宁波江丰电子材料股份有限公司 （4）具有《中华人民共和国公司法》规定的不得担任公司董事、高级管理 人员情形的； （5）法律法规规定不得参与上市公司股权激励的； （6）中国证监会认定的其他情形。 董事会薪酬与考核委员会关于第二期股权激励计划 预留授予限制性股票第三个解除限售期解除限售条件成就 的核查意见 宁波江丰电子材料股份有限公司（以下简称"公司"）于 2025 年 7 月 30 日 召开第四届董事会薪酬与考核委员会第七次会议，审议通过《公司第二期股权激 励计划预留授予限制性股票第三次解除限售被激励对象考核表》、《关于第二期股 权激励计划预留授予限制性股票第三个解除限售期解除限售条件成就的议案》。 根据《上市公司股权激励管理办法》（以下简称"《管理办法》"）、公司《第 二期股权激励计划》等法律法规、规范性文件的有关规定，经审阅相关资料，董 事会薪酬与考核委员会对公司第二期股权激励计划（以下简称"本次激励计划"） 预留授予限制性股票第三个解除限售期可解除限售的激励对象名单、考核表以及 解除限售条件成就情况进行了核查，并发表核查意见如下： 1、公司符合《管理办法》和公司《第二期股权激励计划》等法律法规、规 范性文 ...

Core Viewpoint - Jiangfeng Electronics (300666) announced on August 1 that its subsidiary Shenyang Ruijing plans to purchase 97 machine tools through a financing lease from its related party Shenyang Jiangfeng Tongchuang Precision Manufacturing Co., Ltd. to expand production capacity for semiconductor components, with a total assessed value of 233 million yuan [1] Group 1 - The transaction involves the acquisition of 97 machine tools [1] - The purpose of the acquisition is to support business expansion and capacity enhancement [1] - The total assessed value of the transaction is 233 million yuan [1]

江丰电子（300666）公告，公司控股子公司沈阳睿璟精密科技有限公司拟通过第三方以融资租赁方式向 关联方沈阳江丰同创精密制造有限公司购买设备，交易标的评估价值总计人民币2.33亿元。本次交易金 额参照评估结果定价，总计人民币2.33亿元。公司已于2025年8月1日召开第四届董事会第二十二次会 议，以8票同意、0票反对、0票弃权、1票回避审议通过了相关议案。 ...

（三）公司已于2025年8月1日召开第四届董事会第二十二次会议，以8票同 意、0票反对、0票弃权、1票回避审议通过了《关于公司控股子公司购买设备暨关 联交易的议案》，关联董事姚舜先生对上述议案回避表决。本议案已经公司第四 届董事会第十五次独立董事专门会议、第四届监事会第十九次会议审议通过。 关于公司控股子公司购买设备暨关联交易的公告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚 假记载、误导性陈述或重大遗漏。 证券代码：300666 证券简称：江丰电子 公告编号：2025-081 一、关联交易概述 （一）为满足子公司业务拓展及产能扩充的需要，宁波江丰电子材料股份有 限公司（以下简称"公司"或"江丰电子"）的控股子公司沈阳睿璟精密科技有 限公司（以下简称"沈阳睿璟"）拟通过第三方以融资租赁方式向公司关联方沈 阳江丰同创精密制造有限公司（以下简称"沈阳江丰同创"）购买设备（以下简 称"交易标的"）用于生产半导体零部件产品，交易标的评估价值总计人民币 23,307.84万元。本次交易金额参照评估结果定价，总计人民币23,307.84万元。 宁波江丰电子材料股份有限公司 （二）由于公司控股股东、实 ...

Core Insights - Ningbo Fengke Jingsheng Electronic Materials Co., Ltd. has been established with a registered capital of 200 million yuan, focusing on the research and development of electronic materials and manufacturing of semiconductor devices [1][2] Company Information - The company is wholly owned by Jiangfeng Electronics (300666) through indirect holdings [1] - The legal representative is Wang Xuezhe, and the company is registered in Yuyao City, Ningbo, Zhejiang Province [2] - The business scope includes manufacturing and sales of electronic materials, electronic components, and semiconductor device manufacturing and sales [2] Financial and Operational Details - The registered capital of the company is 200 million yuan, equivalent to approximately 28.5 million USD [1][2] - The company is classified under the computer, communication, and other electronic equipment manufacturing industry [2] - The business operations are set to continue indefinitely from the registration date [2]

