证券代码：300456 证券简称：赛微电子 公告编号：2025-005 北京赛微电子股份有限公司 第五届董事会第十三次会议决议公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 北京赛微电子股份有限公司（以下简称"公司"）第五届董事会第十三次会 议于 2025 年 3 月 19 日采取现场和通讯相结合的方式召开，会议通知于 2025 年 3 月 9 日以电话或电子邮件的方式送达。本次会议应到董事 7 人，实际出席董事 7 人。本次会议召开符合《公司法》和《公司章程》的有关规定，是合法、有效 的。会议由公司董事长杨云春主持，经与会董事表决，审议通过了以下议案： 1、《关于<2024 年度董事会工作报告>的议案》 经与会董事讨论，认为董事会严格按照相关法律、行政法规和中国证券监督 管理委员会的规定，认真落实和执行了股东大会的有关决议，较好地完成了公司 董事会的各项工作。该报告内容真实地反映了公司董事会2024年运行的实际情况。 公司独立董事刘婷女士、王玮先生、付三中先生分别向董事会递交了《2024 年度独立董事述职报告》，并将在公司2024年年度股东大会上进行述 ...

关于 2024 年度拟不进行利润分配的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 一、审议程序 北京赛微电子股份有限公司（以下简称"公司"）于 2025 年 3 月 19 日召开 第五届董事会第十三次会议及第五届监事会第十二次会议，分别审议通过了《关 于<2024 年度利润分配预案>的议案》。该事项已经公司独立董事专门会议审议通 过，尚需提交公司 2024 年年度股东大会审议。 二、2024 年利润分配预案的基本情况 证券代码：300456 证券简称：赛微电子 公告编号：2025-010 北京赛微电子股份有限公司 鉴于公司 2024 年度发生亏损，未能实现盈利，在综合考虑公司实际经营发 展情况和资金需求，以及公司长期发展规划的情况下，公司 2024 年度利润分配 预案为：2024 年度不派发现金红利，不送红股，不以资本公积转增股本。 三、2024 年利润分配预案说明 | 项目 | 本年度 | 上年度 | 上上年度 | | --- | --- | --- | --- | | 现金分红总额（元） | 0 | 25,627,457.22 | 0 | | 回 ...

