董事会全权办理与本 次持股计划相关的事宜。详见公司披露于 2022 年 4 月 27 日、2022 年 5 月 18 日 在证监会指定的创业板信息披露网站巨潮资讯网的持股计划相关公告。 根据中国证监会《关于上市公司实施员工持股计划试点的指导意见》及《深 圳证券交易所上市公司自律监管指引第 2 号——创业板上市公司规范运作》的相 关规定，公司本次持股计划第三个锁定期将于 2025 年 7 月 ...

Core Viewpoint - The article discusses the supply chain issues and investment opportunities in the semiconductor chemical mechanical polishing (CMP) materials market, particularly focusing on the impact of Taiwan's export controls on the supply of DSTl slurry and the growth potential of CMP materials in the semiconductor industry. Group 1: CMP Slurry Supply Issues - DSTl slurry supply has been suspended due to Taiwan's export control restrictions, with only five months of inventory remaining (267 barrels) [2] - DSTl slurry is critical for the CMP process in semiconductor manufacturing, enhancing wafer flatness and surface quality [2] Group 2: Investment Logic in CMP Materials - The demand for CMP materials is expected to grow rapidly due to advancements in process nodes, increased wiring density, and the transition from 2D NAND to 3D NAND technology [4] - CMP materials account for 7% of the semiconductor manufacturing material costs, with CMP slurry and pads making up 49% and 33% of CMP material costs, respectively [4] - The global CMP materials market is projected to grow from $3.3 billion in 2023 to over $4.2 billion by 2027 [4] Group 3: CMP Pad Market Overview - The global CMP pad market grew from $650 million in 2016 to $1.13 billion in 2021, with a CAGR of 11.69% [5] - In China, the CMP pad market increased from 810 million yuan in 2016 to 1.31 billion yuan in 2021, with a CAGR of 10.09% [5] - Dow DuPont dominates the global CMP pad market with a 79% share, while domestic company Dinglong has become a key player in China [6] Group 4: CMP Slurry Market Overview - The global CMP slurry market expanded from $1.1 billion in 2016 to $1.43 billion in 2021, with a CAGR of 5.39% [7] - The Chinese CMP slurry market grew significantly, from 1.23 billion yuan in 2016 to 2.2 billion yuan in 2021, with a CAGR of 12.28% [7] - Major global players in the CMP slurry market include Cabot, Versum Materials, and Dow, with China being the largest demand region [7] Group 5: Domestic Companies in CMP Materials - Dinglong has established itself as the only domestic supplier mastering the entire CMP pad production process, achieving significant breakthroughs in the field [6][12] - Anji Technology, a leading domestic CMP slurry company, reported revenues of 1.075 billion yuan in 2023, capturing a significant market share [22][23] - Shanghai Xinyang and Jiangfeng Electronics are also notable players in the CMP materials sector, focusing on various CMP products [36][37] Group 6: Future Trends and Opportunities - The future of CMP materials is expected to trend towards specialization and customization, providing opportunities for new entrants in the market [8] - Companies focusing on new technologies for polishing liquids, such as those related to SiC, and those mastering upstream particle development are recommended for investment [8]

Core Viewpoint - The demand for electroplating solutions in China is continuously growing, driven by rapid developments in downstream applications such as electronics, automotive, and aerospace, particularly in high-end sectors like semiconductor packaging and PCB manufacturing [1][12]. Industry Overview - Electroplating solutions are composed of metal ions, electrolytes, and additives, essential for the electroplating process, directly affecting the quality and properties of the plated layer [3][4]. Industry Development History - The Chinese electroplating solution industry has evolved through four stages: initial establishment in the 1950s-1970s, rapid development from the 1980s-2000s, maturity and transformation in the 2000s-2010s, and modernization and upgrading from the 2010s to present [4][5]. Market Size - The market size for electroplating solutions in China is projected to reach 3.779 billion yuan in 2024, with a year-on-year growth of 9.16%, and is expected to grow to 4.611 billion yuan by 2026, with a growth rate of 10.79% [12]. Key Enterprises - The competitive landscape of the electroplating solution industry is characterized by both diversification and concentration, with leading companies like Shanghai Xinyang and Jiangsu Aisen dominating the high-end market through strong R&D capabilities and technological advancements [14][16]. Industry Development Trends 1. **Sustained Market Demand Growth**: The demand for high-performance electroplating solutions is expected to increase significantly, particularly in advanced fields such as semiconductor manufacturing and new energy vehicles [20]. 2. **Accelerated Technological Progress and Domestic Substitution**: Domestic companies are making significant advancements in high-end electroplating solutions, reducing reliance on imports and enhancing competitiveness in the global market [21]. 3. **Stricter Environmental Policies**: The industry is moving towards greener and more sustainable practices due to increasing environmental regulations, with a focus on developing eco-friendly electroplating solutions and waste treatment technologies [22].