Group 1: Company Performance Highlights - Jiangfeng Electronics (300666.SZ) achieved a revenue of 3.605 billion CNY in 2024, a year-on-year increase of 38.57%[9] - Lianhua Holdings (600186.SH) is expected to see a revenue growth of 35.09% from 2025 to 2027, with net profits projected at 335 million CNY in 2025[19] - Meige Intelligent (002881.SZ) forecasts revenues of 3.786 billion CNY in 2025, with net profits of 229 million CNY[22] - Foxit Software (688095.SH) anticipates a net profit of 33 million CNY in 2025, with a significant increase in subscription revenue[25] - Lanjian Intelligent (688557.SH) expects net profits of 162 million CNY in 2025, with a projected EPS of 1.59 CNY[34] - Western Mining (601168.SH) reported a revenue of 31.619 billion CNY in H1 2025, a year-on-year increase of 26.59%[36] Group 2: Market Trends and Opportunities - The global market for semiconductor precision components is projected to reach approximately 428.8 billion CNY by 2025, with China's market growing faster than the global average[12] - The AI and big data sectors are driving rapid growth in computing power demand, with the Chinese intelligent computing market expected to reach 1,037.3 EFLOPS by 2025[17] - The smart connected vehicle market is projected to grow from 2.3 billion CNY in 2020 to 5 billion CNY by 2024, with a compound annual growth rate of 21%[21] - The Chinese seasoning market is expected to continue expanding due to the rise of pre-packaged meals and digital marketing strategies[15]

Core Viewpoint - Silver alloy target materials are crucial conductive materials in semiconductor integrated circuits, with increasing demand driven by the growth of high-end electronic products and advancements in semiconductor technology [1][5][18]. Group 1: Market Overview - The market size for silver-based alloy targets in China is projected to reach approximately 135 million yuan in 2024, with a total consumption of 22.38 tons, and is expected to grow to 160 million yuan and 26.89 tons in 2025 [1][5][7]. - The G6.0 generation line is the primary consumer of silver alloy targets, utilizing 19.22 tons in 2024, which is expected to increase to about 23.56 tons in 2025 [7][18]. Group 2: Industry Chain - The upstream of the silver alloy target industry includes high-purity silver and alloy materials, involving silver mining and high-purity metal refining [9]. - The midstream consists of the manufacturing of silver alloy targets, which are widely used in high-end manufacturing sectors such as semiconductors, OLED displays, and energy industries [9][11]. Group 3: Production Process - The manufacturing process of silver alloy targets involves raw material purification, alloy melting, casting, forging, rolling, heat treatment, and machining, with impurity content and microstructure being critical factors affecting target quality [11][18]. Group 4: Competitive Landscape - The silver alloy target market is dominated by foreign companies, with Japan's Mitsubishi holding over 50% of the market share in 2024, followed by South Korea's LT at 34.95% and Germany's Materion at 6.8% [13][15]. - Domestic companies such as Fujian Astone and Shenzhen Top New Materials are in the early stages of research and development, focusing on alloying and preparation process control [15][18]. Group 5: Patent Technology - Various companies are developing innovative technologies for silver alloy targets, including methods to enhance mechanical properties and corrosion resistance through specific alloying elements [17]. Group 6: Industry Development Trends - The silver alloy target industry is characterized by high technical barriers and significant potential for domestic substitution, as China gradually advances in research and innovation in this field [18][20].

Key Points Summary - The article emphasizes the critical role of packaging materials in the integrated circuit industry, accounting for 40%-60% of total packaging costs, and highlights the urgent need for domestic alternatives due to foreign monopolies in high-end materials [3][6]. Group 1: Importance of Materials - Packaging materials are a key bottleneck in the development of the integrated circuit industry, comprising 40%-60% of total packaging costs [3][6]. Group 2: Urgency for Domestic Alternatives - High-end materials are dominated by Japanese and American companies, with low domestic production rates: photoresists (<2%), PSPI (93% by four foreign companies), and silicon powder (70% by Japanese companies) [3]. - The "Made in China 2025" policy is driving local companies to achieve technological breakthroughs, such as Dinglong Co. and Shanghai Xinyang [3]. Group 3: High-Growth Segments - Photo-sensitive materials: The global PSPI market is expected to grow at a CAGR of 25.16%, reaching $2.032 billion by 2029; the Chinese market for photoresists is projected to reach $5.95 million by 2025 [3][18]. - Epoxy molding compounds (EMC): The global market is expected to reach $9.9 billion by 2027, with advanced packaging EMC growing even faster [3]. - Silicon powder: The Chinese market is projected to grow at a CAGR of 22.3%, reaching $5.5 billion by 2025 [3]. - Electroplating and polishing liquids: Global copper electroplating liquids are expected to grow at a CAGR of 10.79%, while CMP polishing liquids in China are expected to grow at 15% [3]. Group 4: Core Materials and Technical Barriers - Photo-sensitive materials: PSPI and BCB are mainstream media for wafer-level packaging, with PSPI being a trend [3]. - Temporary bonding adhesives and underfill materials are critical for 3D packaging, with a market CAGR of 8.2% [3]. - TSV materials are dominated by foreign companies, with the highest cost share (34% for temporary bonding and electroplating) [3]. Group 5: Key Domestic Enterprises - Key players in photo-sensitive materials include Dinglong Co. (mass production of PSPI) and Qiangli New Materials (in certification phase) [3]. - In epoxy molding compounds, Huahai Chengke and Hengsu Huawai are notable companies [3]. - For silicon powder, Lianrui New Materials is focusing on domestic alternatives [3]. - In photoresists and electroplating liquids, Shanghai Xinyang and Tongcheng New Materials are key players [3]. - The fields with low domestic production rates (under 10%) include photoresists, PSPI, spherical silicon powder, and TSV materials, indicating significant replacement potential [3]. Group 6: Investment Logic - Focus on high-growth areas (PSPI, silicon powder), high barriers (photoresists), and high domestic replacement potential (EMC, electroplating liquids) [3].

