| 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 301308 | 江波龙 | 273.00 | 14.64% | 25.21万 | 65.41 Z | | 300456 | 赛微电子 | 53.65 | 11.35% | 129.50万 | 67.69亿 | | 688525 | 佰维存储 | 117.57 | 8.85% | 32.82万 | 37.87亿 | | 688702 | 盛科通信 | 140.92 | 7.19% | - 4.66万 | 6.39亿 | | 688347 | 华虹公司 | 114.81 | 4.87% | 22.35万 | 25.43亿 | | 688262 | 国芯科技 | 30.21 | 4.68% | 14.02万 | 4.21亿 | | 300672 | 国科 微 | 100.11 | 3.89% | 10.61万 | 10.53 乙 | | 688508 | 芯朋得微 | 60.36 | 3.80% | 4.80万 | 2.90亿 | | 688521 | ...

| 代码 | 名称 | 收盘价 | 涨跌幅 | 成交量(手) | 成交额(元) | | --- | --- | --- | --- | --- | --- | | 688325 | 赛微微电 | 101.20 | 18.82% | 4.75万 | 4.60亿 | | 688048 | 长光华芯 | 148.48 | 15.26% | 24.68万 | 34.62亿 | | 301308 | 江波龙 | 273.00 | 14.64% | 25.21万 | 65.41亿 | | 688498 | 源杰科技 | 668.00 | 11.54% | 5.02万 | 33.06亿 | | 300456 | 赛微电子 | 53.65 | 11.35% | 129.50万 | 67.69亿 | | 001309 | 德明利 | 222.42 | 10.00% | 17.14万 | 37.15亿 | | 688110 | 东芯股份 | 124.19 | 9.70% | 30.44万 | 36.64亿 | | 688525 | 佰维存储 | 117.57 | 8.85% | 32.82万 | 37.87亿 | | 68823 ...

New Stock Issuance - New stocks issued include 纳百川 (code: 301667) at an issuance price of 22.63 and 优迅股份 (code: 787807) at 51.66[1] Rights Issues and Announcements - 荃银高科 (code: 300087) has a tender offer period from December 4, 2025, to January 5, 2026[1] - 天普股份 (code: 605255) has a tender offer period from November 20, 2025, to December 19, 2025[1] Delisting and Special Notices - *ST广道 (code: 920680) will enter the delisting arrangement period starting December 11, 2025[1] - *ST苏吴 (code: 600200) will enter the delisting arrangement period starting December 9, 2025[1] Stock Performance Alerts - 赛微电子 (code: 300456) reported severe abnormal fluctuations[1] - 海王生物 (code: 000078) and 瑞达期货 (code: 002961) also reported significant fluctuations[1] Additional Stock Announcements - 航天发展 (code: 000547) and 顺灏股份 (code: 002565) have issued announcements regarding their stock performance[1]

Core Insights - The global OCS (Optical Circuit Switch) market is projected to grow from $0.7 billion in 2020 to $7.8 billion by 2025, with a compound annual growth rate (CAGR) of 62%, and is expected to reach $20.2 billion by 2031, with a CAGR of approximately 17.2% from 2025 to 2031 [1][2] Market Overview - The OCS market is currently concentrated, with the top four manufacturers expected to hold about 69% of the market share by 2025, with major players including Google and Coherent [1][2] - The OCS industry chain consists of upstream core components, midstream equipment integration, and downstream applications, with high technical barriers and many participants concentrated in single segments [2] Technical Advantages - OCS technology is ideal for AI model training due to its high bandwidth, low latency, and low power consumption, making it a preferred solution for interconnectivity [1] - OCS operates without the need for optical-electrical conversion and packet processing, providing advantages in reliability and hardware longevity [1] Application Scenarios - OCS is primarily applied in three scenarios within AI computing clusters: Scale-Up (enhancing single-node performance), Scale-Out (multi-node collaboration), and Scale-Across (interconnecting data centers) [1] - For instance, a Google TPU cluster with 4096 TPU v4 chips requires 48 OCS switches, demonstrating an 85:1 ratio of TPU to OCS, which improves to 192:1 with future expansions [1] Company Focus - Yingtang Zhikong is expanding from electronic component distribution to semiconductor design and manufacturing, planning to acquire Guilin Guanglong Integration by 2025 to strengthen its OCS capabilities [3] - Saiwei Electronics, a leader in MEMS technology, is set to begin mass production of MEMS-OCS in 2023, with a significant portion of its revenue (83%) coming from MEMS business, indicating strong growth potential in the AI computing sector [3]