Financial Performance - In 2024, the company reported a net loss, primarily due to the ongoing ramp-up of its Beijing MEMS production line (Beijing FAB3), which led to increased operational expenses and depreciation, offsetting profits from the Swedish production line [4]. - The company's operating revenue for 2024 was CNY 1,204,715,636.91, a decrease of 7.31% compared to CNY 1,299,682,668.54 in 2023 [30]. - The net profit attributable to shareholders for 2024 was CNY -169,994,109.70, representing a decline of 264.07% from CNY 103,613,168.56 in 2023 [30]. - The gross margin for the year was reported at 40%, an improvement from 35% in the previous year [24]. - The company reported a basic earnings per share of CNY -0.2322 for 2024, a decrease of 263.98% from CNY 0.1416 in 2023 [30]. - The company achieved operating revenue of 1,204.72 million yuan, a decrease of 7.31% compared to the previous year [85]. - The net profit attributable to shareholders was -169.99 million yuan, a significant decline of 264.07% year-on-year [85]. - The company reported a significant increase in cash flow from operating activities in the second quarter of 2024, amounting to CNY 173,692,479.91 [32]. Research and Development - R&D expenses increased from 357 million RMB in the previous year to 455 million RMB, maintaining a high investment intensity [4]. - R&D expenses as a percentage of revenue were 44.01%, 27.44%, and 37.75% for the years 2022, 2023, and 2024 respectively, indicating a high commitment to innovation despite potential risks [8]. - The company has invested RMB 200 million in new technology development, focusing on advanced semiconductor materials [24]. - The company reported R&D investment of approximately ¥454.83 million in 2024, representing 37.75% of its operating revenue, a significant increase from 27.44% in 2023 [112]. - The company is focusing on the development of new technologies, such as GaN transistors and MEMS devices, to enhance its product offerings [125]. - The company has filed multiple patents, including 138 new patents in various technology areas, indicating a strong focus on innovation and R&D [119]. Market Trends and Opportunities - The MEMS industry remains in a high-growth phase, with no signs of overcapacity or significant decline, suggesting long-term competitive advantages for the company [5]. - The global semiconductor market is projected to grow by 19.1% in 2024, reaching a sales scale of USD 627.6 billion [40]. - The global MEMS market size is forecasted to rise from $14.6 billion in 2023 to $20 billion by 2029, with a CAGR of 5% [42]. - The MEMS industry is projected to see a rapid expansion in pure MEMS foundry services, reflecting a shift towards outsourcing and specialization in manufacturing [173]. - The company is positioned to leverage the expanding market opportunities in the MEMS sector, supported by a robust policy environment and growing application needs [46]. Strategic Initiatives - The company plans not to distribute cash dividends or issue bonus shares [13]. - The company is expanding its MEMS foundry capacity in response to growing market demand, but faces uncertainties due to difficulties in technology transfer from Sweden [10]. - The company is expanding its market presence in Europe, targeting a 30% increase in market share within the next two years [24]. - A strategic acquisition of a semiconductor technology firm was completed, expected to enhance R&D capabilities and product offerings [24]. - The company is actively pursuing mergers and acquisitions to enhance efficiency in its industry chain and business expansion [179]. Operational Challenges - The company faces risks from international political and economic fluctuations, which could impact its operations and financial performance due to its significant foreign revenue exposure [6]. - The company has faced uncertainty regarding its ability to continue as a going concern, as indicated by the negative net profit figures over the past three years [30]. - The construction of the 8-inch MEMS foundry line is facing risks of underutilization due to difficulties in technology transfer from Sweden's Silex and uncertainties in market demand [186]. - The MEMS advanced packaging testing project may experience short-term underutilization of new capacity as the transition from potential to actual customers is uncertain [187]. Sustainability and Governance - The management highlighted a commitment to sustainability, aiming for a 50% reduction in carbon emissions by 2025 [24]. - The company is committed to enhancing shareholder value through sustainable growth and profitability initiatives [125]. - The company has strengthened its internal control systems and governance structure to ensure compliance with relevant laws and regulations [199]. - The company is focused on sustainable long-term development, contributing to market stability and investor confidence [196]. Customer and Market Engagement - User data indicates an increase in active users by 25% compared to the previous year, reaching a total of 500,000 users [24]. - The company has a strong customer base in the MEMS sector, serving both large enterprises and innovative startups across various industries, including communication, biomedical, and consumer electronics [81]. - The company’s top five customers accounted for 37.14% of total annual sales, with the largest customer contributing 11.45% [105]. Financial Management - The company has obtained multiple patents in 2024, including a method for wafer cavity preparation and a method for preparing polycrystalline silicon films [124]. - The company is emphasizing prudent management of raised funds to ensure project quality and cost efficiency, resulting in interest income from fund deposits [160]. - The total investment amount for the reporting period was ¥611,420,297.35, a decrease of 45.65% compared to the previous year's investment of ¥1,124,917,647.94 [138].

证券代码：300456 证券简称：赛微电子 公告编号：2025-004 公司持股 5%以上股东国家集成电路产业投资基金股份有限公司保证向 本公司提供的信息内容真实、准确、完整，没有虚假记载、误导性陈述或重 大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息 一致。 北京赛微电子股份有限公司（以下简称"公司"）于 2024 年 10 月 16 日在巨 潮资讯网（http://www.cninfo.com.cn）披露了《关于持股 5%以上股东减持计划 的预披露公告》（公告编号：2024-080），公司持股 5%以上股东国家集成电路产业 投资基金股份有限公司（以下简称"国家集成电路基金"）计划自本公告披露之 日起十五个交易日后的三个月内，通过集中竞价和大宗交易方式减持公司股份合 计不超过 10,983,196 股，即不超过公司总股本的 1.5%，其中通过集中竞价方式 减持不超过 7,322,131 股，即不超过公司总股本的 1%；通过大宗交易方式减持 不超过 3,661,065 股，即不超过公司总股本的 0.5%。 2025 年 2 月 7 日，公司收到国家集成电路基金提供的《关于股份减持结果 ...

