Core Viewpoint - Shenghe Jingwei is set to undergo an IPO review on February 24, 2026, after being accepted for listing on October 30, 2025, and entering the inquiry phase on November 14, 2025 [2] Group 1: Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise in the integrated circuit sector, specializing in 12-inch silicon wafer processing and providing wafer-level packaging (WLP) and multi-chip integration packaging services [2] - The company has shown consistent growth in revenue and net profit from 2022 to 2025, with revenues of approximately 1.633 billion, 3.038 billion, and 4.705 billion yuan for the years 2022, 2023, and 2024 respectively, and net profits of approximately -329 million, 34.13 million, and 214 million yuan for the same years [2] Group 2: Financial Performance - In 2025, Shenghe Jingwei achieved revenues of approximately 6.521 billion yuan, a year-on-year increase of 38.59%, and a net profit of approximately 923 million yuan, a year-on-year increase of 331.8% [2] - The company attributed its significant revenue and profit growth to the rapid increase in market demand within its industry, along with continuous growth in production and sales scale, and ongoing optimization of product structure [2] Group 3: Fundraising and Investment Plans - The company plans to raise 4.8 billion yuan through its IPO, with net proceeds after issuance costs to be invested in three-dimensional multi-chip integration packaging projects and ultra-high-density interconnection three-dimensional multi-chip integration packaging projects [3] Group 4: Customer Concentration and Risks - Shenghe Jingwei's customer concentration has raised concerns, with the top five customers accounting for 72.83% to 90.87% of total sales from 2022 to 2025, and a single customer (Customer A) representing 40.56% to 74.4% of sales during the same period [5] - The company has established long-term stable relationships with major clients and signed long-term framework agreements, which help enhance its core competitiveness despite the high customer concentration [6] Group 5: Inventory Trends - The company's inventory has been increasing, with values of approximately 356 million, 683 million, 1.193 billion, and 1.344 billion yuan at the end of each reporting period, representing 16.1%, 13.1%, 11.66%, and 13.72% of current assets respectively [7] - The growth in inventory is attributed to the expansion of the company's operational scale and revenue [8] Group 6: Shareholding Structure - Shenghe Jingwei has no actual controller or controlling shareholder, with the largest shareholder, Wuxi Chanfang Fund, holding a 10.89% stake as of the signing date of the prospectus [9]

Core Insights - The integrated circuit packaging and testing (ICPT) industry is a crucial part of the semiconductor supply chain, ensuring chip usability and quality certainty, and is supported by various national policies in China [1][4] - The global ICPT market is experiencing fluctuating growth, with a significant shift of capacity towards emerging Asian markets, particularly Taiwan, mainland China, and the USA [1][4] - Advanced packaging is becoming the main growth driver in the post-Moore's Law era, with the largest market segment being flip-chip packaging and the fastest growth in multi-chip integration packaging [1][5] Industry Overview - ICPT encompasses both packaging and testing, connecting wafer manufacturing with end applications, providing physical protection and performance validation [2][3] - The industry is supported by national policies aimed at technological breakthroughs and market expansion, with recent initiatives focusing on energy electronics and AI [4] Global Market Analysis - The global ICPT market is projected to reach $117.85 billion by 2026, with advanced packaging expected to grow at a compound annual growth rate (CAGR) of 13.2% from 2024 to 2026, significantly outpacing traditional packaging's 3.9% CAGR [4][5] - The market is currently in a downturn due to weak demand in consumer electronics and global economic uncertainties, but is expected to recover in 2024 as demand stabilizes [4] China Market Analysis - The mainland China ICPT market is expected to grow from 250.95 billion yuan in 2020 to 353.39 billion yuan by 2025, with a CAGR of 7.09% [6][7] - Advanced packaging is gaining traction, with its market share projected to reach 20.86% by 2025, driven by domestic demand and technological advancements [7] Competitive Landscape - The global ICPT industry is dominated by a few key players, with the top three companies holding approximately 50% of the market share by 2024 [12] - Mainland China has four companies in the global top ten, showcasing its competitive strength in the ICPT sector [12] Future Development Trends - The industry is expected to shift towards high-end, collaborative, and differentiated development, focusing on advanced packaging technologies and enhancing domestic supply chains [13][14] - There will be a continued emphasis on optimizing demand structures, with a shift from traditional consumer electronics to high-end applications like automotive electronics and AI [15]