证券代码：300236 证券简称：上海新阳 公告编号：2025-045 上海新阳半导体材料股份有限公司 关于对外投资股权投资基金进展暨完成备案登记的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 一、对外投资基本情况 为充分把握市场机遇，拓宽公司投资渠道，上海新阳半导体材料股份有限 公司（以下简称"公司"）以自有资金参与由中芯聚源私募基金管理（上海） 有限公司（以下简称"中芯聚源"）发起设立的股权投资基金。该股权基金名 称为聚源启新股权投资基金（无锡）合伙企业（有限合伙）（以下简称"启新 基金"）。启新基金认缴出资总额为人民币80,000万元，其中公司作为有限合伙 人认缴出资人民币3,000万元，占认缴出资总额的3.75%。具体内容详见公司于 2025年05月19日发布在巨潮资讯网（www.cninfo.com.cn）上的《关于公司拟 对外投资股权投资基金的公告》。 管理人名称：中芯聚源私募基金管理（上海）有限公司 托管人名称：中国农业银行股份有限公司 备案编码：SAZY22 备案日期：2025年06月24日 公司将根据基金的后续进展情况，按照有关法律法 ...

Core Viewpoint - The article highlights the significant growth and advancements in the semiconductor photoresist industry, showcasing various companies' performance and R&D capabilities in this sector. Group 1: Business Performance - Tongcheng New Materials achieved a 50.43% year-on-year increase in semiconductor photoresist revenue for 2024, with ArF photoresist passing customer validation and generating revenue [1] - Aisen Semiconductor reported a 37.68% year-on-year growth in photoresist and supporting reagent revenue for 2024, with significant market penetration in advanced packaging negative photoresist [2] - Shanghai Xinyang's photoresist products saw an overall revenue increase of over 100% year-on-year, with multiple KrF photoresists achieving bulk sales [4] - Nanda Optoelectronics experienced a breakthrough of over 80% year-on-year growth in photoresist business, with several ArF products validated by customers [6] - Jingrui Electric Materials reported a nearly 30% year-on-year growth in photoresist business for 2024, maintaining a strong market position with its UV wide-spectrum photoresists [5] Group 2: R&D Capabilities - Tongcheng New Materials has nearly 50 semiconductor photoresist R&D projects, with half validated by users and some entering small-scale production [2] - Aisen Semiconductor is advancing its PSPI photoresist product certifications and has formed an expert team for KrF photoresist development [3] - Shanghai Xinyang is enhancing its R&D and industrialization of high-end photoresists for integrated circuit manufacturing, focusing on 3D NAND, DRAM, and logic advanced processes [5] - Nanda Optoelectronics is developing high-resolution photoresists for 300mm wafers below 90nm and aims to establish a proprietary patent system [6] - Jingrui Electric Materials is collaborating with Sinopec Group on ArF high-end photoresists and has multiple R&D projects underway for various photoresist applications [7] Group 3: Industry Events - The 2025 TrendBank (Fifth) Lithography Industry Conference will be held on July 9-10 in Hefei, aiming to gather experts, scholars, and industry representatives to discuss advancements and challenges in lithography technology and materials [9]

证券代码：300236 证券简称：上海新阳 公告编号：2025-044 分配预案公布后至实施前，公司总股本（即：扣除公司股票回购专用证券 账户持股数后的股本数）发生变动的，将按照"现金分红总额不变"的原则， 按照公司新的总股本计算的分配比例实施。 及调整原则一致。 二、本次实施的权益分派方案 本公司2024年年度权益分派方案为：以公司现有总股本剔除已回购股份 币现金（含税；扣税后，通过深股通持有股份的香港市场投资者、QFII、RQFII 以及持有首发前限售股的个人和证券投资基金每10股派2.340000元；持有首发 后限售股、股权激励限售股及无限售流通股的个人股息红利税实行差别化税率 征收，本公司暂不扣缴个人所得税，待个人转让股票时，根据其持股期限计算 应纳税额【注】；持有首发后限售股、股权激励限售股及无限售流通股的证券投 资基金所涉红利税，对香港投资者持有基金份额部分按10%征收，对内地投资者 持有基金份额部分实行差别化税率征收）。 本次权益分派后除权除息参考价公式为：除权除息日的前一收盘价-每股现 金红利=除权除息日的前一收盘价-0.2584362。 一、股东大会审议通过权益分派方案的情况 回购专用证券账 ...