证券代码：300456 证券简称：赛微电子 公告编号：2025-003 北京赛微电子股份有限公司 关于控股股东股票质押式回购交易提前购回的公告 2、截至本公告披露日，公司控股股东、实际控制人杨云春先生所持股份的 累计质押情况如下： | | | | | 占其 | 占公司 | 已质押股份情况 | | 未质押股份情况 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 股东 名称 | 持股数量 （股） | 持股 比例 | 累计质押/冻 结/拍卖等数 | 所持 股份 | 总股本 比例 | 已质押股份 | 占已质 | 未质押股份 | 占未质押 | | | | （%） | 量（股） | 比例 | （%） | 限售和冻结 | 押股份 | 限售和冻结 | 股份比例 | | | | | | （%） | | 数量（股） | 比例（%） | 数量（股） | （%） | | 杨云春 | 179,076,719 24.46 | | 89,450,000 | 49.95 | 12.22 | 50,480,000 | 56.43 | 83,827,539 ...

证券时报e公司讯，赛微电子在机构调研时表示，随着万物互联与智能传感时代的到来，物理世界与数 字世界需要相互连接的桥梁，无论科技及应用如何发展，均离不开对真实世界的感知，人、设备、自然 世界之间及内部各自之间的感知、联系均需要通过声、热、光、电、磁、运动等等各种基础器件来辅助 实现，基础感知及执行器件的应用场景将越来越丰富，通过半导体工艺批量标准化制造的MEMS芯片， 具备小型化、低成本、低功耗、高集成度等突出特点，正在对部分传统传感器件进行渗透及替代。 相比IC芯片产业的规模体量，MEMS芯片产业仍处于发展初期，未来发展前景广阔。 近年来，公司MEMS业务持续增长，客户及晶圆品类持续增加，境内外产线均呈现出积极向上的发展态 势。 公司于近期公布的2024年度业绩预告数据也反映了这一点。 公司的角色是MEMS晶圆制造厂商，为下游各领域客户提供优质的工艺开发及晶圆制造服务。 公司MEMS业务的收入结构主要包括通讯、生物医疗、工业汽车和消费电子四大领域。 ...

1 也比较熟悉；在公司看来，每家公司的业务发展模式都是根据 自身的资源及业务特点确定的，公司非常尊重各类厂商（包括 客户）自身的战略考虑。但同时非常明显，半导体制造产线的 建设具有长周期、重资产投入的特点，且某单一领域设计公司 投资建设的自有产线一方面较难为同类竞争设计公司服务， 另一方面产线向其他产品品类拓展的难度也较大。而公司是 专业的纯代工企业，基于长期的工艺开发及生产实践，在同类 产品的代工业务方面能够积累较好的工艺技术，在制造环节 具有产品迭代和成本控制方面的服务优势，Fabless（无晶圆 厂）模式或 Fablite（轻晶圆厂）设计公司与我们合作，可以 避免巨大的固定资产投入，可以将资源更多地专注在产品设 计及迭代方面，并参与市场竞争。 证券代码：300456 证券简称：赛微电子 北京赛微电子股份有限公司 投资者关系活动记录表 编号：2025-001 投资者关系活动 类别 ■特定对象调研 □分析师会议 □媒体采访 □业绩说明会 □新闻发布会 □路演活动 ■现场参观 □其他 参与单位名称及 人员姓名 Obeikan Investment Group（沙特奥贝坎投资集团） Imtiaz Mahtab（ ...

