Group 1: Industry Barriers - The semiconductor industry has significant technical barriers due to the high technical content in product formulation and production processes, which span multiple disciplines including chemistry and microelectronics [3] - There is a talent barrier in the semiconductor industry, as composite talents with backgrounds in chemistry and microelectronics are scarce, making it difficult to assemble technical teams [3] - Market barriers exist as semiconductor companies are very cautious in selecting suppliers, requiring strict assessments and certifications from potential suppliers [3] Group 2: Certification and Procurement - The certification cycle for chemicals related to semiconductor manufacturing and packaging is lengthy, typically taking 6 months to a year for downstream clients to validate raw material quality before placing orders [3] - The certification process is rigorous and scientific, influenced by factors such as production capacity and process changes [3] Group 3: Employee Stock Ownership Plan - The company plans to implement an employee stock ownership plan through secondary market purchases within 6 months after shareholder approval [4] - The plan is currently not initiated and requires several procedures to be completed before stock acquisition can begin [4] Group 4: Technology and Product Development - The company is focusing on TSV (Through-Silicon Via) technology, which allows for high-density interconnections between chips, enhancing speed and reducing power consumption [4] - The company’s copper plating additives for IC packaging substrates have a market value of approximately 1.2 billion RMB, with major competitors including Rohm and Haas and MacDermid [4] Group 5: Project Updates - The semiconductor wafer project has officially started, with the technical plan confirmed and related construction and R&D progressing normally [4] - The company’s non-public issuance of materials is currently under review by the China Securities Regulatory Commission [4] Group 6: Market Conditions and Risks - The market for sapphire single crystal materials has slowed due to changes in demand from major clients like Apple, impacting sales for the invested company Dongguan Jingyan Powder Technology [5] - The company is closely monitoring market changes and advising investors to be aware of investment risks [5] Group 7: Future Directions - The company aims to leverage capital market platforms for industry integration and business expansion, aspiring to become the largest supplier of electronic chemical materials in China [5] - Future interests include functional chemical materials in PCB, LED, LCD, and photovoltaic sectors, in addition to the semiconductor field [5]

证券代码：300236 证券简称：上海新阳 东方证券胡誉镜，中金公司范海涛、陈明，民生证券王喆，汇添富杨瑨， 参与单位名称 大智慧孙芳芳 及人员姓名 时间 2014 年 11 月 11 日 地点 上海新阳会议室 上市公司接待 董事会秘书杜冰、证券事务助理保莹 人员姓名 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2014-027 | --- | --- | --- | --- | --- | --- | --- | |--------------|---------------------------|-------|----------------------------|-------|-------|-------| | | | | | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | | | | | | | | | | | | | 动类别 | □媒体采访 □业绩说明会 | | | | | | | | □新闻发布会 □路演活动 | | | | | | | | □现场参观 □其他 | | （请文字说明其他活动内容） | | | | | --- | --- | |-- ...

Group 1: Financial Performance - The gross profit margin of the company's chemical products decreased due to new products and projects being in the market promotion phase, increased R&D investment, and rising operational costs from completed fundraising projects [1] - The company has maintained stable sales revenue and prices for its chemical products [1] Group 2: R&D Investment - High R&D expenses in recent years were primarily for new product development in wafer manufacturing and advanced packaging, as well as participation in national major science and technology projects from 2011 to 2013 [1][2] - The company is focused on continuous R&D capabilities to support future technological advancements [2][3] Group 3: Market Expansion and Partnerships - The company aims to penetrate foreign enterprises, which requires a window period for opportunities related to new production capacity, process adjustments, cost reductions, and supply chain optimization [2] - The partnership with German DH Company is based on its established industry position and the company's capabilities in R&D and quality control [2] - The company is expanding its product applications in various sectors, including construction, venues, airports, railways, bridges, and ships, with a focus on high-end functional coatings [2] Group 4: Future Development Strategy - The company positions itself as a technology-driven enterprise, focusing on semiconductor-specific electronic chemicals and related equipment while exploring new market opportunities [3] - Future development will revolve around two main lines: deepening the semiconductor industry chain and expanding core technologies in various fields [3] Group 5: Non-Public Offering Progress - The non-public offering project has not yet been submitted to the China Securities Regulatory Commission, pending approvals from relevant government departments [3]

证券代码：300236 证券简称：上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2014-023 | --- | --- | --- | --- | |-----------------------|----------------------------------|------------------------------------------------|------------------------------------------------------------------| | | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | | 动类别 | □媒体采访 □业绩说明会 | | | | | □新闻发布会 □路演活动 | | | | | □现场参观 □其他 | | （请文字说明其他活动内容） | | 参与单位名称 | 泽，申万菱信沈俊，浙商证券周小峰 | | 广发证券许兴军、王亮，银华基金刘宇尘，南方基金方建，招商基金刘一 | | 及人员姓名 | | | | | 时间 | 2014 年 10 月 28 日 | | | | 地点 | 上海新 ...

