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晚间公告丨8月7日这些公告有看头
Di Yi Cai Jing· 2025-08-07 10:35
Key Points - Multiple listed companies in the Shanghai and Shenzhen markets released announcements on August 7, highlighting significant developments for investors [1] Group 1: Major Events - Zhongma Transmission clarified that its electric vehicle reducers are exclusively for electric vehicles and do not involve robotics, following a stock price surge of over 20% [1] - Buchang Pharmaceutical's subsidiary Luzhou Buchang signed an exclusive supply agreement with GOODFELLOW for the registration and distribution of a new drug in the Philippines, with financial details kept confidential [2] - Dao Technology entered a strategic cooperation agreement with Gongji Technology and Chip Pei Sen to collaborate on atomic-level scientific computing capabilities [3] - Furi Electronics reported that its subsidiary provides JDM/OEM services for service robots, contributing less than 1% to the company's total revenue despite a stock price increase of 46.44% [4] Group 2: Performance Reports - Shangwei New Materials reported a 12.5% increase in revenue to 784 million yuan for the first half of 2025, but net profit fell by 32.91% to 29.9 million yuan [5] - SMIC disclosed Q2 2025 revenue of $2.209 billion, up from $1.901 billion year-on-year, with a gross margin of 20.4% [6] - China Mobile announced a 5% year-on-year increase in net profit to 84.24 billion yuan for the first half of 2025, with operating revenue of 543.77 billion yuan [7] - Huahong Semiconductor reported Q2 2025 sales revenue of $566.1 million, a year-on-year increase of 18.3% [8][9] - Rongzhi Rixin achieved a 2063.42% increase in net profit to 14.24 million yuan for the first half of 2025, with revenue growth of 16.55% [10]
道氏技术:与共济科技及芯培森签订战略合作框架协议 就原子级科学计算算力业务开展深度合作
Mei Ri Jing Ji Xin Wen· 2025-08-07 10:33
Core Viewpoint - Dao's Technology (300409.SZ) has signed a strategic cooperation agreement with Gongji Technology and its affiliate Chipenson to collaborate on atomic-level scientific computing power business [1] Group 1 - The three parties aim to conduct in-depth cooperation in the field of atomic-level scientific computing [1] - Dao's Technology will promote the construction of multiple intelligent computing centers dedicated to atomic-level scientific computing [1] - Gongji Technology will provide suggestions and optimization plans for the computing centers [1] - Chipenson will ensure the supply of high-speed computing servers [1]
道氏技术(300409.SZ):与共济科技及芯培森签署战略合作协议
Ge Long Hui A P P· 2025-08-07 10:33
Core Viewpoint - The company, Daoshi Technology, has signed a strategic cooperation agreement with Shenzhen Gongji Technology Co., Ltd. and its affiliate Guangdong Chip Pei Sen Technology Co., Ltd. to focus on the new materials sector and artificial intelligence-driven research and development [1] Group 1: Strategic Cooperation - The agreement aims to leverage the strengths of all three parties in the field of AI4R&D and atomic-level scientific computing [1] - Daoshi Technology has established joint ventures and investments in companies that enhance its capabilities in material innovation and AI-driven research [1] Group 2: Technological Focus - The company is concentrating on innovations in materials, processes, and products, particularly in the AI4R&D domain [1] - Guangdong Chip Pei Sen has developed high-speed, low-power consumption servers, which will be integral to the collaboration on atomic-level scientific computing [1] Group 3: Infrastructure Development - The partnership will utilize Gongji Technology's expertise in the construction and operation of computing power centers, which are essential for the planned large-scale computing power center [1] - The collaboration is expected to deepen the engagement in the atomic-level scientific computing power business [1]
道氏技术:将与共济科技、芯培森就原子级科学计算算力业务开展深度合作
Zheng Quan Shi Bao Wang· 2025-08-07 10:25
Core Insights - Dao's Technology (300409) announced a strategic cooperation agreement with Gongji Technology and its affiliate Chipenson on August 7 [1] - The collaboration focuses on deep cooperation in atomic-level scientific computing power business, leveraging each party's strengths in AI for R&D and computing power center operations [1] Company Developments - Dao's Technology has made significant investments in the AI for R&D sector and plans to establish a large-scale atomic-level scientific computing power center [1] - Gongji Technology is recognized for its capabilities in constructing and operating computing power centers, as well as its understanding of relevant policies and development trends [1] - Chipenson has developed high-speed, low-power consumption servers, which will be integral to the collaboration [1]
