Core Viewpoint - The company, Hefei Xinhui Microelectronics Co., Ltd., is strategically expanding its business in the semiconductor industry, particularly in advanced packaging and storage chip sectors, to capitalize on the growing demand driven by AI infrastructure [2][3]. Group 1: Company Developments - On October 14, 2025, the company announced a significant investment by acquiring a 27.5445% stake in Hefei Xinfeng Technology Co., Ltd., and forming a strategic partnership with East China Technology (Suzhou) Co., Ltd. to expand into 3D DRAM and other storage chip packaging services [2]. - The company is focusing on advanced packaging technologies, including Chiplet, Fan-out, 3D, and SiP, leveraging its expertise in bump manufacturing as a foundational technology [2]. - As of September 30, 2025, the company reported a revenue of 1.295 billion yuan, marking a year-on-year growth of 21.05%, and a net profit of 124 million yuan, with a growth of 23.21% [9]. Group 2: Market Position and Financials - The company has a significant international presence, with overseas revenue accounting for 54.15% of total revenue, benefiting from the depreciation of the Chinese yuan [4]. - The main business of the company is integrated circuit advanced packaging and testing services, with display driver chip packaging accounting for 90.25% of its revenue [3][8]. - As of September 30, 2025, the number of shareholders increased to 23,500, with an average of 36,445 shares held per shareholder, indicating growing investor interest [9].

Report's Investment Rating for the Industry - No information regarding the industry investment rating is provided in the report. Core Views - The bond market sentiment was generally positive last week due to factors such as the central bank's resumption of treasury bond trading, loose cross - month funds, the stock market decline after the Sino - US summit, and weak PMI data. The 10 - year treasury bond yield closed at 1.80% on Friday, down 5.32bp from the previous week [1][7][8]. - The equity market rose first and then fell last week. With positive factors like Sino - US trade negotiations, the release of the "15th Five - Year Plan" draft, and the Fed's interest - rate cut expectation, the A - share market was strong in the first half of the week, with the Shanghai Composite Index hitting a new high above 4000. However, it declined in the second half as positive news materialized and the demand for profit - taking increased. The technology hardware sector, which had a high increase previously, led the decline [1][7]. - Most convertible bond issues rose last week. The CSI Convertible Bond Index increased by 0.79% for the whole week, the median price rose by 0.63%, and the calculated arithmetic average parity increased by 0.64%. The overall conversion premium rate increased by 0.10% compared with the previous week [1][8]. - Convertible bonds are still restricted by high prices, high premiums, and frequent redemptions. The overall opportunity is hard to find as the median convertible bond price remains above 130 yuan. For different types of convertible bonds, there are different challenges, such as limited capacity and return space for low - price strategies in debt - biased convertible bonds, over - anticipation of underlying stock price increases in balanced convertible bonds, and the risk of double - killing of valuation and parity in high - quality "core stocks" of non - redeemable equity - biased convertible bonds during market fluctuations [2][17]. - Given the strong bullish atmosphere in the equity market, it is difficult to make decisions on increasing or decreasing positions. The overall assets should be treated with a trading - band mindset. When selecting bonds, it is advisable to allocate evenly across industries. For balanced convertible bonds, choose those with high - volatility underlying stocks that can quickly digest the high convertible bond premiums, and for equity - biased convertible bonds, focus on low - premium targets [2][17]. Summary by Relevant Catalogs Market Trends (2025/10/27 - 2025/10/31) Stock Market - The equity market showed a volatile trend. The Shanghai Composite Index had different daily changes: up 1.18% on Monday, down 0.22% on Tuesday, up 0.7% on Wednesday, down 0.73% on Thursday, and down 0.81% on Friday. Different sectors had varying performances each day [7]. - Most Shenwan primary industries rose last week. The top - performing industries were power equipment (4.29%), non - ferrous metals (2.56%), steel (2.55%), basic chemicals (2.50%), and comprehensive (2.26%), while communication (-3.59%), beauty care (-2.21%), banking (-2.16%), and electronics (-1.65%) performed poorly [8]. Bond Market - The bond market sentiment was good. The 10 - year treasury bond yield closed at 1.80% on Friday, down 5.32bp from the previous week, influenced by factors such as the central bank's actions, fund conditions, stock market movements, and PMI data [1][7][8]. Convertible Bond Market - Most convertible bond issues rose. The CSI Convertible Bond Index increased by 0.79% for the whole week, the median price rose by 0.63%, and the arithmetic average parity increased by 0.64%. The overall conversion premium rate increased by 0.10% compared with the previous week. The arithmetic average conversion premium rates of convertible bonds in different parity ranges also changed [1][8]. - In terms of industries, most convertible bond industries rose. The top - performing industries were steel (+3.04%), machinery and equipment (+2.15%), national defense and military industry (+1.75%), and automobile (+1.16%), while communication (-3.18%), beauty care (-3.17%), building materials (-0.75%), and media (-0.48%) performed poorly [11]. - At the individual bond level, Titan (solid - state battery concept), Dazhong (lithium mine), Zhenhua (chromium salt), Zhonghuan Zhuan 2 (innovative drugs), and Yunji (belt conveyor) convertible bonds led the increase, while Tongguang (optical fiber cable), Shuiyang (skin care products), Jingda (controllable nuclear fusion), Huayi (semiconductor clean room), and Wujin (stainless steel) convertible bonds led the decline [1][12]. - The total trading volume of the convertible bond market last week was 310.731 billion yuan, with an average daily trading volume of 62.146 billion yuan, which was higher than the previous week [15]. Valuation Overview - As of October 31, 2025, for equity - biased convertible bonds, the average conversion premium rates in different parity intervals were at different percentile levels since 2010 and 2021. For debt - biased convertible bonds, the average YTM of those with a parity below 70 yuan was -5.3%, at the 0%/1% percentile levels since 2010/2021. The average implied volatility of all convertible bonds was 40.84%, and the difference between the convertible bond implied volatility and the long - term actual volatility of the underlying stocks was -1.34%, both at certain percentile levels [18]. Primary Market Tracking Last Week (2025/10/27 - 2025/10/31) - Qizhong Convertible Bond announced its issuance, and Jin 25 and Funeng Convertible Bonds were listed. Qizhong Convertible Bond has a scale of 850 million yuan, Jin 25 Convertible Bond has a scale of 2 billion yuan, and Funeng Convertible Bond has a scale of 3.802 billion yuan. Each bond's underlying company has its own business characteristics, financial performance, and planned use of funds after deducting issuance fees [26][27][29]. - One company (Ruikeda) got new approval for registration, one company (Shuangle Co., Ltd.) passed the listing committee review, 13 companies' applications were accepted by the exchange, one company (Mankun Technology) passed the shareholders' meeting, and 4 companies announced board proposals [31]. Future Week (2025/11/3 - 2025/11/7) - As of the announcement on October 31, there is no convertible bond announced for issuance, and Jinlang Zhuan 02 is expected to be listed. It has a scale of 1.677 billion yuan, and its underlying company has specific business operations, financial data, and planned use of funds [30]. - Currently, there are 94 convertible bonds waiting to be issued, with a total scale of 143.51 billion yuan. Among them, 5 have been approved for registration with a total scale of 4.15 billion yuan, and 6 have passed the listing committee review with a total scale of 3.38 billion yuan [31].

