Shanghai Sinyang(300236)
Search documents
上海新阳(300236) - 2014年7月14日投资者关系活动记录表
2022-12-08 05:24
证券代码:300236 证券简称:上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号:2014-013 | --- | --- | --- | |-----------------------|-----------------------------------|---------------------------------------------------------------------| | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | 动类别 | □媒体采访 □业绩说明会 | | | | □新闻发布会 □路演活动 | | | 参与单位名称 | □现场参观 宏源证券王建伟、秦闻 | □其他 (请文字说明其他活动内容) | | 及人员姓名 | | | | 时间 | 2014 年 7 月 14 日 | | | 地点 | 上海新阳会议室 | | | 上市公司接待 人员姓名 | | 证券事务代表:杜冰,证券事务助理:保莹 | | | 1、请简单介绍一下公司的业务情况? | | | | | 公司的主要属性是化学材料的供应商,也生产配套的设备产品。对外 | | ...
上海新阳(300236) - 2014年8月29投资者关系活动记录表
2022-12-08 05:21
证券代码:300236 证券简称:上海新阳 上海新阳半导体材料股份有限公司投资者关系活动记录表 编号:2014-017 | --- | --- | --- | |-------------------------|-------------------------------------------------|------------------------------------------------------------------------------------------------------------------------------| | | | | | 投资者关系活 | ■特定对象调研 □分析师会议 | | | 动类别 | □媒体采访 □业绩说明会 | | | | □新闻发布会 □路演活动 | | | | □现场参观 | □其他 (请文字说明其他活动内容) | | 参与单位名称 及人员姓名 | | 华创证券曹令,中银基金陈军、马蘅、白培根,申银万国陆士杰,中信证 券韩益平,光大永明保险曾维江,国信证券蓝逸翔,华夏基金吕一闻 | | | | | | 时间 | 2014 年 8 月 ...
上海新阳(300236) - 2015年6月30日投资者关系活动记录表
2022-12-08 03:18
Group 1: Market Development and Product Supply - Shanghai Xinyang has become the primary supplier of copper interconnect plating solutions for SMIC, with sales of plating solutions to Wuxi Hynix Semiconductor and copper cleaning solutions to SMIC Shanghai [1] - The company's front-end wafer process chemicals are expected to be the main profit growth point, aiming for rapid revenue growth based on 2014 figures [1] Group 2: Product Performance and Market Trends - The monthly shipment of the company's slicing knife products has reached approximately 1,000 units, with a stable growth in order volume [2] - The 300mm semiconductor wafer market is currently dominant, holding a 70% market share, while the 200mm product has passed its peak [2] - In 2013, the global monthly consumption of 12-inch wafers was 5.16 million pieces, with domestic demand for 300mm wafers projected to exceed 600,000 pieces by 2017 and over 1 million pieces by 2020 [2] Group 3: Project Developments - The large wafer project has secured land and is in the process of obtaining planning and construction permits, with construction expected to commence in Q3 2015 and production planned for the end of 2016 [2] - The new 5,000-ton capacity for Kaopule has received trial production approval and has entered the trial production phase [2] Group 4: Competitive Advantages and Future Directions - Dongguan Jingyan Company has a competitive edge through proprietary research and development of direct hydrolysis production processes, leading in high-purity alumina technology [3] - The company aims to leverage capital market platforms for industry integration and business expansion, aspiring to become the largest electronic chemical materials supplier in China [3]
上海新阳(300236) - 2015年9月10日投资者关系活动记录表
2022-12-08 03:10
Group 1: Company Overview and Strategy - Shanghai Xinyang is a technology-driven company focused on semiconductor electronic chemicals and supporting equipment, aiming to consolidate its market position while expanding product applications and exploring new markets [1] - The company plans to develop along two main lines: deepening the semiconductor industry chain potential and continuously expanding core technology applications across various fields [1] Group 2: Financial Performance - In the first half of 2015, the company's net profit decreased compared to the same period last year due to increased investment scale, rising depreciation costs, and insufficient release of new production capacity from fundraising projects [1] - The introduction of consumption tax on coating products negatively impacted the net profit of its subsidiary Jiangsu Kaopule New Materials Co., Ltd [1] - The company aims to actively develop new markets and clients to restore rapid growth in operating performance while reminding investors to be cautious of investment risks [1] Group 3: Industry Barriers - The semiconductor industry faces significant technical barriers due to the high technical content in product formulation research and production processes, which span multiple disciplines [2] - Talent scarcity, particularly for professionals with backgrounds in chemistry and microelectronics, creates a talent barrier for assembling technical teams [2] - Market barriers exist as semiconductor companies are cautious in selecting suppliers, requiring rigorous assessment and certification [2] Group 4: Supply Chain Efficiency - The company typically has a one-week delivery cycle for domestic clients, while international competitors face longer delivery times of 2-3 months due to shipping and customs processes [2] - Shorter delivery cycles enhance customer production efficiency and stabilize impurity content in ultra-pure chemical products, contributing to improved product yield [2] Group 5: Product Development and Market Outlook - The company currently has a wafer dicing blade production capacity of approximately 5,000 pieces per month, with monthly sales around 1,500 pieces, showing stable growth [2] - The market for 300mm semiconductor wafers is promising, with a current market share of 70%, and demand projected to exceed 600,000 pieces by 2017 and 1,000,000 pieces by 2020 [3] - The company is interested in expanding into functional chemical materials in various electronic fields, including PCB, LED, LCD, and photovoltaics [3] Group 6: Future Growth Points - The company maintains a solid market position in traditional semiconductor packaging, while rapid growth is expected in the semiconductor wafer processing sector over the next 2-3 years [3] - Advanced packaging technology reserves may lead to rapid growth in the next 3-5 years, alongside new projects in wafer dicing blades and IC substrate chemical materials [3]