Group 1 - The core viewpoint of the article is that Chongda Technology (002815.SZ) focuses on PCB products primarily for servers [1] Group 2 - The company has communicated with investors through an interactive platform regarding its supply wave [1]

Investment Overview - The company plans to invest a total of RMB 5 billion in the expansion project at the Zhuhai Jinwan base, with an estimated post-tax investment recovery period of approximately 7.5 years, including the construction period [1][2] - The construction period for the project is set from 2025 to 2027, with phased implementation based on market demand and business progress [1] Impact on Company Performance - The expansion investment project is not expected to have a significant impact on the company's operating performance in 2025, although long-term performance remains uncertain [2] Background and Necessity of the Investment - The expansion is driven by technological breakthroughs in AI and high demand for high-end PCBs, with Prismark predicting a compound annual growth rate of 15.7% for multilayer boards and 6.4% for HDI from 2024 to 2029 [3] - The existing capacity at the Zhuhai Jinwan base is insufficient to meet the growing demand for high-performance products in AI computing, high-speed communications, and automotive applications, necessitating targeted technological upgrades and new high-end HDI factory investments [4][5] Feasibility of the Investment - The company has over 30 years of experience in PCB manufacturing and is recognized as a national high-tech enterprise, providing a solid technical foundation for the project's success [5] - The Zhuhai Jinwan base has established a strong technical reserve and customer base in high-end PCB manufacturing, ensuring stable and sustainable market demand for the expansion project [5][6] - The investment aligns with national industrial policies and market trends, aiming to enhance the company's competitive advantage in high-end products and expand its operational scale [6]

Summary of Key Points from the Conference Call Industry Overview - The conference call focuses on the **PCB (Printed Circuit Board)** industry, particularly high-end HDI (High-Density Interconnect) boards and the associated equipment investment opportunities [1][2][3]. Core Insights and Arguments - **High Precision Requirements**: High-end HDI boards require extreme precision, with alignment accuracy of ±1 micron, via hole tolerances of ±0.05 mm, and plating uniformity of ±5 microns. This necessitates advanced imported equipment such as high-resolution exposure machines and precision laser drilling machines [1][2]. - **Market Demand**: The number of HDI board manufacturers in mainland China is limited (5-7 stages), but increasing demand from clients like NVIDIA is driving R&D and production investments [1][3]. - **Technological Advancements**: The PCB manufacturing process is evolving, with North American chip-related PCBs reaching 30-40 layers and thicknesses of 4-6 mm, which conventional equipment cannot handle [1][3]. - **Domestic Equipment Challenges**: Domestic high-end PCB equipment faces capacity shortages and higher costs due to reliance on high-end components, leading to a lack of price competitiveness [1][4]. - **Leading Companies**: Dongwei Company is highlighted as a leader in VCP (Vertical Continuous Plating) technology, particularly with its GP300 model, which is crucial for filling holes in high-end PCB manufacturing [1][7]. Additional Important Content - **Equipment Dependency**: The industry heavily relies on imported equipment, especially for X-Ray inspection machines and plating lines, which are critical for high-end HDI production [2][20]. - **Quality and Yield Issues**: Domestic PCB manufacturing struggles with yield and precision compared to overseas counterparts, particularly in deep drilling applications where domestic equipment may not meet the required specifications [8][14]. - **Material and Cost Considerations**: The cost of materials, such as the Ma 8 material, significantly impacts overall production costs, with drilling tools representing a small but critical cost component [15][16]. - **Future Trends**: The trend towards smaller hole diameters (expected to reach 75 microns) and thinner materials will require advancements in laser drilling technology, indicating a shift towards more efficient and precise manufacturing processes [18]. Conclusion - The PCB industry is at a critical juncture, with increasing demand for high-end products driving the need for advanced manufacturing technologies. Domestic manufacturers face challenges in equipment capacity, quality, and cost competitiveness, while opportunities for growth exist through technological advancements and potential domestic replacements for imported equipment.

