| 证券代码：300480 | 证券简称：光力科技 | 公告编号：2025-085 | | --- | --- | --- | | 债券代码：123197 | 债券简称：光力转债 | | 光力科技股份有限公司 关于部分闲置募集资金进行现金管理到期收回的公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 光力科技股份有限公司（以下简称"公司"）于 2025 年 9 月 21 日召开第五 届董事会第二十四次会议审议通过了《关于继续使用部分闲置募集资金进行现金 管理的议案》，同意公司全资子公司光力瑞弘电子科技有限公司（以下简称"光 力瑞弘"）在不影响募集资金投资项目正常实施的前提下，继续使用不超过人民 币 35,000.00 万元的闲置募集资金进行现金管理，使用期限自公司董事会审议通 过之日起十二个月内有效，在上述使用期限及额度范围内，资金可以循环滚动使 用。具体内容详见公司于 2025 年 9 月 23 日在巨潮资讯网（www.cninfo.com.cn） 披露的相关公告。 近日，公司在授权范围内使用部分闲置募集资金进行现金管理已到期收回， 现就有关进展情况公告 ...

Core Viewpoint - The demand for semiconductor equipment has significantly increased since July, leading to a reduction in delivery cycles and full production capacity for the company's domestic semiconductor slicing machines, prompting plans for a second phase of expansion [2][3]. Semiconductor Equipment Demand - The company has observed a strong demand for semiconductor equipment, with a notable increase in shipment volumes starting from the third quarter of this year, and this growth trend is expected to continue until 2026 [3]. - The company's semiconductor packaging and testing equipment includes precision processing equipment, high-performance air spindles, and consumables, establishing a competitive advantage in the semiconductor slicing field [3]. Market and Product Focus - The company's semiconductor packaging and testing equipment primarily serves OSAT and IDM manufacturers in Europe, Southeast Asia, and China, providing solutions in the slicing and grinding domain [4]. - The air spindle, a core component of the company's products, is also applicable in various precision manufacturing fields beyond semiconductors, with successful deliveries across multiple sectors [4]. Mergers and Acquisitions - The company has made three overseas acquisitions post-IPO, integrating technology and channels in the semiconductor equipment market, particularly in the wafer slicing sector [5]. - The acquired subsidiary ADT is among the top three global semiconductor slicing machine manufacturers, while the UK subsidiary LP is recognized for its pioneering work in air spindles [5]. Technological Advancements - The company is focused on high-precision slicing machines, which are critical for chip quality and production costs, utilizing advanced technologies such as high-precision air spindles and automated systems [6]. - The company aims to leverage its R&D capabilities across the UK, Israel, and China to enhance customer service and meet market demands effectively [6]. AI Integration - The company is advancing its "Artificial Intelligence+" initiative, integrating AI into manufacturing processes to enhance operational efficiency and drive strategic upgrades from equipment providers to intelligent solution service providers [7]. - AI is seen as a core driver for the company's growth, particularly in the context of the semiconductor industry's recovery, influencing the decision to initiate a second phase of production expansion [7]. - The integration of AI and large model technologies is also being applied internally to improve R&D and operational processes, thereby reducing costs and enhancing innovation focus [8].

