如果您希望可以时常见面，欢迎标星收藏哦~ 2025 年 12 月 18 日，中国汽车芯片产业迎来一个重要节点。 在中国汽车芯片产业创新战略联盟 2025 全体成员大会上，全球首款实现量产并装车的 RISC-V 架 构车规级芯片——紫荆 M100 正式发布。该产品实现了 RISC-V 架构芯片在车载量产应用中的首 次落地，标志着中国汽车芯片产业在开放架构方向上的自主研发和工程化能力迈出实质性一步。 作为联盟年度重要活动之一，本次发布会吸引了多家整车企业、Tier 1 供应商、芯片设计企业及科 研机构代表参与。工业和信息化部相关领导、联盟理事长单位代表以及来自整车和零部件企业的技 术负责人出席活动，共同见证了紫荆 M100 的量产发布，并围绕其在车载应用、产业协同及国产 化进程中的意义进行了交流与讨论。 技术突破：从零到一的征程 紫荆M100作为全球首款实现量产上车的RISC-V汽车芯片，充分发挥了RISC-V开放、模块化的架 构优势，紧密契合智能汽车电子电气架构的演进趋势，具备高算力、低功耗、高安全性与高扩展性 四大核心特征。 回顾这款芯片的诞生历程，紫荆半导体走出了一条独特的"快速突破"之路。从2023年启动 ...

Core Viewpoint - The article highlights India's significant progress in the semiconductor sector with the launch of the DHRUV64 microprocessor, marking a milestone in establishing a self-sufficient semiconductor ecosystem and reducing reliance on imported microprocessors [2][5]. Group 1: DHRUV64 Microprocessor - The DHRUV64 is India's first fully indigenous 64-bit microprocessor, designed by the Centre for Development of Advanced Computing (C-DAC) [4]. - It utilizes a 64-bit RISC-V open instruction set architecture and is manufactured using a 28nm process, featuring a dual-core design with a maximum frequency of 1GHz [4]. - The microprocessor is applicable in various fields, including mobile phones, computers, automotive electronics, medical devices, defense systems, and satellite communications [4]. Group 2: Impact on India's Semiconductor Ecosystem - The successful development of DHRUV64 enhances India's domestic capabilities in advanced processor development, providing technological support for critical digital infrastructure [5]. - India currently consumes about 20% of the world's microprocessors, and the DHRUV64 serves as a modern platform for its vast technical talent pool, promoting the continuous development of the local semiconductor ecosystem [5]. - The government has indicated that the success of DHRUV64 paves the way for the next-generation processors, Dhanush and Dhanush+, which are already in the development phase [4]. Group 3: RISC-V Architecture - RISC-V is an open architecture that provides a set of instructions for chip design without licensing fees, facilitating broader adoption across industries, startups, and research institutions [4]. - This open architecture encourages collaborative innovation by providing common tools and standards, thereby improving cooperation between research institutions and companies [4].

Core Viewpoint - Hesai Technology (HSAI.US) has seen a significant stock price increase following the release of its new high-performance smart control chip and safety technology for LiDAR systems, indicating strong market interest and potential growth in the autonomous driving sector [1][2]. Group 1: Product Developments - Hesai launched the Fermi C500, a high-performance smart control chip based on the RISC-V architecture, which completes its fourth-generation chip platform [1]. - The Fermi C500 is the world's first LiDAR-specific control chip with dual certification for functional safety and cybersecurity, meeting stringent reliability and information security requirements for automotive applications [1]. - The chip integrates multiple functions, including MCU, FPGA, and ADC, and features a 256-core waveform processing engine for enhanced performance in complex weather conditions [1]. Group 2: Market Outlook - According to CICC, the shipment volume of car-mounted LiDAR in China is expected to exceed 3 million units by 2025 and 10 million units by 2028, with a compound annual growth rate of 58% [2]. - The robotics sector is identified as a new growth area for LiDAR technology, while overseas markets are anticipated to experience significant growth [2].

