| 证券代码：300480 | 证券简称：光力科技 | 公告编号：2026-001 | | --- | --- | --- | | 债券代码：123197 | 债券简称：光力转债 | | 光力科技股份有限公司 2025 年第四季度可转换公司债券转股情况公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假 记载、误导性陈述或重大遗漏。 重要内容提示： 1、"光力转债"（债券代码：123197）转股期限为 2023 年 11 月 13 日至 2029 年 5 月 7 日。 2、最新转股价格为 21.15 元/股。 3、转股股份来源：优先使用回购库存股，不足部分使用新增股份。 4、2025 年第四季度，共有 10 张"光力转债"完成转股（票面金额共计 1,000 元人民币），合计转为 47 股"光力科技"股票（股票代码：300480）。 5、截至 2025 年第四季度末，公司剩余可转换公司债券为 3,995,419 张，剩 余票面总金额为人民币 399,541,900 元。 根据《深圳证券交易所创业板股票上市规则》和《深圳证券交易所上市公司 自律监管指引第 15 号——可转换公司债券》的有关规定 ...

| 证券代码：300480 | 证券简称：光力科技 | 公告编号：2026-002 | | --- | --- | --- | | 债券代码：123197 | 债券简称：光力转债 | | 光力科技股份有限公司 关于使用部分闲置募集资金进行现金管理的进展公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 光力科技股份有限公司（以下简称"公司"）于 2025 年 9 月 21 日召开第五 届董事会第二十四次会议审议通过了《关于继续使用部分闲置募集资金进行现金 管理的议案》，同意公司全资子公司光力瑞弘电子科技有限公司（以下简称"光 力瑞弘"）在不影响募集资金投资项目正常实施的前提下，继续使用不超过人民 币 35,000.00 万元的闲置募集资金进行现金管理，使用期限自公司董事会审议通 过之日起十二个月内有效，在上述使用期限及额度范围内，资金可以循环滚动使 用。具体内容详见公司于 2025 年 9 月 23 日在巨潮资讯网（www.cninfo.com.cn） 披露的相关公告。 近日，公司在上述决议授权范围、授权期限内使用部分暂时闲置募集资金购 买了银行理财产品，现 ...

1月5日，光力科技盘中上涨2.03%，截至11:06，报17.05元/股，成交6855.22万元，换手率1.64%，总市 值60.16亿元。 资金流向方面，主力资金净流出71.30万元，大单买入1363.68万元，占比19.89%，卖出1434.98万元，占 比20.93%。 光力科技今年以来股价涨2.03%，近5个交易日跌0.06%，近20日涨8.60%，近60日跌8.73%。 资料显示，光力科技股份有限公司位于河南省郑州高新开发区长椿路10号，成立日期1994年1月22日， 上市日期2015年7月2日，公司主营业务涉及安全生产监控装备业务和半导体封测装备业务。主营业务收 入构成为：安全生产监控类产品51.26%，半导体封测装备类产品44.79%，其他(补充)3.95%。 光力科技所属申万行业为：机械设备-专用设备-能源及重型设备。所属概念板块包括：节能环保、机器 人概念、集成电路、华为概念、半导体等。 截至12月19日，光力科技股东户数2.50万，较上期增加0.00%；人均流通股9901股，较上期增加0.00%。 2025年1月-9月，光力科技实现营业收入4.60亿元，同比增长20.75%；归母净利润36 ...

Group 1 - The company, Guangli Technology, has sufficient orders on hand and has entered a state of full production since the third quarter, with a noticeable acceleration in the delivery speed of its core domestic semiconductor equipment [1] - The company continues to receive an increasing number of new orders [1]