Core Insights - The report from Huazhong Securities highlights the increasing demand for Optical Circuit Switches (OCS) due to the high requirements of AI large model training for communication bandwidth, latency, and power consumption [1][3] - The global OCS market is projected to grow from $0.07 billion in 2020 to $0.78 billion by 2025, with a compound annual growth rate (CAGR) of 62% [3] - The OCS industry chain consists of upstream core components, midstream equipment integration, and downstream applications, with high technical barriers and significant value concentration in upstream components [4] Market Growth - The OCS market is expected to reach $2.02 billion by 2031, with a CAGR of approximately 17.2% from 2025 to 2031 [3] - Major players in the market include Google and Coherent, with the top four companies expected to hold about 69% of the market share by 2025 [3] Applications and Efficiency - OCS is primarily applied in three scenarios within AI computing clusters: Scale-Up, Scale-Out, and Scale-Across, showcasing its efficiency in expanding TPU cluster capabilities [2] - For instance, a Google TPU cluster with 4096 TPU v4 chips requires 48 OCS switches, demonstrating a TPU to OCS ratio of 85:1, which improves to 192:1 with future upgrades [2] Industry Participants - Companies like Yintan Zhikong and Saiwei Electronics are positioned to benefit from the OCS market growth, with Yintan focusing on semiconductor design and manufacturing, and Saiwei leading in MEMS technology [5] - Yintan plans to acquire Guilin Guanglong Integration to enhance its OCS capabilities, while Saiwei is set to start mass production of MEMS-OCS, capitalizing on the expanding AI computing demand [5]

(一)重要市场新闻 2、2025培育钻石产业大会6日在郑州启幕，现场签约30个全产业链项目，总投资额不低于150亿元。此 次大会还发布了《2025培育钻石产业发展报告》，并举办产业对话会及产教融合对接会等活动。依托7 家超硬材料领域国家级研发平台，郑州在高温高压法，大功率化学气相沉积法等关键技术上持续领先， 并拓展至散热、光学等高端应用领域。河南省中原珠宝创新产业（300832）研究院院长张杰在大会上介 绍，当前中国培育钻石市场规模约140亿元，预计到2030年将超过1025亿元，中国将是培育钻石市场规 模快速增长的千亿蓝海。 点评：随着5G通信、人工智能、云计算等技术的爆发式发展，算力呈指数级增长，对散热能力提出更 高需求。而金刚石散热在高算力场景中具有超高导热率，出色的热稳定性，与材料兼容性好等显著优 势。科技巨头已在尝试金刚石散热技术。未来随着金刚石散热方案不断完善，有望重构散热技术全球竞 争格局，而我国为世界超硬材料生产大国，其人造金刚石的产量位居全球第一，产业链优势明显，有望 充分受益。概念股包括国机精工（002046）、四方达（300179）、黄河旋风（600172）等。 3、中国电信（60172 ...

