Group 1 - Mingyang Circuit focuses on the R&D, production, and sales of printed circuit boards (PCBs), covering high multilayer boards, HDI boards, and rigid-flex boards, widely used in industrial control, communication equipment, and automotive electronics. The demand for high-reliability, high-density PCBs is continuously growing due to industrial automation upgrades, 5G communication network construction, and the increasing penetration of new energy vehicles [1][32] - Weirgao specializes in the R&D, production, and sales of electronic-grade special epoxy resins and related composite materials, which are key raw materials for PCBs. The demand for high-frequency, high-temperature, and low-loss materials is increasing in 5G communication, data centers, and new energy vehicles, leading to an expanding market space for specialty epoxy resins [2][33] - Qiangda Circuit focuses on the R&D, production, and sales of high-density interconnect printed circuit boards (HDI), widely used in consumer electronics such as smartphones and tablets. The market demand for high-end products like high multilayer HDI and AnyLayer HDI is continuously growing due to the recovery of the consumer electronics market and the upgrade of smart terminal functions [3][34] Group 2 - Benchuan Intelligent specializes in the R&D, production, and sales of PCBs, with core products including communication boards, automotive boards, and industrial control boards. The market demand for high-reliability, high-frequency PCBs is expanding due to the construction of 5G base stations and the upgrade of new energy vehicle systems [4][35] - Kexiang Co., Ltd. focuses on the R&D, production, and sales of HDI and high multilayer boards, covering various fields including consumer electronics and automotive electronics. The demand for high-end PCBs is continuously growing due to the functional upgrades of consumer electronics and the increasing demand for automotive electronic systems [5][36] - Jinlu Electronics specializes in the R&D, production, and sales of PCBs, with core products including automotive electronic boards and communication boards. The demand for high-reliability, high-integration PCBs is continuously growing due to the increasing penetration of new energy vehicles and the deep coverage of 5G networks [6][37] Group 3 - Shengyi Technology is a leading global supplier of copper-clad laminates (CCL) and related electronic materials, with products widely used in PCBs and electronic packaging. The demand for high-end copper-clad laminates is continuously expanding due to the increasing demand for high-frequency, high-temperature materials in 5G communication and data centers [7][38] - Xiehe Electronics focuses on the R&D, production, and sales of PCBs, including high-frequency and high-speed boards. The market demand for high-end products is continuously growing due to the advancement of 5G networks and the expansion of new energy vehicle systems [8][39] - Shiyun Circuit specializes in the R&D, production, and sales of PCBs, covering automotive electronics, consumer electronics, and industrial control. The demand for high-reliability, high-integration automotive PCBs is continuously growing due to the increasing complexity of in-vehicle electronic systems [9][40]

证券日报网讯 2月24日，逸豪新材在互动平台回答投资者提问时表示，截至2026年2月13日，公司股东 总户数为14683户。 （文章来源：证券日报） ...

PCB概念股持续拉升，中材科技、江南新材、国际复材、宏和科技、中国巨石、铜冠铜箔盘中创新高， 山东玻纤、天通股份涨停，明阳电路、德龙激光涨超10%，逸豪新材、菲利华、深南电路跟涨。 ...

◎记者 王凯丰 临近春节，在逸豪新材无菌无尘的封闭式生产车间内，一条条自动化生产线正高速运转，工人们熟练地 操作着设备，开足马力完成订单。 "公司目前在手订单充足，铜箔产线持续处于满产状态。"逸豪新材总经理刘磊向上海证券报记者介绍， 公司是国内少数实现"铜箔—覆铜板—PCB"全产业链布局的企业，电解铜箔年产能位居行业前列。 近年来，随着AI服务器等应用领域的高速发展，铜箔下游需求稳步增长。刘磊表示，随着今年公司1万 吨高精度电解铜箔项目落地投产，公司将持续加码高端铜箔产能布局，充分发挥垂直一体化产业链的协 同效应，提升高附加值产品的比重，在新能源赛道加速卡位。 技术创新筑牢根基 产品矩阵适配市场需求 "当时全国铜箔企业不超过10家，逸豪新材便是其中之一。"刘磊介绍，成立于2003年的逸豪新材是国内 较早开展电子电路铜箔业务的企业，近年来构建起从电解铜箔、铝基覆铜板到印制电路板的全产业链布 局，并于2022年9月在创业板上市。 在高端铜箔领域，技术创新是企业核心竞争力的关键。作为行业内为数不多的具有PCB垂直一体化产业 链布局的企业，逸豪新材拥有电子电路铜箔、铝基覆铜板和PCB生产核心技术，形成了独特的技术协同 ...