| 证券代码：300480 | 证券简称：光力科技 | 公告编号：2025-085 | | --- | --- | --- | | 债券代码：123197 | 债券简称：光力转债 | | 光力科技股份有限公司 关于部分闲置募集资金进行现金管理到期收回的公告 本公司及董事会全体成员保证信息披露的内容真实、准确和完整，没有虚 假记载、误导性陈述或重大遗漏。 光力科技股份有限公司（以下简称"公司"）于 2025 年 9 月 21 日召开第五 届董事会第二十四次会议审议通过了《关于继续使用部分闲置募集资金进行现金 管理的议案》，同意公司全资子公司光力瑞弘电子科技有限公司（以下简称"光 力瑞弘"）在不影响募集资金投资项目正常实施的前提下，继续使用不超过人民 币 35,000.00 万元的闲置募集资金进行现金管理，使用期限自公司董事会审议通 过之日起十二个月内有效，在上述使用期限及额度范围内，资金可以循环滚动使 用。具体内容详见公司于 2025 年 9 月 23 日在巨潮资讯网（www.cninfo.com.cn） 披露的相关公告。 近日，公司在授权范围内使用部分闲置募集资金进行现金管理已到期收回， 现就有关进展情况公告 ...

Core Viewpoint - The demand for semiconductor equipment has significantly increased since July, leading to a reduction in delivery cycles and full production capacity for the company's domestic semiconductor slicing machines, prompting plans for a second phase of expansion [2][3]. Semiconductor Equipment Demand - The company has observed a strong demand for semiconductor equipment, with a notable increase in shipment volumes starting from the third quarter of this year, and this growth trend is expected to continue until 2026 [3]. - The company's semiconductor packaging and testing equipment includes precision processing equipment, high-performance air spindles, and consumables, establishing a competitive advantage in the semiconductor slicing field [3]. Market and Product Focus - The company's semiconductor packaging and testing equipment primarily serves OSAT and IDM manufacturers in Europe, Southeast Asia, and China, providing solutions in the slicing and grinding domain [4]. - The air spindle, a core component of the company's products, is also applicable in various precision manufacturing fields beyond semiconductors, with successful deliveries across multiple sectors [4]. Mergers and Acquisitions - The company has made three overseas acquisitions post-IPO, integrating technology and channels in the semiconductor equipment market, particularly in the wafer slicing sector [5]. - The acquired subsidiary ADT is among the top three global semiconductor slicing machine manufacturers, while the UK subsidiary LP is recognized for its pioneering work in air spindles [5]. Technological Advancements - The company is focused on high-precision slicing machines, which are critical for chip quality and production costs, utilizing advanced technologies such as high-precision air spindles and automated systems [6]. - The company aims to leverage its R&D capabilities across the UK, Israel, and China to enhance customer service and meet market demands effectively [6]. AI Integration - The company is advancing its "Artificial Intelligence+" initiative, integrating AI into manufacturing processes to enhance operational efficiency and drive strategic upgrades from equipment providers to intelligent solution service providers [7]. - AI is seen as a core driver for the company's growth, particularly in the context of the semiconductor industry's recovery, influencing the decision to initiate a second phase of production expansion [7]. - The integration of AI and large model technologies is also being applied internally to improve R&D and operational processes, thereby reducing costs and enhancing innovation focus [8].

Core Insights - The company has observed a significant increase in demand for semiconductor equipment since July, with shorter delivery cycles and full production capacity for its domestic semiconductor slicing machines, prompting plans for a second phase of expansion [1] - The semiconductor equipment sector is seen as a key indicator of the semiconductor industry's health, with expectations of overall recovery starting in 2024 and a substantial increase in equipment shipments beginning in Q3 of this year, likely continuing until 2026 [1] Semiconductor Equipment Demand - The company's semiconductor packaging and testing equipment includes precision processing equipment, high-performance air spindles, and consumables, establishing a competitive advantage in the semiconductor slicing field [2] - The company serves OSAT and IDM manufacturers in markets including Europe, Southeast Asia, and China, providing solutions in slicing and grinding, with its air spindle technology applicable in various precision manufacturing sectors [2] Mergers and Acquisitions - Following its IPO, the company made three overseas acquisitions to integrate technology and channels in the semiconductor equipment market, particularly in the wafer slicing sector, and has achieved initial mass production of high-end slicing machines through independent R&D [2][3] R&D and Technology Development - The company faced challenges in replicating technologies from acquired firms and opted to learn from the ground up, aligning its R&D with international standards [3] - The acquired subsidiary ADT is a leading player in semiconductor slicing machines, while the UK subsidiary LP is recognized for its innovations in air spindle technology [3] Product and Market Strategy - The company aims to leverage its R&D capabilities across the UK, Israel, and China, utilizing the advantages of its subsidiaries to enhance customer response and service capabilities [4] - The company is committed to integrating AI into its operations, viewing it as a core driver for transitioning from an equipment provider to an intelligent solution service provider [5] AI Integration and Innovation - The company is optimistic about the semiconductor industry's recovery, which is a key reason for its rapid expansion plans, and is focused on deep integration of AI with its core technologies and market demands [5] - AI is being utilized to enhance the company's IoT systems, transforming them from passive monitoring to proactive warning and decision support systems, significantly improving service value for mining clients [6]

