Core Viewpoint - The company plans to issue approximately 5.699 million shares at a price of 56.15 yuan per share and 4.8 million convertible bonds to acquire 70% equity in Hengsuo Huawai, with a total transaction amount of 1.12 billion yuan [1] Group 1: Transaction Details - The total amount raised will be used for cash compensation, technological transformation of chip-level packaging material production lines, construction of intelligent production lines for automotive-grade chip packaging materials, upgrading of research centers, and supplementing working capital [1] - The target company, Hengsuo Huawai, is a national-level specialized and innovative "little giant" enterprise engaged in the R&D, production, and sales of semiconductor chip packaging materials [1] Group 2: Market Position and Impact - After the transaction, Huahai Chengke's annual production and sales volume in the field of semiconductor epoxy encapsulants is expected to exceed 25,000 tons, maintaining its leading position in China and becoming the second-largest globally in terms of shipment volume [1] - The integration of both companies' technological advantages will accelerate the R&D and mass production of advanced packaging materials such as high thermal conductivity encapsulants and storage chip encapsulants, breaking the foreign technology monopoly [1] Group 3: Company Profile - Huahai Chengke is a national-level specialized and innovative "little giant" enterprise focused on semiconductor chip packaging materials, with main products including epoxy encapsulants and electronic adhesives [1] - As of September 19, the company's stock price was reported at 106.00 yuan per share, with a daily increase of 1.92% [1]