证券代码：300236 证券简称：上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2014-025 | --- | --- | --- | |-----------------------|---------------------------------------------|-----------------------------------------------------------------------------| | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | 动类别 | □媒体采访 □业绩说明会 □新闻发布会 □路演活动 | | | | | | | 参与单位名称 | □现场参观 □其他 | （请文字说明其他活动内容） 鹏华基金张国平、刘苏、伍旋，申银万国陆士杰、张騄 | | 及人员姓名 | | | | 时间 | 2014 年 11 月 4 日 | | | 地点 | 上海新阳会议室 | | | 上市公司接待 人员姓名 | 董事会秘书杜冰、证券事务助理保莹 | | | | 行业的？ | 1、半导体行业有较高的行业和市场壁垒，公司一开始是如 ...

证券代码：300236 证券简称：上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2014-026 | --- | --- | --- | |--------------|----------------------------------|---------------------------------------------------------------------------------------------------------------------------| | | | | | 投资者关系活 | | ■特定对象调研 □分析师会议 | | 动类别 | □新闻发布会 □路演活动 | □媒体采访 □业绩说明会 | | | | | | 参与单位名称 | □现场参观 □其他 | （请文字说明其他活动内容） 汇丰晋信曹庆、赵文、陈平、李元博，中银国际张力磁，中金公司方巍， | | 及人员姓名 | | 德威资本樊学栋，东北证券张景煜，国金证券马鹏清，太平洋资产张晓辉， 信达澳银曾国富、钱翔，富国基金张啸伟，兴业全球基金朱璘 | | 时间 | 2014 年 11 月 5 日 | ...

证券代码：300236 证券简称：上海新阳 齐鲁证券刘易、杜威，易方达基金何云峰、冯波，方正证券孙远峰 参与单位名称 及人员姓名 时间 2014 年 11 月 20 日 地点 上海新阳会议室 上市公司接待 董事会秘书杜冰、证券事务助理保莹 人员姓名 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2014-029 | --- | --- | --- | --- | --- | --- | --- | |--------------|---------------------------|-------|----------------------------|-------|-------|-------| | | | | | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | | | | | | | | | | | | | 动类别 | □媒体采访 □业绩说明会 | | | | | | | | □新闻发布会 □路演活动 | | | | | | | | □现场参观 □其他 | | （请文字说明其他活动内容） | | | | | --- | --- | |------------ ...

证券代码：300236 证券简称：上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2014-020 | --- | --- | --- | --- | |-------------------------|-----------------------------------|-------|---------------------------------------------------------------------| | | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | | 动类别 | □媒体采访 □业绩说明会 | | | | | □新闻发布会 □路演活动 | | | | | □现场参观 | □其他 | （请文字说明其他活动内容） | | 参与单位名称 及人员姓名 | 富达国际投资马磊 | | | | 时间 | 2014 年 10 月 8 日 | | | | 地点 | 上海新阳会议室 | | | | 上市公司接待 人员姓名 | 董事会秘书杜冰、证券事务助理保莹 | | | | | 1、请简单介绍一下公司的业务情况？ | | | | | | | 公 ...

证券代码：300236 证券简称：上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2015-001 | --- | --- | --- | --- | |-------------------------|--------------------------------------------|-------|------------------------------------------------------------------| | | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | | 动类别 | □媒体采访 □业绩说明会 | | | | | □新闻发布会 □路演活动 | | | | | □现场参观 □其他 | | （请文字说明其他活动内容） | | 参与单位名称 及人员姓名 | | | 海通证券陈平，华金证券蔡景彦，华夏基金李明斯、裴彦春 | | | | | | | 时间 | 2015 年 1 月 9 日 | | | | 地点 | 上海新阳会议室 | | | | 上市公司接待 人员姓名 | 董事会秘书杜冰、证券事务助理保莹 | | | | | ...

证券代码：300236 证券简称：上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号：2015-005 | --- | --- | --- | |-------------------------|-----------------------------|--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------| | | | | | 投资者关系活 | | ■特定对象调研 □分析师会议 | | 动类别 | | □媒体采访 □业绩说明会 | | | | □新闻发布会 □路演活动 | | | □现场参观 □其他 | （请文字说明其他活动内容） | | 参与单位名称 及人员姓名 | | 中信证券卢博森，阳光资产于庭泽、张学鹏，中邮基金王曼 | | 时间 | 2015 年 2 月 2 日 ...