Core Insights - The PCB industry, previously considered traditional and unexciting, is now experiencing explosive growth due to the surging demand for AI computing power, positioning it as a lucrative sector in technology [1][20] - PCB is referred to as the "mother of electronic products," serving as the foundational layer for all electronic devices, and its importance has been re-evaluated in the context of AI servers [1][8] Company Overview - Shenghong Technology, founded by Chen Tao in 2006, specializes in high-layer PCBs and has established itself in the supply chains of major companies like TCL and Skyworth [2][4] - The company went public in 2015, raising 577 million yuan, and has seen significant growth in revenue and net profit since then [3][4] Financial Performance - In 2022, Shenghong Technology achieved a revenue of 10.731 billion yuan, a year-on-year increase of 35.31%, and a net profit of 1.154 billion yuan, up 71.96% [5] - In Q1 2023, the company reported a revenue of 4.312 billion yuan, reflecting an 80.31% year-on-year growth, and a net profit of 921 million yuan, a staggering increase of 339.22% [5] Market Dynamics - The value of PCBs in AI servers has dramatically increased, with the price of a PCB for a mainstream AI server ranging from $2,000 to $5,000, compared to $200 to $500 for traditional servers, indicating a tenfold increase in value [12] - The global market for AI server PCBs is projected to grow from approximately $2 billion in 2023 to over $10 billion by 2027, driven by a compound annual growth rate exceeding 29% [13] Competitive Landscape - The PCB industry has been dominated by Japanese and Korean companies, which hold 40% of the global HDI market share, but Chinese manufacturers are gaining ground due to cost advantages and rapid iteration capabilities [15][18] - Shenghong Technology is positioned as a key player in the market, with 82.95% of its revenue coming from overseas and a leading gross margin in HDI boards [19] Future Outlook - The company aims to achieve a revenue target of 20 billion yuan by 2026, reflecting its ambition to capitalize on the growing AI and electronic manufacturing sectors [6][20] - The shift towards high-end PCB production signifies a transformation in China's electronic manufacturing industry, moving from cost-driven strategies to technology and capital-driven approaches [19][20]

Summary of PCB Drilling Equipment Industry Conference Call Industry Overview - The conference call focused on the PCB (Printed Circuit Board) drilling equipment industry, highlighting the impact of AI server demand on the domestic PCB supply chain, particularly driven by Nvidia's GV200 OAM version and high-end server backplanes from companies like Huawei and Apple [1][2][3]. Key Companies Involved - Major players in the industry include: - **Deep Blue Circuit** - **Pengding Holdings** - **Victory Technology** - **Huidian Technology** - These companies are actively expanding their HDI (High-Density Interconnect) production lines to meet the increasing demand for AI server orders [1][3][5]. Core Insights and Arguments - **Increased Demand**: Starting from Q4 2024, PCB orders are expected to surge, particularly in Q1 and Q2 of 2025, driven by the demand for AI server motherboards [2]. - **Collaboration with Tech Giants**: Companies like Deep Blue Circuit and Pengding Holdings are closely collaborating with major tech firms such as Huawei and Apple to produce high-layer HDI products [1][3]. - **Expansion Plans**: Several manufacturers, including Jingwang, Guanghe, and Fangzheng, are planning to follow suit in expanding HDI production capacity [5]. - **Technological Advancements**: The CO-WOP (Chip-on-Wafer) technology is enhancing the precision requirements for HDI, leading to increased demand for high-frequency and high-density interconnect boards [6][7]. Equipment and Investment Insights - **Core Production Processes**: The main processes in PCB production include lamination, exposure, drilling, plating, and testing, with drilling being the most valuable segment, accounting for over 30% of the total investment [9][12]. - **Investment Breakdown**: - Small factories may invest around 200 million CNY, while large factories could exceed 2 billion CNY in total investment [9]. - Drilling equipment, particularly laser drilling machines, is crucial for high-end applications, with significant investments required for advanced machinery [12][21]. - **Market Dynamics**: Domestic PCB equipment is gaining traction in the mid-to-low-end market, while high-end applications still rely heavily on imported equipment from brands like Germany's Xumo [10][11]. Potential Risks and Challenges - **Supply Chain Constraints**: The demand for advanced drilling equipment is outpacing supply, with orders for critical machinery like the German Book press equipment and Xumo drilling machines already booked into mid-2026 [6][8]. - **Quality Control**: The complexity of high-layer HDI boards necessitates precise drilling techniques, and any errors can lead to significant economic losses [14][16]. - **Technological Barriers**: The high barriers to entry in advanced drilling technologies, such as depth control milling, pose challenges for domestic manufacturers to compete with established foreign brands [24]. Additional Noteworthy Points - **Future Trends**: The increasing number of HDI layers is expected to drive up demand for lamination and drilling processes, emphasizing the need for high-quality materials and equipment [31]. - **Market Competition**: While domestic brands are making strides, they still face challenges in matching the efficiency and quality of imported equipment, particularly for high-stakes orders like those from Nvidia [33][34]. This summary encapsulates the key points discussed during the conference call, providing insights into the current state and future outlook of the PCB drilling equipment industry.