道氏技术:与共济科技及芯培森签订战略合作框架协议
Di Yi Cai Jing· 2025-08-07 10:25
Core Insights - The company has signed a strategic cooperation agreement with Gongji Technology and its affiliate Chipenson to collaborate on atomic-level scientific computing capabilities [2] - The partnership aims to establish multiple intelligent computing centers dedicated to atomic-level scientific calculations [2] - Gongji Technology will provide recommendations and optimization plans for the computing centers, while Chipenson will ensure the supply of high-speed computing servers [2]
道氏技术:与共济科技及芯培森签署战略合作协议
Xin Lang Cai Jing· 2025-08-07 10:20
Core Viewpoint - The company has signed a strategic cooperation agreement with Shenzhen Gongji Technology Co., Ltd. and its affiliate Guangdong Chipenson Technology Co., Ltd., focusing on the new materials sector and AI-driven research and development [1] Group 1: Strategic Partnerships - The company is concentrating on material innovation, process innovation, and product innovation [1] - The collaboration aims to leverage the strengths of all parties in the field of atomic-level scientific computing [1] Group 2: AI and Computing Initiatives - The company has made significant investments in AI4R&D, including the establishment of Guangdong Turing Dawson Technology Co., Ltd. and the investment in Chipenson [1] - The partnership with Gongji Technology is expected to enhance the operational capabilities of the planned atomic-level scientific computing power center [1] Group 3: Technological Advancements - Chipenson has developed high-speed, low-power consumption servers, which will be integral to the collaboration [1] - The three parties are set to engage in deep cooperation regarding atomic-level scientific computing power business [1]
道氏技术(300409) - 关于签订战略合作框架协议的公告
2025-08-07 10:12
证券代码:300409 证券简称:道氏技术 公告编号:2025-083 广东道氏技术股份有限公司 关于签订战略合作框架协议的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整,没有 虚假记载、误导性陈述或重大遗漏。 特别提示: 1、广东道氏技术股份有限公司(以下简称"道氏技术"或"公司")本次签订 《战略合作协议》,不会对公司本年度财务状况及经营业绩构成重大影响,如 后续具体合作对公司当年度业绩有重大影响将另行公告。 2、公司最近三年内签署的框架性协议或意向性协议均在正常履行中。 3、根据相关法律法规,本次签署《战略合作协议》无需提交公司董事会 或股东大会审议,也不构成《上市公司重大资产重组管理办法》规定的重大资 产重组事项。 一、协议签署概况 近日,公司与深圳市共济科技股份有限公司(以下简称"共济科技")及关 联方广东芯培森技术有限公司(以下简称"芯培森")签署了《战略合作协议》。 公司聚焦新材料领域,专注材料创新、工艺创新和产品创新,并在人工智能驱 动的研发(AI4R&D)领域持续布局,先后合资成立广东图灵道森技术有限公 司、投资入股芯培森以及合资成立广东赫曦原子智算中心有限公司。 鉴于公司在 ...
道氏技术等成立赫曦原子智算中心公司
Qi Cha Cha· 2025-08-06 04:25
Group 1 - The establishment of Guangdong Hexi Atomic Intelligent Computing Center Co., Ltd. has been registered with a capital of 50 million yuan, focusing on data processing, information system integration, cloud computing technology services, and internet data services [1][2] - The company is located in the Chancheng District of Foshan City, Guangdong Province, and is classified under the software and information technology services industry [2] - The major shareholder is Daoshi Technology Co., Ltd. (300409.SZ), holding an 80% stake, while Guangdong Chip Peisen Technology Co., Ltd. holds the remaining 20% [3] Group 2 - The business scope includes general projects such as data processing and storage support services, information system integration services, and cloud platform-based business outsourcing services [2] - The company is currently in operation with a business license valid until August 4, 2025 [2] - The registered address is located at No. 1, Yishui Third Street, Nanzhuang Town, Chancheng District, Foshan City, Guangdong Province [2]
道氏技术(300409.SZ):考虑利用AI进行材料的反向设计,在这方面芯培森可以提供支持
Ge Long Hui· 2025-08-05 07:26
格隆汇8月5日丨道氏技术(300409.SZ)在投资者互动平台表示,公司会根据实际需要,考虑利用AI进行 材料的反向设计,在这方面芯培森可以提供支持。 ...
道氏技术:芯培森公司主要从应用AI相关技术
Mei Ri Jing Ji Xin Wen· 2025-08-04 08:06
Core Viewpoint - The company DaoTech (300409.SZ) is addressing investor inquiries regarding its investment in Chip Pei Sen APU, focusing on how it supports complex scientific calculations while lowering development barriers for researchers and enterprises [2] Group 1 - DaoTech emphasizes the use of AI-related technologies, such as AI Agents and large atomic models, to facilitate the use of APU computing power servers for researchers [2] - The company is also developing software interfaces that maintain users' existing habits, making it easier for scientific personnel to utilize the APU technology [2] - The response highlights the company's commitment to promoting the widespread application and adoption of its technology among researchers and enterprises [2]