Financial Performance - The company expects a net loss attributable to shareholders of between 139.88 million and 191.68 million yuan for the fiscal year 2024, a decline of 235% to 285% compared to the previous year[4]. - The net profit after deducting non-recurring gains and losses is projected to be a loss of between 154.05 million and 205.85 million yuan, representing a decrease of 1,989% to 2,625% year-over-year[4]. - Operating revenue is estimated to be between 1.17 billion and 1.30 billion yuan, compared to 1.30 billion yuan in the previous year[4]. - Non-recurring gains and losses are expected to impact the net profit by approximately 14.17 million yuan, compared to 95.46 million yuan in the previous year[8]. MEMS Business Performance - MEMS business revenue is expected to be between 984.12 million and 1.03 billion yuan, an increase from 855.76 million yuan in the previous year[4]. - The revenue from the Swedish MEMS production lines (FAB1&2) is projected to be between 805.39 million and 841.99 million yuan, up from 732.17 million yuan last year[7]. - The Beijing MEMS production line (FAB3) is expected to generate revenue between 171.24 million and 181.62 million yuan, significantly up from 103.78 million yuan in the previous year[4]. Market Challenges - The company has seen a decline of over 50% in sales from semiconductor equipment and satellite navigation businesses due to intensified competition in the domestic market[8]. Investment and Strategy - The company continues to increase investment in MEMS business, with rising sales, management, and R&D expenses[8]. - The company has a strong competitive advantage in MEMS technology, with a focus on expanding production capacity and maintaining active order growth in various application fields[7].

中国经济网北京1月2日讯 赛微电子(300456.SZ)于2024年12月31日发布关于控股股东、实际控制人减持 计划实施完毕的公告。 2024年12月31日，赛微电子收到控股股东、实际控制人、董事长、总经理杨云春出具的《关于减持计划 实施完毕的告知函》，截至公告披露日，杨云春已通过集中竞价方式累计减持其持有的赛微电子股份 5,270,000股，占赛微电子总股本的0.72%，未减持完的股份在计划减持期间内不再减持，杨云春本次减 持计划实施完毕。 经计算，杨云春本次减持金额合计为9821.89万元。 本次减持后，杨云春持有赛微电子179,076,719股，占赛微电子总股本比例24.46%。 赛微电子于2024年11月18日披露了《关于控股股东、实际控制人减持计划的预披露公告》（公告编号： 2024-094），杨云春计划自该公告披露之日起十五个交易日后的三个月内（窗口期不减持），通过集中 竞价方式减持不超过5,857,705股赛微电子股份，即不超过赛微电子总股本的0.80%。 2024年前三季度，赛微电子实现营业收入8.25亿元，同比下降9.26%；实现归属于上市公司股东的净利 润-1.18亿元；实现归属于上市公 ...

北京赛微电子股份有限公司（以下简称"公司"）于近日收到北京市科学技 术委员会、北京市财政局、国家税务总局北京市税务局联合颁发的《高新技术企 业证书》，具体情况如下： 企业名称：北京赛微电子股份有限公司 证书编号：GR202411003464 证券代码：300456 证券简称：赛微电子 公告编号：2024-107 北京赛微电子股份有限公司 关于公司再次通过高新技术企业认定的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有 虚假记载、误导性陈述或重大遗漏。 本次系公司持有的原高新技术企业证书有效期满后进行的重新认定，根据国 家有关规定，公司自本次通过高新技术企业认定起连续三年（2024 年至 2026 年） 可继续享受国家关于高新技术企业的税收优惠政策，即按照 15%的税率缴纳企业 所得税。本次通过高新技术企业资格的重新认定不影响公司 2024 年度已披露的 相关财务数据。 特此公告。 北京赛微电子股份有限公司董事会 2024 年 12 月 23 日 发证时间：2024 年 10 月 29 日 有效期：三年 ...