Core Insights - The company has observed a significant increase in demand for semiconductor equipment since July, with shorter delivery cycles and full production capacity for its domestic semiconductor slicing machines, prompting plans for a second phase of expansion [1] - The semiconductor equipment sector is seen as a key indicator of the semiconductor industry's health, with expectations of overall recovery starting in 2024 and a substantial increase in equipment shipments beginning in Q3 of this year, likely continuing until 2026 [1] Semiconductor Equipment Demand - The company's semiconductor packaging and testing equipment includes precision processing equipment, high-performance air spindles, and consumables, establishing a competitive advantage in the semiconductor slicing field [2] - The company serves OSAT and IDM manufacturers in markets including Europe, Southeast Asia, and China, providing solutions in slicing and grinding, with its air spindle technology applicable in various precision manufacturing sectors [2] Mergers and Acquisitions - Following its IPO, the company made three overseas acquisitions to integrate technology and channels in the semiconductor equipment market, particularly in the wafer slicing sector, and has achieved initial mass production of high-end slicing machines through independent R&D [2][3] R&D and Technology Development - The company faced challenges in replicating technologies from acquired firms and opted to learn from the ground up, aligning its R&D with international standards [3] - The acquired subsidiary ADT is a leading player in semiconductor slicing machines, while the UK subsidiary LP is recognized for its innovations in air spindle technology [3] Product and Market Strategy - The company aims to leverage its R&D capabilities across the UK, Israel, and China, utilizing the advantages of its subsidiaries to enhance customer response and service capabilities [4] - The company is committed to integrating AI into its operations, viewing it as a core driver for transitioning from an equipment provider to an intelligent solution service provider [5] AI Integration and Innovation - The company is optimistic about the semiconductor industry's recovery, which is a key reason for its rapid expansion plans, and is focused on deep integration of AI with its core technologies and market demands [5] - AI is being utilized to enhance the company's IoT systems, transforming them from passive monitoring to proactive warning and decision support systems, significantly improving service value for mining clients [6]

Core Viewpoint - The demand for semiconductor equipment has significantly increased since July, leading to shorter delivery cycles and full production capacity for the company's domestic semiconductor slicing machines, prompting plans for a second phase of expansion [1][2]. Semiconductor Equipment Demand - The company has observed a strong demand for semiconductor equipment, with a notable increase in shipment volumes starting from the third quarter of this year, and this growth trend is expected to continue until 2026 [2]. - The company's semiconductor packaging and testing equipment includes precision processing equipment and high-performance air spindles, which have gained widespread recognition and repeat orders from leading packaging enterprises and clients in new technology fields [2]. Market and Product Focus - The company's semiconductor packaging and testing equipment primarily targets OSAT and IDM manufacturers in Europe, Southeast Asia, and China, providing solutions in the slicing and grinding domain [3]. - The air spindle, a core component of the company's products, is not only used in the semiconductor sector but also serves a broader range of precision manufacturing applications [3]. Mergers and Acquisitions - The company has made three overseas acquisitions post-IPO, including Loadpoint Limited and ADT, to quickly penetrate the global semiconductor equipment market and integrate technology and channels in the wafer slicing sector [4]. - Following these acquisitions, the company focused on learning and overcoming various technical challenges to achieve high-end slicing machine mass production [4]. Subsidiary Contributions - ADT, a wholly-owned subsidiary, ranks among the top three semiconductor slicing machine manufacturers globally and is recognized for its cutting precision [5]. - The UK subsidiary, LP, is the inventor of the semiconductor slicing machine and has maintained a leading position in developing high-performance air spindles and related components [5]. R&D and Collaboration - The company plans to leverage the collaborative advantages of its R&D teams in the UK, Israel, and China to enhance customer response and service capabilities through a dual-circulation production and marketing model [6]. AI Integration - The company is advancing its "Artificial Intelligence+" initiative, integrating AI as a core driver in its business development, particularly in the semiconductor industry [8]. - AI is viewed not just as a tool but as a key engine for the company's strategic upgrade from an equipment and system provider to an intelligent solution service provider [8]. - The integration of AI with internal R&D and operational processes aims to enhance automation, reduce operational costs, and allow teams to focus on high-value innovation and customer service [9].

证券日报网讯12月23日，光力科技（300480）在互动平台回答投资者提问时表示2025年12月19日，公司 股东人数约为2.5万户。 ...