证券代码：300236 证券简称：上海新阳 公告编号：2025-044 上海新阳半导体材料股份有限公司 2024年度权益分派实施公告 本公司及董事会全体成员保证信息披露内容的真实、准确和完整，没有 虚假记载、误导性陈述或重大遗漏。 特别提醒 截至本公告日，上海新阳半导体材料股份有限公司（以下简称"公司"）总 股本为313,381,402股，公司回购专用证券账户中的股份数为1,884,844股。根 据《公司法》的规定，公司回购专用证券账户中的股份不参与2024年度权益分 派，本次实际参与权益分派的股份数为311,496,558股。 本次权益分派实施后，按公司总股本折算每10股现金分红比例计算如下： 按总股本折算每10股现金分红比例=本次实际现金分红总额/(公司总股本/10)= 311,496,558×0.26/(313,381,402/10)=2.584362（实际现金分红总额及按总股 本折算每股现金分红比例时保留小数点后六位数，最后一位直接截取，不四舍 五入）。 本次权益分派后除权除息参考价公式为：除权除息日的前一收盘价-每股现 金红利=除权除息日的前一收盘价-0.2584362。 一、股东大会审议通过权益分 ...

证券代码：300236 证券简称：上海新阳 公告编号：2025-043 上海新阳半导体材料股份有限公司 关于子公司完成工商变更登记的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 近日，上海新阳半导体材料股份有限公司（以下简称"公司"）接到江苏考 普乐新材料有限公司（以下简称"考普乐"）的通知，因日常经营需要，考普乐 已完成经营范围变更的工商登记手续，并取得常州市高新技术产业开发区（新北 区）政务服务管理办公室换发的《营业执照》，相关登记信息如下： 统一社会信用代码：91320400768252379G 名 称：江苏考普乐新材料有限公司 请广大投资者理性投资，注意风险。 特此公告。 上海新阳半导体材料股份有限公司 董事会 类 型：有限责任公司 住 所：常州市新北区滨江经济开发区滨江二路 1 号 法定代表人：蒋莉丽 注册资本：5896 万元整 成立日期：2004 年 11 月 03 日 经营范围：许可项目：危险化学品生产(依法须经批准的项目，经相关部门 批准后方可开展经营活动，具体经营项目以审批结果为准)一般项目：涂料制造 (不含危险化学品)；涂料销售(不 ...

北京市隆安律师事务所上海分所 关于上海新阳半导体材料股份有限公司 2024 年度股东大会的 法律意见书 北京市隆安律师事务所上海分所 www.longanlaw.com 二〇二五年五月 关于上海新阳半导体材料股份有限公司 2024 年度股东大会的法律意见书 北京市隆安律师事务所上海分所 关于上海新阳半导体材料股份有限公司 2024 年度股东大会的 致：上海新阳半导体材料股份有限公司 北京市隆安律师事务所上海分所（以下简称"本所"）接受上海新阳半导体 材料股份有限公司（以下简称"公司"）委托，就公司召开 2024 年度股东大会 （以下简称"本次股东大会"）的有关事宜，根据《中华人民共和国公司法》 （以下简称"《公司法》"）、《上市公司股东大会规则》（以下简称"《股东大会规 则》"）等法律、法规、规章和其他规范性文件以及《上海新阳半导体材料股份 有限公司章程》（以下简称"《公司章程》"）的有关规定，出具本法律意见书。 为出具本法律意见书，本所及本所律师依据《律师事务所从事证券法律业 务管理办法》和《律师事务所证券法律业务执业规则（试行）》等规定，严格履 行了法定职责，遵循了勤勉尽责和诚实信用原则，对本次股东大会所 ...

证券代码：300236 证券简称：上海新阳 公告编号：2025-042 上海新阳半导体材料股份有限公司 2024年度股东大会决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 现场会议召开日期和时间：2025年5月29日（星期四）14:00； 特别提示： 1．本次股东大会未涉及变更前次股东大会决议； 2、本次股东大会以现场投票和网络投票相结合的方式召开，中小投资者单 独计票。 一、会议召开和出席情况 1、会议届次：2024年度股东大会 2、会议召集人：上海新阳半导体材料股份有限公司董事会 3、会议召开的合法、合规性：经公司第六届董事会第四次会议审议通过，决 定召开2024年度股东大会，召集程序符合有关法律、行政法规、部门规章、规范 性文件和公司章程的规定。 4、会议召开日期和时间： 网络投票日期和时间：2025年5月29日。其中，通过深圳证券交易所交易系统 进行网络投票的时间为2025年5月29日9:15-9:25，9:30-11:30和 13:00-15:00；通过 深圳证券交易所互联网系统投票的具体时间为2025年5月29日9:15-15:00。 5 ...