Core Viewpoint - Hesai Technology (2525.HK) has seen significant stock price increases, with a rise of over 8% followed by an additional increase of over 16%, reaching HKD 149.8 during trading [1] Product Launch and Innovations - On November 24, Hesai Technology launched the Fermi C500, a high-performance intelligent main control chip for LiDAR based on RISC-V architecture [1] - The company also introduced the world's only photon isolation safety technology and the updated 256-line safety LiDAR ATX [1] - Photon isolation technology is now integrated into all main LiDAR products, including ATX and ETX [1] Technical Features - The Fermi C500 chip features a self-controlled RISC-V architecture, ensuring supply chain security and independent technology iteration [1] - It is the world's first LiDAR-specific main control chip that integrates MCU, FPGA, and ADC into a single chip, meeting stringent reliability and information security requirements for automotive applications [1] - The chip is also the first to include a built-in point cloud intelligence engine (IPE) and integrates a 256-core waveform processing core, enabling intelligent noise filtering in complex weather conditions for high-precision perception in autonomous driving [1]

Core Insights - HeSai Technology, a global leader in LiDAR, held a technology open day on November 24, 2023, where it unveiled the Fermi C500 chip based on RISC-V architecture, a photon isolation safety technology, and the upgraded 256-line ATX LiDAR [1][4][16]. Group 1: Product Development and Innovation - The Fermi C500 chip integrates MCU, FPGA, and ADC, making it the world's first LiDAR-specific main control chip with dual certification for functional and network safety, meeting stringent automotive reliability and information security requirements [4][6]. - HeSai has achieved full-stack self-research in key components of LiDAR, including lasers, detectors, and signal processors, making it the only company in the industry to do so [6][30]. - The photon isolation technology ensures zero false alarms by preventing interference between laser channels, significantly enhancing the reliability of HeSai's LiDAR products [16][24][26]. Group 2: Market Position and Performance - HeSai has delivered a total of 185 million self-developed chips, ranking first in the industry, and has maintained a leading market share in China for eight consecutive months [3][30][34]. - The penetration rate of LiDAR in new energy passenger vehicles has reached 20%, with one in five new cars equipped with LiDAR as standard [32]. - HeSai's ATX LiDAR has received over 4 million orders and is expected to start mass production in April 2026, highlighting its strong market demand [27][30]. Group 3: Strategic Partnerships and Future Outlook - HeSai has secured partnerships with top automotive manufacturers, including major European and global new energy vehicle companies, for the 2026 model year [32][33]. - The upcoming demand for L3 autonomous driving features is expected to drive the need for multiple LiDAR units in vehicles, positioning HeSai favorably in the evolving market landscape [33].

Core Insights - Hesai Technology's stock surged over 8% in Hong Kong, leading to a pre-market increase of 7.58% in its US shares following the announcement of its new products and index inclusion [1] Product Developments - Hesai launched the Fermi C500, a laser radar dedicated intelligent control chip based on the RISC-V architecture, which integrates MCU, FPGA, and ADC into a single chip [1] - The Fermi C500 is the world's first laser radar control chip with dual certification for functional safety and cybersecurity [1] - The company also introduced the updated 256-line safety laser radar ATX, featuring the unique "photon isolation" safety technology [1] Market Recognition - Hesai has been included in the Hang Seng Composite Index, effective December 8, reflecting strong market recognition of its business performance and value [1] - This inclusion is expected to broaden the investor base and attract additional capital from mainland investors through the Hong Kong Stock Connect [1]

（文章来源：第一财经） 11月24日，禾赛科技在上海禾赛麦克斯韦全球研发智造中心举办2025技术开放日活动。禾赛科技发布基 于RISC-V架构的激光雷达专用高性能智能主控芯片费米C500。 ...