Group 1: Company Overview - Guangli Technology Co., Ltd. is involved in semiconductor packaging and testing equipment and IoT security production monitoring equipment [1] - The company has achieved batch sales of domestic semiconductor cutting equipment, comparable to international competitors in stability, cutting quality, and efficiency [2][3] Group 2: Market Presence - The company's products are sold in global markets, including the US, Europe, and Southeast Asia, with positive customer feedback [3] - The subsidiary ADT has successfully marketed its series products (71XX, 79XX, 80XX) in overseas markets [3] Group 3: Product Offerings - The company offers a variety of consumables, including soft blades, hard blades, flanges, and grinding plates, with a high adaptability to mainstream cutting machines [3] - Customizable cutting blades are available, with thousands of models to meet diverse customer needs [3] Group 4: Financial Performance - Since July 2025, the company has entered a full production state, leading to rapid growth in its semiconductor packaging business, as reflected in the third-quarter report with both quarter-on-quarter and year-on-year revenue increases [3] - The controlling shareholder has terminated the share reduction plan ahead of schedule, with no further reductions planned during the remaining period [4]

光力科技公告，控股股东、实际控制人赵彤宇及其一致行动人宁波万丰隆贸易有限公司计划在预披露公 告发布之日起15个交易日后的3个月内以大宗交易方式合计减持公司股份不超过702.79万股（占总股本 的2%）。赵彤宇于2025年10月14日至2025年11月25日通过大宗交易方式累计减持公司股份623万股，占 公司总股本的1.77%。赵彤宇及其一致行动人决定提前终止本次股份减持计划，未完成减持的股份在剩 余减持计划期间内将不再减持。 ...

| 证券代码：300480 | 证券简称：光力科技 | 公告编号：2025-084 | | --- | --- | --- | | 债券代码：123197 | 债券简称：光力转债 | | 光力科技股份有限公司 关于控股股东、实际控制人及其一致行动人 提前终止减持计划暨减持股份结果的公告 控股股东、实际控制人赵彤宇先生及其一致行动人宁波万丰隆贸易有限公司 保证向公司提供的信息内容真实、准确、完整，没有虚假记载、误导性陈述或 重大遗漏。 本公司及董事会全体成员保证公告内容与信息披露义务人提供的信息一致。 光力科技股份有限公司（以下简称"公司"）于 2025 年 9 月 9 日在巨潮资讯 网披露了《关于控股股东、实际控制人及其一致行动人减持公司股份的预披露公 告》（公告编号：2025-059，以下简称"预披露公告"），赵彤宇先生及其一致行 动人宁波万丰隆贸易有限公司（以下简称"万丰隆"）计划在预披露公告发布之 日起 15 个交易日后的 3 个月内以大宗交易方式合计减持公司股份不超过 7,027,911 股（占总股本的 2%）。 公司于近日收到控股股东、实际控制人赵彤宇先生及其一致行动人万丰隆出 具的《提前终止减持计 ...

证券日报网讯12月11日，光力科技（300480）在互动平台回答投资者提问时表示，2025年12月10日，公 司股东人数约为2.5万户。 ...

2025 年 12 月 09 日 公司研究●证券研究报告 光力科技（300480.SZ） 公司快报 深化封测切割/减薄，在手订单持续稳定增长 投资要点 产品线不断丰富，ADT 整体经营情况逐步恢复以前年度水平。公司半导体封测装 备主要应用于封测中的晶圆切割、封装体切割、晶圆减薄工艺环节。对应两大类设 备，分别是切割划片机和减薄机。公司生产的半导体切割划片机广泛应用于集成电 路、功率半导体器件、MiniLED、传感器等多种产品，可以实现对硅、碳化硅、氮 化镓、砷化镓、蓝宝石、陶瓷、水晶、石英、玻璃等多种材料的划切，已成功应用 于先进封装中划切工艺。晶圆减薄工艺主要应用在封装测试和晶圆材料生产中，目 前在部分功率半导体的晶圆制造环节也是不可或缺的，公司研发生产的减薄机已应 用于硅、碳化硅晶圆的减薄工艺。公司紧跟行业发展趋势和市场需求变化，不断丰 富产品线，推动产品的升级迭代和新产品、新工艺的开发，初步完成了机械切割、 激光切割、研磨设备布局，公司开发的用于基板切割的 JIG SAW 7260 和用于 DBG 工艺且更加智能的 8231 均在验证中，用于半导体 Low-K 开槽的激光划片机 9130 和用于超薄晶圆 ...