Group 1: Optical Modules - The optical module industry is experiencing the highest growth and performance realization among AI hardware this year, driven by high verification barriers for North American CSP tech giants and increasing demand due to the acceleration of supernode technology [2][4] - The average ratio of optical modules to GPUs is continuously increasing, with demand for 800G and 1.6T optical modules being revised upwards, indicating a strong upward resonance in demand [2][4] - By 2026, the demand for 1.6T optical modules is expected to exceed 30 million units, with an average price of $900-1000 per unit, while high-end EML optical chips are projected to face a 25-30% supply shortage [4][5] Group 2: Liquid Cooling - The liquid cooling industry has seen fluctuating trends this year, with initial enthusiasm dampened by low penetration rates, followed by a resurgence in August and significant breakthroughs in November [5][9] - The demand for liquid cooling in North America is expected to expand rapidly by 2026, with penetration rates in the NVIDIA ecosystem projected to rise from 20-30% to over 80-90% [7][9] - A leading domestic manufacturer is anticipated to capture a market share of 13-17% in North America by 2026, with Google expected to implement liquid cooling solutions for over 200,000 TPU V7 chips, creating a market space exceeding $24-28 billion [9][10] Group 3: AI PCB - The AI PCB industry is thriving, with companies like Shenghong, Huidian, and Shengyi achieving performance realization in North America, despite some quarterly fluctuations [10][12] - The supply side is seeing an increase in product value and manufacturing difficulty due to upgrades in customer chips and cabinet solutions, leading to a marginal differentiation in the supply landscape [10][12] - By 2026, the introduction of orthogonal backplanes is expected to significantly increase unit value, with M9 material processing anticipated to break through, although mass production is expected to ramp up in 2027 [12][13] Group 4: Server Power Supply - The server power supply market has shown similar trends to liquid cooling, with initial excitement followed by a divergence in performance among manufacturers [13][14] - The supply side is dominated by Taiwanese manufacturers, with a high concentration of market share, while domestic manufacturers are expected to make significant breakthroughs in North America by 2026 [14][15] - The adoption of HVDC technology is projected to replace traditional UPS solutions, with an expected market scale exceeding $20-30 billion by 2026 [15]

每经头条（nbdtoutiao）——秒光、售罄！银行大额存单成稀缺资源，2%以上产品很难抢，有的门槛高 达1000万元！专家：存款利率或长期下行 每经AI快讯，赛微电子（SZ 300456，收盘价：48.18元）12月5日晚间发布公告称，北京赛微电子股份 有限公司于2025年12月5日收到公司董事、总经理、董事会秘书张阿斌先生及副总经理周家玉女士、刘 波先生《关于股份减持计划的告知函》，其计划自本公告发布之日起十五个交易日后的三个月内，以集 中竞价方式减持公司股份合计不超过约15万股，占公司总股本的0.021%。 截至发稿，赛微电子市值为353亿元。 （记者 曾健辉） ...

格隆汇12月5日丨赛微电子(300456.SZ)公布，收到公司董事、总经理、董事会秘书张阿斌先生及副总经 理周家玉女士、刘波先生《关于股份减持计划的告知函》，其计划自本公告发布之日起十五个交易日后 的三个月内（即2025年12月29日-2026年3月28日，且窗口期不减持），以集中竞价方式减持公司股份合 计不超过152,172股，占公司总股本的0.021%。 ...

炒股就看金麒麟分析师研报，权威，专业，及时，全面，助您挖掘潜力主题机会！ 据统计，12月5日，盘后美利信披露增持情况。赛微电子、天赐材料、欧晶科技、粤万年青、新媒股 份、赛力斯、全新好、明新旭腾、东星医疗、爱旭股份、电魂网络、隆华新材、超捷股份、永鼎股份、 多氟多、创耀科技、安德利、统一股份、希荻微、科林电气、合兴包装等21家上市公司披露减持情况。 | | | 12月5日上市公司盘后增持情况 | | --- | --- | --- | | 1 | 美利信 | 控股股东拟5000万元-1亿元增持公司股份 | | | | 12月5日上市公司盘后减持情况 | | 1 | 塞微电子 | 董事、高管拟合计减持不超15.22万股 | | 2 | 天赐材料 | 董事和高级管理人员拟合计减持不超92.4万股公司股份 | | 3 | 欧晶科技 | 股东万兆慧谷拟减持不超3%公司股份 | | 4 | 粤万年青 | 合和投资12月3日-4日减持218.39万股 | | 5 | 新媒股份 | 股东横琴红土融耀拟减持不超0.11%股份 | | e | 塞力斯 | 非执行董事周昌玲计划减持不超0.000057%股份 | | 7 | 全新 ...