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. is set to go public on February 24, 2024, aiming to raise 4.8 billion yuan for advanced packaging projects, positioning itself as a significant player in the semiconductor testing and packaging industry [1][2]. Group 1: Company Overview - Shenghe Jingwei is ranked as the 10th largest semiconductor packaging and testing company globally and the 4th largest domestically according to Gartner [1]. - The company was established in 2014 as a joint venture between SMIC and JCET, focusing on bridging the gap in the 12-inch wafer processing segment [1][2]. Group 2: Business Operations - The company specializes in advanced 12-inch wafer processing and has become a key supplier for Qualcomm, marking its entry into the market [2]. - Shenghe Jingwei has achieved significant milestones in 12-inch wafer-level chip packaging (WLCSP), with mass production starting in 2018 [2]. Group 3: Market Position - As of 2024, Shenghe Jingwei holds the largest 12-inch Bumping capacity in mainland China and is the first to provide 14nm advanced process Bumping services [3]. - The company leads the market in 12-inch WLCSP revenue in mainland China with a market share of approximately 31% [4]. Group 4: Financial Performance - The company reported a compound annual growth rate (CAGR) of 69.77% in revenue from 2022 to 2024, with projected revenues of 6.52 billion yuan in 2025, reflecting a year-on-year growth of 38.59% [9]. - Shenghe Jingwei turned a profit in 2023 after previous losses, with net profits of 340 million yuan, 2.14 billion yuan in 2024, and 4.35 billion yuan in the first half of 2025 [9]. Group 5: Research and Development - The company has significantly increased its R&D investments, with expenditures rising from 257 million yuan in 2022 to 506 million yuan in 2024 [10]. - Shenghe Jingwei's R&D encompasses various advanced processes, including CVD, CMP, and TSV, contributing to its competitive edge in the industry [11].

Group 1 - The core point of the article is that Shenghe Jingwei Semiconductor Co., Ltd. is set to undergo an IPO review on February 24, aiming to raise approximately 4.8 billion yuan for advanced packaging projects [1] - Shenghe Jingwei is a leading global provider of integrated circuit wafer-level advanced packaging services, focusing on 12-inch silicon wafer processing and offering wafer-level packaging (WLP) and multi-chip integration packaging [1] - The company aims to enhance the performance of high-performance chips, particularly GPUs, CPUs, and AI chips, through heterogeneous integration methods that exceed Moore's Law, achieving improvements in computing power, bandwidth, and energy efficiency [1] Group 2 - The IPO application was accepted on October 30, 2025, and entered the inquiry stage on November 14 of the same year [1] - The funds raised will be allocated to projects including three-dimensional multi-chip integration packaging and ultra-high-density interconnect three-dimensional multi-chip integration packaging [1]

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and forming a strategic partnership to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - The company's main business involves high-end packaging and testing services for integrated circuits, with a revenue composition of 90.25% from display driver chip packaging [3][8]. Group 2: Financial Performance - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, reflecting a year-on-year growth of 21.05%, and a net profit of 124 million yuan, up 23.21% year-on-year [9]. - The overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4][9]. - The company has distributed a total of 161 million yuan in dividends since its A-share listing [9]. Group 3: Market Position and Trends - The company operates within the semiconductor industry, specifically in the integrated circuit packaging and testing sector, and is categorized under advanced packaging and semiconductor concepts [8]. - The stock experienced a decline of 3.12% on February 10, with a trading volume of 651 million yuan and a market capitalization of 16.206 billion yuan [1].

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is actively expanding its business in advanced packaging and testing services for integrated circuits, particularly in response to the growing demand for storage chips in the AI infrastructure era [2][3]. Group 1: Business Developments - The company has acquired a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and established a strategic partnership with its shareholder, East China Technology (Suzhou) Co., Ltd., to jointly develop 3D DRAM and other storage chip packaging and testing services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2][3]. Group 2: Financial Performance - For the period from January to September 2025, the company reported a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, up 23.21% year-on-year [9]. - As of September 30, 2024, the company's overseas revenue accounted for 54.15%, benefiting from the depreciation of the yuan [4]. Group 3: Market Position and Shareholder Information - The company operates primarily in the semiconductor industry, focusing on integrated circuit packaging and testing, with display driver chip testing accounting for 90.25% of its revenue [8]. - As of September 30, 2024, the number of shareholders increased to 23,500, with an average of 36,445 circulating shares per person, reflecting a rise of 27.82% [9].