Core Viewpoint - The demand for semiconductor equipment has significantly increased since July, leading to shorter delivery cycles and full production capacity for the company's domestic semiconductor slicing machines, prompting plans for a second phase of expansion [1][2]. Semiconductor Equipment Demand - The company has observed a strong demand for semiconductor equipment, with a notable increase in shipment volumes starting from the third quarter of this year, and this growth trend is expected to continue until 2026 [2]. - The company's semiconductor packaging and testing equipment includes precision processing equipment and high-performance air spindles, which have gained widespread recognition and repeat orders from leading packaging enterprises and clients in new technology fields [2]. Market and Product Focus - The company's semiconductor packaging and testing equipment primarily targets OSAT and IDM manufacturers in Europe, Southeast Asia, and China, providing solutions in the slicing and grinding domain [3]. - The air spindle, a core component of the company's products, is not only used in the semiconductor sector but also serves a broader range of precision manufacturing applications [3]. Mergers and Acquisitions - The company has made three overseas acquisitions post-IPO, including Loadpoint Limited and ADT, to quickly penetrate the global semiconductor equipment market and integrate technology and channels in the wafer slicing sector [4]. - Following these acquisitions, the company focused on learning and overcoming various technical challenges to achieve high-end slicing machine mass production [4]. Subsidiary Contributions - ADT, a wholly-owned subsidiary, ranks among the top three semiconductor slicing machine manufacturers globally and is recognized for its cutting precision [5]. - The UK subsidiary, LP, is the inventor of the semiconductor slicing machine and has maintained a leading position in developing high-performance air spindles and related components [5]. R&D and Collaboration - The company plans to leverage the collaborative advantages of its R&D teams in the UK, Israel, and China to enhance customer response and service capabilities through a dual-circulation production and marketing model [6]. AI Integration - The company is advancing its "Artificial Intelligence+" initiative, integrating AI as a core driver in its business development, particularly in the semiconductor industry [8]. - AI is viewed not just as a tool but as a key engine for the company's strategic upgrade from an equipment and system provider to an intelligent solution service provider [8]. - The integration of AI with internal R&D and operational processes aims to enhance automation, reduce operational costs, and allow teams to focus on high-value innovation and customer service [9].

证券日报网讯12月23日，光力科技（300480）在互动平台回答投资者提问时表示2025年12月19日，公司 股东人数约为2.5万户。 ...

Group 1: Company Overview - Guangli Technology Co., Ltd. is involved in semiconductor packaging and testing equipment and IoT security production monitoring equipment [1] - The company has achieved batch sales of domestic semiconductor cutting equipment, comparable to international competitors in stability, cutting quality, and efficiency [2][3] Group 2: Market Presence - The company's products are sold in global markets, including the US, Europe, and Southeast Asia, with positive customer feedback [3] - The subsidiary ADT has successfully marketed its series products (71XX, 79XX, 80XX) in overseas markets [3] Group 3: Product Offerings - The company offers a variety of consumables, including soft blades, hard blades, flanges, and grinding plates, with a high adaptability to mainstream cutting machines [3] - Customizable cutting blades are available, with thousands of models to meet diverse customer needs [3] Group 4: Financial Performance - Since July 2025, the company has entered a full production state, leading to rapid growth in its semiconductor packaging business, as reflected in the third-quarter report with both quarter-on-quarter and year-on-year revenue increases [3] - The controlling shareholder has terminated the share reduction plan ahead of schedule, with no further reductions planned during the remaining period [4]