Core Viewpoint - The 2025 Fourth China Advanced Thermal Management Technology Conference will focus on thermal management technologies in the automotive electronics and AI server/data center industries, addressing challenges related to high-performance chips and high-power devices [2]. Group 1: Conference Overview - The conference will take place on August 28-29, 2025, in Shanghai, organized by Cheqian Information and Thermal Design Network, with support from various industry organizations [2]. - The event will feature over 70 presentations and more than 600 industry experts in attendance [2]. Group 2: Key Topics and Sessions - The first day will cover opportunities and challenges in thermal management driven by AI and smart vehicles, with presentations from companies like Dawning Information Industry and China Mobile [3][4]. - The afternoon sessions will focus on liquid cooling in data centers, featuring discussions on practical applications and innovative solutions from companies such as Dawning Data Infrastructure and Sichuan Huakun Zhenyu [4][27]. - The second day will continue with liquid cooling technologies and high-performance chip thermal management, including insights from Fudan University and ZTE Corporation [9][31]. Group 3: Specialized Sessions - Specialized sessions will address topics such as micro-nano scale heat transfer, power semiconductor thermal management, and advanced packaging technologies [15][42][46]. - The conference will also include a dedicated session on AI server thermal management, featuring contributions from companies like Inventec and Supercloud Digital Technology Group [33][35]. Group 4: Supporting Organizations and Media - The conference is supported by various media outlets and organizations, including Cheqian Information, Thermal Design Network, and the China Electronic Industry Standardization Technology Association [2][54]. - The event aims to foster collaboration and knowledge sharing among industry professionals to advance thermal management technologies [54].