Core Viewpoint - Shenghong Technology has submitted its listing application to the Hong Kong Stock Exchange, with J.P. Morgan, CITIC Securities International, and GF Securities (Hong Kong) as joint sponsors [1] Company Overview - Shenghong Technology is a leading global supplier of PCBs for artificial intelligence and high-performance computing, focusing on the R&D, production, and sales of advanced HDI and multi-layer PCBs [3] - The company holds the largest market share in the AI and high-performance computing PCB sector, with key applications including AI computing cards, servers, AI servers, data center switches, and general substrates [3] - Shenghong Technology is recognized for its technological leadership, capable of producing PCBs with over 100 layers and being among the first to achieve mass production of 6-layer 24-layer HDI products [3] Industry Trends - The explosive growth of AI technology is creating structural growth opportunities in the PCB industry, as AI server PCBs require high-frequency, low-signal loss, and high-heat dissipation capabilities [3] - The value of a single AI server PCB is significantly higher than that of traditional servers, leading to a projected substantial increase in demand for high-performance PCBs as AI applications expand [3] Market Projections - Global server shipments are expected to reach approximately 16 million units in 2024, with AI servers accounting for about 2 million units, representing 12.8% of total shipments [4] - By 2029, global server shipments are projected to grow to 18.8 million units, with AI server shipments reaching 5.4 million units, resulting in a compound annual growth rate (CAGR) exceeding 20% and an increase in AI servers' share to 21.7% [4] - The global capital expenditure for data centers is anticipated to reach $455 billion in 2024, with a significant portion allocated to AI infrastructure, driving demand for high-performance PCBs [4] Financial Performance - Shenghong Technology's revenue for the fiscal years 2022, 2023, and 2024 is reported as approximately RMB 7.885 billion, RMB 7.931 billion, and RMB 10.731 billion, respectively [5] - The company's profit attributable to owners for the same periods is approximately RMB 790 million, RMB 671 million, and RMB 1.154 billion, indicating a growth trajectory [5]

鹏鼎控股（002938）8月19日晚间公告，公司董事会审议通过议案，同意公司在淮安园区投资合计80亿 元建设淮安产业园，并同步投资建设SLP、高阶HDI及HLC等产品产能，扩充软板产能，为快速成长的 AI应用市场提供涵盖服务器、光通信、人形机器人、智能汽车及AI端侧产品等多领域的全方位PCB解决 方案。 提及AI服务器产线客户认证情况，鹏鼎控股表示，公司持续与服务器终端客户展开积极合作，目前主 流客户也在加快推进相关工作。同时，泰国园区第一期项目已建成，正在进行客户认证及打样阶段，预 计下半年能小批量投产。另外，鹏鼎控股称，公司今年资本开支计划主要投向包括泰国园区、软板扩 充、淮安园区在内的高阶HDI及SLP项目等。 在7月份披露的资者关系活动记录表中，鹏鼎控股表示，公司高度重视AI服务器领域的发展前景，目前 在淮安园区和泰国园区具备相关产能。公司积极关注全球AI服务器市场的发展动态，并将根据市场需 求和公司战略及时调整投资扩产计划。 消费电子及计算机用板业务方面，鹏鼎控股把握消费电子复苏周期，积极推动以AI眼镜为代表的AI端 侧产品的开发与量产，实现了相关业务的快速成长。上半年，公司消费电子与计算机用板业务 ...

