Group 1 - The report from Dongfang Securities highlights that process technology upgrades drive chip performance improvements, while advanced packaging serves as another key driver for enhancing chip capabilities [1] - In the context of slowing process technology upgrades, increasing the die area can enhance transistor count and computational power, with Nvidia's H100 die area nearing the reticle limit of approximately 800-900 mm² [1] - Nvidia's B200 adopts advanced packaging with dual die integration, achieving 208 billion transistors in a single package, which is more than double the 80 billion transistors in the H100 [1] - According to Nvidia's roadmap, the Rubin Ultra will integrate four dies in a single package, targeting a computational power of 100PF FP4 per card [1] Group 2 - System assembly is emerging as a new driver for AI server performance enhancement, as wafer manufacturing and advanced packaging may not keep pace with the growing demand for AI computing power [2] - The number of GPUs in AI servers is expected to increase from 8 per server to 72 per cabinet, with projections for the VR Ultra NVL576 cabinet in 2027 to support 144 GPUs, each with four die, totaling 576 die [2] - The increase in GPU count raises cooling requirements and complicates system assembly, exemplified by the production ramp-up challenges faced by GB200 NVL72 due to assembly difficulties [2] - Leading companies in the industry are likely to benefit from the rising technical barriers and improved competitive environment in system assembly [2] Group 3 - In terms of investment targets, companies related to AI server system assembly are maintained, including Industrial Fulian, which has significantly optimized GB200 series product testing and reduced cabinet debugging time [3] - Industrial Fulian has expanded capacity globally and introduced fully automated assembly lines, expecting strong growth in GB200 shipments, primarily driven by large North American cloud service providers [3] - Haiguang Information's merger with Zhongke Shuguang is anticipated to create vertical integration capabilities encompassing CPU, DCU, and system assembly [4] - Lenovo is expected to launch various servers based on Blackwell Ultra starting in the second half of 2025, as indicated by Nvidia [4] - Huaqin Technology, a core ODM supplier for domestic internet firms' AI servers, benefits from the capital expenditure expansion of downstream cloud companies [4]

Group 1 - The report from Dongfang Securities highlights that process technology upgrades drive chip performance improvements, while advanced packaging serves as another key driver for performance enhancement [1] - In the context of slowing process technology upgrades, increasing the die area can enhance transistor count and computing power, with Nvidia's H100 die area nearing the reticle limit of approximately 800-900 mm² [1] - Nvidia's B200 adopts advanced packaging with dual die integration, achieving 208 billion transistors in a single package, which is more than double the 80 billion transistors in the H100 [1] Group 2 - System assembly is emerging as a new driver for AI server performance enhancement, as wafer manufacturing and advanced packaging may not keep pace with the growing demand for AI computing power [2] - The number of GPUs in AI servers is expected to increase significantly, from 8 GPUs per server to 72 GPUs per cabinet, and potentially to 144 GPUs in the VR Ultra NVL576 cabinet by 2027 [2] - The increase in GPU count raises challenges in heat dissipation and system assembly complexity, with industry leaders likely to benefit from the elevated barriers to entry and improved competitive environment [2] Group 3 - In terms of investment targets, companies related to AI server system assembly are maintained, including Industrial Fulian, which has optimized GB200 series product testing and reduced system-level cabinet debugging time [3] - Industrial Fulian is expanding capacity globally and has introduced fully automated assembly lines, expecting strong growth in GB200 shipments, primarily driven by large North American cloud service providers [3] - Haiguang Information's merger with Zhongke Shuguang is anticipated to create vertical integration capabilities encompassing CPU, DCU, and system assembly [4] Group 4 - Lenovo is expected to launch various servers based on Blackwell Ultra starting in the second half of 2025, as indicated by Nvidia [4] - Huaqin Technology, a core ODM supplier for domestic internet companies' AI servers, is set to benefit from the capital expenditure expansion of downstream cloud companies [4]

Investment Rating - The report maintains a "Positive" investment rating for the electronic industry, indicating an expected return that is stronger than the market benchmark by over 5% [5]. Core Insights - The AI server market continues to grow, driven by demand for AI computing power and hardware upgrades [7]. - System assembly is emerging as a new driver for performance enhancement in AI servers, as traditional manufacturing processes may not keep pace with the rapid development of AI computing needs [8]. - Advanced packaging techniques are becoming crucial for improving chip performance, especially as traditional process upgrades slow down [8]. - Industry leaders are expected to benefit from the rising technical barriers and improved competitive environment in the system assembly sector [8]. Summary by Sections AI Server Market Dynamics - The demand for AI computing facilities is driving growth in the AI server market, with significant upgrades in hardware [7]. - The number of GPUs in AI servers is increasing dramatically, with projections for future upgrades to 144 GPUs per cabinet by 2027 [8]. Performance Enhancement Drivers - The report highlights that system assembly is becoming a key factor in enhancing AI server performance, as the number of GPUs per server increases [8]. - The complexity of system assembly is rising, which may limit production capacity for some companies [8]. Recommended Investment Targets - The report recommends several companies related to AI server system assembly, including: - Industrial Fulian (601138, Buy) - Haiguang Information (688041, Buy) - Lenovo Group (00992, Buy) - Huaqin Technology (603296, Buy) [8]. - Industrial Fulian is noted for significant improvements in product testing and production efficiency, with strong order growth expected [8]. - Haiguang Information is positioned to leverage vertical integration capabilities following its merger with Zhongke Shuguang [8]. - Lenovo Group is anticipated to launch various servers based on Nvidia's Blackwell Ultra starting in the second half of 2025 [8]. - Huaqin Technology is recognized as a core ODM supplier for AI servers, benefiting from increased capital expenditures by cloud service providers [8].