证券代码：002156 证券简称：通富微电 公告编号：2025-042 通富微电子股份有限公司 关于持股 5%以上股东减持计划时间届满暨减持结果公告 2025 年 8 月 6 日，公司收到产业基金出具的《关于通富微电子股份有限公 司股份变动触及 1%整数倍的告知函》，产业基金在 2025 年 7 月 18 日至 2025 年 8 月 6 日期间，通过大宗交易方式合计减持公司股份 13,142,400 股，减持前持 股比例为 7.77%，减持后持股比例为 6.91%，具体详见公司于 2025 年 8 月 8 日在 巨潮资讯网（http://www.cninfo.com.cn）披露的《关于持股 5%以上股东股份 变动比例触及 1%整数倍的公告》（公告编号：2025-035）。 现公司收到产业基金出具的《关于通富微电子股份有限公司减持计划时间届 满暨减持结果告知函》，截至 2025 年 9 月 8 日，本次减持计划时间区间已届满， 产业基金本次减持计划已累计减持公司股份 31,886,169 股，占公司当前总股本 的 2.1%，持股比例从 8.77%下降至 6.67%。具体减持及权益变动情况如下： 一、 减持计划的 ...

Summary of Key Points Core Viewpoint - The shareholder, National Integrated Circuit Industry Investment Fund Co., Ltd., has completed its share reduction plan, resulting in a significant decrease in its stake in Tongfu Microelectronics Co., Ltd. [1] Group 1: Share Reduction Details - The shareholder reduced its holdings by 15.176 million shares from June 11, 2025, to June 27, 2025, at a price range of 23.24 to 25.23 CNY per share [1] - An additional reduction of 16.7102 million shares occurred from July 18, 2025, to August 20, 2025, at a price range of 23.45 to 25.92 CNY per share [1] - The total shares reduced amounted to 31.8862 million, representing 2.1% of the company's total share capital, decreasing the holding percentage from 8.77% to 6.67% [1]

Core Viewpoint - The company is actively developing advanced packaging technologies and expanding its production capacity to seize market opportunities and enhance its competitive edge in the semiconductor industry [2]. Group 1: Company Strategy - The company is focusing on high value-added products and market hotspots, aligning with industry technology trends [2]. - It is investing in the development of advanced packaging technologies such as fan-out, wafer-level, and flip-chip packaging [2]. - The company is also strategically positioning itself in cutting-edge packaging technologies like Chiplet and 2D+ to create a differentiated competitive advantage [2].

Group 1 - The company Tongfu Microelectronics (002156) confirmed on September 8 that its chip packaging and testing services are utilized in data centers [1]

证券日报网讯通富微电9月8日在互动平台回答投资者提问时表示，公司主营集成电路封装测试业务，公 司客户资源覆盖国际巨头企业以及各个细分领域龙头企业，大多数世界前20强半导体企业和绝大多数国 内知名集成电路设计公司都已成为公司客户。 （文章来源：证券日报） ...

Core Viewpoint - Tongfu Microelectronics (002156) announced a breakthrough in technology research and development in the optoelectronic packaging (CPO) field, with related products passing preliminary reliability tests [1] Group 1 - The company achieved significant progress in CPO technology research and development by the first half of 2025 [1] - The subsequent developments will be assessed based on customer and market demand [1]

格隆汇9月8日丨通富微电(002156.SZ)在互动平台表示，公司封测的芯片有应用在数据中心上。 ...

Company Overview - Tongfu Microelectronics Co., Ltd. is located in Chongchuan Development Zone, Nantong City, Jiangsu Province, and was established on February 4, 1994. The company was listed on August 16, 2007. Its main business involves integrated circuit packaging and testing, with revenue composition being 96.98% from integrated circuit packaging and testing and 3.02% from sales of molds and materials [1]. Stock Performance - As of September 8, Tongfu Microelectronics' stock price decreased by 2.05%, trading at 31.55 CNY per share, with a total market capitalization of 47.88 billion CNY. The stock has seen a year-to-date increase of 6.93%, a decline of 9.55% over the last five trading days, a rise of 14.94% over the last 20 days, and an increase of 35.67% over the last 60 days [1]. - The company has appeared on the "Dragon and Tiger List" twice this year, with the most recent appearance on September 4, where it recorded a net buy of -155 million CNY [1]. Financial Performance - For the period from January to June 2025, Tongfu Microelectronics achieved a revenue of 13.038 billion CNY, representing a year-on-year growth of 17.67%. The net profit attributable to shareholders was 412 million CNY, reflecting a year-on-year increase of 27.72% [2]. Shareholder Information - As of June 30, 2025, the number of shareholders for Tongfu Microelectronics was 276,000, a decrease of 6.46% from the previous period. The average number of tradable shares per shareholder increased by 6.90% to 5,497 shares [2]. - The top ten circulating shareholders include significant institutional investors, with Hong Kong Central Clearing Limited being the fourth largest shareholder, holding 25.0739 million shares, an increase of 2.1328 million shares from the previous period [3].

Group 1 - The company, Tongfu Microelectronics (002156.SZ), announced a breakthrough in technology research and development in the field of Chip-on-Photonic (CPO) as of September 8, 2023 [1] - The related products have passed preliminary reliability testing, indicating progress in their development [1] - Future developments will be determined based on customer and market demand [1] Group 2 - An investor inquired whether the CPO products have been sent to GPU manufacturers for certification, reflecting interest in the company's advancements [3]

Core Insights - The semiconductor packaging and testing technology has become a crucial element in overcoming the dual challenges of "physical limits" and "industrial chain disruptions" in the context of the global semiconductor industry's rapid transformation and geopolitical tensions [1] Group 1: Industry Trends - The advanced packaging sector is seen as a core pathway to continue Moore's Law, with technologies such as 2.5D/3D, Chiplet, and Fan-Out accelerating the integration of design and manufacturing [1] - The geopolitical landscape is reshaping supply chains, necessitating a dual approach of self-sufficiency and globalization for China's packaging industry [1] Group 2: Regional Developments - Jiangsu province, holding nearly half of the national packaging capacity, has become a significant hub for the semiconductor packaging industry, with the Yangtze River Delta region accounting for over 81% of the national total [2] - By 2024, Jiangsu's packaging revenue is projected to exceed 170 billion yuan, with key enterprises achieving breakthroughs in system-level packaging and 2.5D packaging technologies [2] Group 3: Market Dynamics - The domestic integrated circuit industry has seen a continuous increase in prosperity, with sales reaching 1,045.8 billion yuan, a year-on-year growth of 18% [3] - The advanced packaging market is growing at a rate that outpaces traditional packaging, driven by the demand for high-density, diversified, and miniaturized packaging solutions [3]