Summary of Shennan Circuits Conference Call Company Overview - **Company**: Shennan Circuits (002916.SZ) - **Industry**: PCB (Printed Circuit Board) manufacturing, with a focus on AI applications Key Points and Arguments 1. **AI PCB Demand**: There is ongoing strength in demand for AI PCBs, which is expected to support resilient pricing and margins despite rising costs of raw materials such as CCL, gold-related chemicals, and glass fiber [1][2][4] 2. **Pricing and Margins**: The company is anticipated to experience slower price erosion than normal, leading to resilient margins. This is attributed to tight supply conditions in high-end PCBs for AI servers and networking [2][4] 3. **Revenue Estimates**: Revenue estimates for 2025E, 2026E, and 2027E have been revised slightly upward by 0% to 2%, reflecting a more resilient pricing outlook [8] 4. **Target Price Update**: The 12-month target price has been revised up to Rmb150 from Rmb132, based on a 29x P/E ratio for 2026E, aligning with the company's historical average [4][12] 5. **Valuation**: Shennan Circuits is currently trading at approximately 28x/23x P/E for 2026E/2027E, which is considered undemanding compared to its historical average of 29x [3][11] 6. **Market Position**: The company is viewed as a key beneficiary of China's domestic AI infrastructure investments, with expectations for robust revenue and net profit growth as local equipment vendors increase their server and networking shipments [11] Additional Important Content 1. **Risks**: Key downside risks include weaker demand in datacom/AI PCBs, geopolitical disruptions affecting supply chains, competitive pricing pressures, and potential deterioration in 5G demand [13] 2. **Industry Context**: The overall PCB industry in China has seen strong share price rallies driven by AI demand, contributing to valuation recovery [3] 3. **Financial Metrics**: The revised net profit estimates for 2025E, 2026E, and 2027E have been increased by 1% to 3%, reflecting the anticipated slower price erosion [8] This summary encapsulates the essential insights from the conference call regarding Shennan Circuits, highlighting its market position, financial outlook, and associated risks.

Market Overview - The A-share market continued to rise, with the Shanghai Composite Index reaching a nearly 10-year high and the North Star 50 hitting a historical peak. The Shenzhen Composite Index and the ChiNext Index also surpassed their highs from October 8 of the previous year [1] - The total trading volume in the Shanghai and Shenzhen markets was 2.76 trillion yuan, an increase of 519.6 billion yuan from the previous trading day, marking a new high for the year [1] - By the close of trading, the Shanghai Composite Index rose by 0.85%, the Shenzhen Composite Index increased by 1.73%, and the ChiNext Index gained 2.84% [1] Valuation Analysis - According to China International Capital Corporation (CICC), the overall valuation of A-shares is currently in a reasonable range and not overvalued. The dynamic price-to-earnings ratio of the CSI 300 is around 12.2 times, which is approximately at the 69th percentile historically since 2010 [2] - The market capitalization of A-shares has reached around 100 trillion yuan, with the ratio to GDP remaining at a relatively low level compared to major global markets [2] - The total market capitalization to M2 ratio is about 33%, positioned at the 60th percentile historically, indicating a moderate valuation level [2] - The dividend yield of the CSI 300 is 2.69%, which remains attractive compared to the yield of 10-year government bonds [2] Brokerage Sector Insights - Huatai Securities noted that the brokerage sector is currently undervalued and underweighted, with a positive outlook for value re-evaluation in the sector. The equity market has been steadily rising since the beginning of the year, with continuous increases in trading volume, margin financing balances, and the issuance scale of equity products [3] - The performance of brokerages is expected to improve due to the sustained growth of market conditions and the positive regulatory environment supporting capital markets [3] PCB Industry Outlook - Dongwu Securities highlighted that the recent price increases in copper-clad laminates reflect the high demand in the PCB industry, driven by the demand for computing servers. Several copper-clad laminate manufacturers have announced price hikes [4] - The demand for multi-layer boards, HDI, and high-frequency boards is expected to grow significantly, with specific requirements for drilling, exposure, and electroplating processes [4] - Dongwu Securities recommends focusing on the core processes of PCB production, including drilling, exposure, and electroplating [4]

Core Viewpoint - The company has developed relevant technologies in the optical module and server fields and can achieve large-scale production, although current shipment volumes are low [1] Group 1: Technology Development - The company is focusing on the development and application of cutting-edge PCB technologies [1] - The company plans to actively engage in the research and application of new technologies and products based on market demand and its own business advantages [1]