每经AI快讯，有投资者在投资者互动平台提问：公司以RISC-V架构为核心的mcu在国内处于什么水 平？ （记者 曾健辉） 振华风光（688439.SH）11月14日在投资者互动平台表示，尊敬的投资者，您好！公司首款基于RISC-V 架构的32位MCU产品已开始小批量出货，可应用于电机控制、电子系统健康监测等场景，目前正积极 开展后续定型及量产工作。该产品具备集成32位内核、最高80MHz工作频率、内置最大256KB闪存、宽 电压支持（3V-5V）及高ESD性能（8000V）等特点。在技术储备方面，公司已研发多款基于RISC-V架 构的32位微处理器，拥有外设路由管理技术、改进型多层总线管理技术，并开发了高性能ADC、运放 和灵活的通讯接口，在高可靠领域填补空白，同时建立了完善的应用生态平台。 ...

Core Insights - The company, Rockchip (瑞芯微), announced the mass production of new products based on the RISC-V architecture, marking a significant milestone in its development strategy [1][3]. Company Overview - RISC-V architecture is characterized by its openness, flexibility, and low power consumption, making it suitable for applications in AIoT, industrial control, and smart terminals [3]. - Rockchip has been investing in RISC-V research and development, launching several high-performance chip products aimed at smart hardware and embedded systems [3]. Product Performance - The new product series shows significant improvements in computing performance and energy efficiency compared to previous generations, supporting various AI acceleration engines and security modules [3]. - These products can be widely applied in scenarios such as smart homes, educational electronics, and industrial gateways [3]. Strategic Direction - Rockchip has identified RISC-V as one of its long-term strategic directions, focusing on both independent design and ecosystem collaboration to enhance architecture optimization and system-level integration capabilities [3]. - The company is actively working with multiple partners to advance ecosystem development related to RISC-V [3]. Industry Context - Industry experts view RISC-V as a crucial force in the domestic CPU architecture landscape, helping the local chip industry overcome core technology barriers [3]. - The mass production of Rockchip's products signifies a critical step in the company's efforts towards chip autonomy and ecosystem development [3]. Future Plans - The company plans to continue expanding its product offerings based on the RISC-V architecture, increasing research on AI processing units and operating system compatibility to build a more comprehensive open chip ecosystem [3].

Investment Rating - The report does not explicitly state an investment rating for the industry or specific companies Core Insights - The second Guangdong-Hong Kong-Macao Greater Bay Area Semiconductor Industry Ecology Expo showcased significant advancements in the semiconductor industry, focusing on wafer manufacturing, advanced packaging, IC design, and compound semiconductors [1][15] - Xinkailai's subsidiary Qiyunfang Technology launched two domestically developed EDA software products, which enhance performance by 30% compared to industry benchmarks and reduce hardware development cycles by 40% [2][17] - Wanliyan, another subsidiary, introduced a 90GHz ultra-high-speed oscilloscope, improving domestic oscilloscope performance by 500% and supporting advanced chip testing [2][18] - The collaboration between DAMO Academy Xuantie and Xinmang Microelectronics resulted in a cycle-level accurate simulation model for AI vector accelerators, significantly improving performance tuning capabilities [3][19] - Shenzhen Pinghu Laboratory established a leading 8-inch power semiconductor platform, achieving a localization rate of 99.2% for equipment and aiming for mass production of 1200V SiC MOSFETs and 650V GaN HEMTs by 2025 [5][25] Summary by Sections New Product Launch by Subsidiaries of Xinkailai - Qiyunfang Technology launched two EDA software products that fill a technological gap in high-end electronic design software, enhancing performance and reducing development time [2][16][17] - Wanliyan's oscilloscope features a sampling rate of 200 billion samples per second and can significantly reduce parameter tuning time for high-speed interface chips [2][18] Joint Launch by DAMO Academy Xuantie and Xinmang Microelectronics - The new modeling and optimization solution for AI vector accelerators allows for cycle-level tracking and visualization of CPU microarchitecture, improving the efficiency of performance tuning [3][19][20] - This solution is expected to enhance the competitiveness of RISC-V architecture in high-performance computing [4][22][23] Highlight Exhibits of Shenzhen Pinghu Laboratory - The laboratory's cleanroom and equipment have achieved a high localization rate, breaking foreign monopolies in core semiconductor equipment [5][25][26] - The facility aims to reduce R&D costs and facilitate mass production of advanced semiconductor components by 2025 [5][27][28]