证券日报网讯 2月12日，逸豪新材在互动平台回答投资者提问时表示，截至2026年2月10日，公司股东 总户数为14022户。 （文章来源：证券日报） ...

国信证券股份有限公司 关于赣州逸豪新材料股份有限公司 2025 年度持续督导定期现场检查报告 | 保荐人名称：国信证券股份有限公司 被保荐公司简称：逸豪新材 | | | | | | --- | --- | --- | --- | --- | | 保荐代表人姓名：郭振国 | 联系电话：0755-82130833 | | | | | 保荐代表人姓名：黄滨 | 联系电话：0755-82130833 | | | | | 现场检查人员姓名：郭振国、曾开 | | | | | | 现场检查对应期间：2025 年度 | | | | | | 年 月 日 现场检查时间：2026 2 4 | | | | | | 一、现场检查事项 现场检查意见 | | | | | | （一）公司治理 是 不适用 | | | | 否 | | 现场检查手段：（1）查阅历次董事会、监事会、股东会会议材料；（2）查阅公司章程及各 | | | | | | 项规章制度；（3）与公司管理层进行访谈，了解公司基本制度的执行情况；（4）现场察看 | | | | | | 公司主要经营场所。 | | | | | | 1.公司章程和公司治理制度是否完备、合规 | | ✓ ...

Group 1 - The core point of the article is that Yihau New Materials reported a total of 14,488 shareholders as of January 30, 2026 [2]

Core Viewpoint - The company expects a net profit attributable to shareholders for the year 2025 to be between -61 million and -51 million, with a net profit excluding non-recurring gains and losses projected between -65 million and -55 million [1] Group 1: Industry Impact - The copper foil industry is experiencing intensified competition due to the continuous release of newly built production capacity, leading to a decline in processing fees, which remain at low levels [1] - Despite a slight improvement in copper foil gross margins, they are still considered low, impacting overall company performance [1] Group 2: Company Performance - The company is actively advancing its fundraising project construction and increasing R&D investment to diversify product offerings and optimize product structure [1] - The utilization rate of the company's PCB production capacity is improving slowly, and although gross margins have shown some recovery, the company remains in a loss position, negatively affecting overall performance [1] - The company has seen an increase in product sales revenue and accounts receivable due to the release of new production capacity, but high initial production costs have led to asset impairment provisions, further impacting performance [1]

证券代码：301176 证券简称：逸豪新材 公告编号：2026-003 赣州逸豪新材料股份有限公司 2025 年度业绩预告 本公司及董事会全体成员保证信息披露的内容真实、准确、完整，没有虚假记载、误导性陈述或重 大遗漏。 一、本期业绩预计情况 1、业绩预告期间：2025 年 1 月 1 日至 2025 年 12 月 31 日。 三、业绩变动原因说明 本报告期业绩变动主要系： 1、受铜箔行业前期新建产能持续释放，铜箔行业竞争加剧等影响，铜箔加工费虽显现回调迹 象但仍处低位。报告期内，公司积极推进募投项目建设，持续加大研发投入，不断丰富产品种类和 优化产品结构，铜箔毛利率有一定幅度提升但仍然较低；公司 PCB 产能利用率提升较慢，虽然毛利 率有所好转但仍处亏损状态，影响公司业绩。 2、报告期内，公司新增产能陆续释放，产品销售收入和应收账款相应增长，且投产前期生产 成本较高，公司依据《企业会计准则》等相关规定，对相关资产计提资产减值准备（含信用减值损 失），相应影响公司业绩。 2、业绩预告情况：预计净利润为负值 （1）以区间数进行业绩预告的 单位：万元 | 项 | 目 | 本报告期 | | | | 上年同期 | | ...

Core Viewpoint - The company announced a postponement of its fundraising investment project while maintaining the project's implementation subject, use of funds, and scale unchanged [1] Group 1 - The company will hold its third board meeting on January 13, 2026, to review the proposal for the postponement of the fundraising investment project [1] - The postponement is based on the current progress of the "annual production of 10,000 tons of high-precision electrolytic copper foil project" [1] - This matter does not require submission for shareholder meeting approval [1]