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has responded to the second round of IPO inquiry from the Sci-Tech Innovation Board, with CICC as the sponsor [2] Group 1: Company Structure and Shareholding - The company has no actual controller, and major shareholders holding more than 5% of shares, including Advpackaging, have committed to a 36-month lock-up period starting from the listing date, with a total lock-up ratio of 39.22% [2] - There are interconnections among several shareholders, such as Puhua Chuangyu, Puhua Zhixin, and Hua Capital, which can be traced back to three natural person shareholders: Liu Yue, Chen Datong, and Wu Haibin [2] Group 2: Board and Management Relationships - The board consists of 9 directors, with some directors having relationships with shareholders, including being appointed by relevant shareholders or holding more than 5% equity in related shareholders [4] - The company has confirmed that there are no undisclosed relationships between senior management and shareholders, aside from those already disclosed [4] Group 3: Director Backgrounds - The company provided a detailed table of directors and their relationships with shareholders, indicating various levels of involvement and shareholdings [5] - Notable positions include the Chairman and CEO, who holds 18.14% of the equity in the employee stock ownership platform, and other directors with similar ties to shareholder entities [5] Group 4: Business Overview - Shenghe Jingwei is an advanced packaging and testing enterprise in the integrated circuit industry, focusing on 12-inch silicon wafer processing and providing advanced packaging services such as wafer-level packaging (WLP) and multi-chip integration packaging [2] - The company aims to support high-performance chips, particularly GPUs, CPUs, and AI chips, by enhancing performance through heterogeneous integration beyond Moore's Law, achieving high computing power, high bandwidth, and low power consumption [2]

Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is actively expanding its business in advanced packaging and testing services for integrated circuits, particularly in response to the growing demand for storage chips in the AI infrastructure era [2][3]. Group 1: Business Developments - The company has acquired a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd. and established a strategic partnership with its shareholder, East China Technology (Suzhou) Co., Ltd., to jointly develop 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 2.5D/3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2][3]. Group 2: Financial Performance - For the period from January to September 2025, the company reported a revenue of 1.295 billion yuan, representing a year-on-year growth of 21.05%, and a net profit attributable to shareholders of 124 million yuan, up 23.21% year-on-year [9]. - The company's overseas revenue accounted for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. Group 3: Market Position and Shareholder Information - As of September 30, 2025, the company had 23,500 shareholders, an increase of 15.93% from the previous period, with an average of 36,445 circulating shares per shareholder, up 27.82% [9]. - The company is listed in the electronic-semiconductor-integrated circuit packaging and testing sector, with its main revenue derived from display driver chip packaging, which constitutes 90.25% of its total revenue [8].