Investment Rating - The report maintains a "Buy-A" investment rating for the company, with a target price of 83.27 CNY per share based on a PE valuation method of 40 times for 2025 [5][4]. Core Views - The company is positioned as a leading player in the global sputtering target material industry, benefiting from stable growth in domestic and international orders, particularly from major semiconductor manufacturers like TSMC and SMIC [2][3]. - The semiconductor materials market is projected to grow significantly, with a forecasted size of 74 billion USD in 2024, increasing to over 87 billion USD by 2027, which will positively impact the company's revenue [2]. - The company is actively expanding its precision components business and has initiated a project for electrostatic chucks, aiming to enhance its strategic positioning in key semiconductor components [3]. Summary by Sections Financial Performance - For the first half of 2025, the company expects revenue of 2.1 billion CNY, a year-on-year increase of 29.04%, and a net profit attributable to shareholders of 247-267 million CNY, reflecting a growth of 53.29%-65.70% [1]. - In the second quarter of 2025, the anticipated revenue is 1.1 billion CNY, with net profit expected to range from 90-110 million CNY, showing a year-on-year change of -11.53% to +8.18% [1]. Market Position and Growth - The company is recognized as a core supplier for major chip manufacturers, which supports its growth trajectory in the sputtering target market [2]. - The global semiconductor precision components market is expected to reach approximately 428.8 billion CNY by 2025, with strong demand from wafer manufacturers and semiconductor equipment manufacturers [3]. Strategic Initiatives - The company is progressing with its ultra-high purity metal sputtering target project, with the Huanghu target material factory's main construction advancing smoothly [2]. - A partnership with South Korea's KSTE was established to expand the domestic market for electrostatic chucks, with a planned fundraising of 1.948 billion CNY, of which 1 billion CNY is allocated for the production of integrated circuit equipment electrostatic chucks [3].

Group 1: Company Performance Forecasts - Zhongshe Co., Ltd. expects a net loss of 6 to 8 million yuan for the first half of 2025, compared to a profit of 18.83 million yuan in the same period last year [1] - Jiangfeng Electronics anticipates a net profit of 247 to 267 million yuan for the first half of 2025, representing a growth of 53.29% to 65.70% year-on-year [1] - Naipu Mining forecasts a net profit of 15 to 22.5 million yuan for the first half of 2025, a decline of 73.32% to 82.21% compared to the previous year [7] - Runjian Co., Ltd. expects a net profit of 35 to 52.5 million yuan for the first half of 2025, a decrease of 78% to 85% year-on-year [13] - Kanglong Chemical predicts a net profit of 679 to 713 million yuan for the first half of 2025, down 36% to 39% from the previous year [14] Group 2: Shareholder Actions - Tianyuan Co., Ltd. plans to reduce its shareholding by up to 0.76% through a concentrated bidding process [2] - Sanwei Tiandi intends to reduce its shareholding by up to 4.07% through concentrated bidding or block trading [3] - Zhongfu Shenying plans to reduce its shareholding by up to 1% due to personal funding needs [4] - Hengfeng Information intends to reduce its shareholding by up to 3% through concentrated bidding or block trading [6] - *ST Yanzhen's stock will be suspended for inspection due to abnormal trading fluctuations [9] Group 3: Corporate Transactions - *ST Weir plans to acquire 51% of Shanghai Zijiang New Materials Technology Co., Ltd. for 546 million yuan [10] - Greenland plans to introduce overseas strategic investors for its subsidiary QINGMEI to enhance global competitiveness [12] - Taihe Co., Ltd. intends to acquire the remaining 51% stake in Guangdong Haode Crop Technology Co., Ltd. for 22.083 million yuan [13] - Weichai Heavy Machinery is planning to acquire 100% of Changzhou Fiberglass Shipyard Co., Ltd. [15] - Guolian Aquatic plans to introduce a new shareholder through capital increase for its subsidiary [16]