1. Report Industry Investment Rating - No industry investment rating information is provided in the report. 2. Core Views of the Report - In 2026, the process of incremental funds entering the market will continue, and the "Spring Rally" market is likely to occur at the beginning of the year, with the main focus on investment opportunities in the technology and high - end manufacturing sectors [3][54]. - As the proportion of institutional investors in the convertible bond market increases, the impact of stock market expectations on convertible bond valuation deepens. Given investors' optimism about the medium - to - long - term stock market, institutional investors' demand for equity assets remains strong, and the stable capital situation supports convertible bond valuation, with limited short - to - medium - term downside [3][54]. - When the valuation is stable, convertible bonds show the characteristics of "strong in rising and weak in falling" compared to underlying stocks, and still have high allocation value [3][54]. - Recommended convertible bond tracks and targets: (1) In the technology growth sector, pay attention to Ruike, Qizhong and other convertible bonds due to rising overseas computing power demand and the acceleration of AI industrialization; (2) In the high - end manufacturing field, focus on convertible bonds such as Yake, Daimei, Huachen, and Yubang; (3) Due to the optimization of the supply - demand pattern in some industries, pay attention to Youfa convertible bond [3][54]. 3. Summary According to the Directory 3.1 Strategy Analysis 3.1.1 February's Top Ten Convertible Bonds - Meinuohua/Meinuo Convertible Bond: A comprehensive international pharmaceutical technology manufacturing company. The JH389 project in its innovation pipeline is in continuous progress, with positive results in product development, patent application, and commercialization planning [2][10]. - Yatai Technology/Yaoke Convertible Bond: Focuses on R & D and production of aluminum materials and components for automobile thermal management and lightweight systems. It is an important global supplier in these fields and is actively expanding into emerging areas such as new - energy vehicles, aerospace, industrial thermal management, and robotics [2][11]. - Youfa Group/Youfa Convertible Bond: The largest domestic welded steel pipe R & D, production, and sales enterprise. With the improvement of downstream demand and the upcoming new round of supply - side reform, the company plans to improve its national and overseas layout [2][17]. - Jiangsu Huachen/Huachen Convertible Bond: Engaged in the R & D, production, and sales of power transmission and control equipment. With the growth of global energy investment, the company is optimizing its overseas market strategy and aiming for new breakthroughs in overseas markets [2][20]. - Hongya CNC/Hongya Convertible Bond: A leading domestic furniture equipment enterprise. Its subsidiaries are developing in the fields of furniture manufacturing automation solutions and high - precision gears, with good industrial synergy [24]. - Qizhong Technology/Qizhong Convertible Bond: Specializes in advanced packaging and testing of integrated circuits. It is a leading domestic company in bumping manufacturing technology. The global and Chinese display driver chip markets are growing, providing development opportunities [2][28]. - Seiko Steel Structure/Seiko Convertible Bond: A comprehensive steel structure enterprise with complete industrial chain services. It has traditional and innovative business models and has successfully undertaken many overseas landmark projects [2][33]. - Daimei Co., Ltd./Daimei Convertible Bond: A leading global automotive interior parts manufacturer. It has established a new subsidiary focusing on intelligent robotics, marking a step forward in its intelligent business layout [2][37]. - Yubang New Materials/Yubang Convertible Bond: A global supplier of tin - coated welding tapes for photovoltaic modules. It is entering the industrial thermal management track by investing in a technology company, and the data center thermal management market has broad prospects [2][44]. - Ruike Da/Ruike Convertible Bond: A national specialized and sophisticated "little giant" enterprise in connector products. It has a wide range of products in new - energy vehicles, data centers, and other fields, and the demand for its high - speed cable products in data centers is strong [2][48]. 3.1.2 Weekly Convertible Bond Strategy - This week, the stock indices showed a differentiated trend. The CSI Convertible Bond Index fell by 2.61%. The petrochemical, communication, and coal industries ranked high in terms of price changes. The median prices of convertible bonds in each parity range decreased, and the convertible bond valuation is still relatively high compared to historical levels [2][54]. 3.2 Market Tracking - The report provides multiple charts to track the market, including the price changes of broad - based indices and industry indices, the median prices of convertible bonds in different conversion value ranges, the changes in convertible bond valuation, and the back - testing results of various strategy indices. However, specific data analysis is not elaborated in the text [58][60][63].

Investment Rating - The report maintains a "Buy" rating for Jiangsu Changjiang Electronics Technology Co., Ltd. (长电科技), Haiguang Information Technology Co., Ltd. (海光信息), and Guanghe Technology Co., Ltd. (广合科技) [7][14] Core Insights - Jiangsu Changjiang Electronics Technology Co., Ltd. has made significant progress in the CPO product technology field, successfully delivering samples of its XDFOI process silicon photonic engine, which optimizes energy efficiency and bandwidth performance [12][13] - Intel showcased its EMIB glass substrate technology at the NEPCON Japan electronics exhibition, demonstrating the capability of glass substrates to support complex multi-chip configurations, offering advantages over traditional organic substrates [13] - The report highlights the increasing demand for PCBs driven by emerging technologies such as 5G, AI, and automotive electronics, with China becoming the largest PCB production base globally [28][29] Summary by Sections Company Performance and Forecast - Jiangsu Changjiang Electronics Technology Co., Ltd. is projected to have an EPS of 1.23 in 2026 with a PE ratio of 39.73 [7][14] - Haiguang Information Technology Co., Ltd. is expected to achieve an EPS of 1.58 in 2026 with a PE ratio of 174.68 [7][14] - Guanghe Technology Co., Ltd. is forecasted to have an EPS of 2.67 in 2026 with a PE ratio of 37.33 [7][14] Industry Dynamics - The electronic industry saw a 1.39% increase in the week of January 19-23, ranking 22nd among the primary industries [15][24] - The AI computing-related sub-sector experienced a significant increase, with the integrated circuit packaging and testing sector rising by 7.25% [18][20] - The PCB industry is expected to recover from a downturn, with revenue growth projected to stabilize in 2025 after a challenging period in 2023 [29][30] Market Trends - The report notes a trend of increasing orders in the data processing sector, with AI-related orders constituting over 73% of new contracts for companies like Chip Origin Technology [42][43] - The automotive industry faces challenges due to rising memory prices, which could significantly impact manufacturing costs and supply availability [46][47]