Group 1: IPO Market Developments - The week of October 27 to November 2 saw significant IPO activity, including the listing of the first batch of newly registered companies in the Sci-Tech Innovation Board's growth tier, with three unprofitable companies making their debut [1] - The companies He Yuan Bio-U, Xi'an Yicai-U, and Bi Bei Te-U collectively listed on the Sci-Tech Innovation Board, with closing prices on October 31 showing substantial increases compared to their issue prices, with gains of 3.25 times, 2.33 times, and 92% respectively [1] - Mo Er Thread received its IPO registration approval on October 30, taking four months from application acceptance to registration effectiveness [1][2] Group 2: Mo Er Thread Company Overview - Mo Er Thread, established in June 2020, focuses on the research, design, and sales of GPUs and related products, aiming to raise 8 billion yuan through its IPO for various AI and graphics chip development projects [2] - The company plans to allocate funds for the development of a new generation of AI training and inference chips, graphics chips, and AI SoC chips, as well as to supplement working capital [2] Group 3: Tian Su Measurement Company Insights - Tian Su Measurement, which provides calibration, testing, and certification services, received its IPO registration approval during the same week, but highlighted risks related to declining certificate prices that could impact performance [2][3] - The company's calibration business revenue accounted for over 91% of its main business income during the reporting period, with a noted decrease in certificate prices from 142.01 yuan to 119.43 yuan [2] Group 4: Sheng He Jing Wei Semiconductor Company Profile - Sheng He Jing Wei Semiconductor's IPO application was accepted on October 30, with plans to raise 4.8 billion yuan, focusing on advanced packaging and testing for integrated circuits [3] - The company reported revenues of 16.33 billion yuan in 2022, with projections of 30.38 billion yuan and 47.05 billion yuan for the following years, but also noted a significant customer concentration risk [3][4] Group 5: Zhu Zhou Ke Neng New Materials Company Status - Zhu Zhou Ke Neng New Materials' IPO application was terminated after being in a stagnant state since July 2023, despite meeting the R&D investment criteria for the Sci-Tech Innovation Board [4][5] - The company specializes in the research, production, and sales of rare metal elements and reported fluctuating revenues and net profits, alongside deteriorating cash flow from operating activities [5]

目前，全球范围内，只有少数领先企业具备2.5D的量产能力，其中台积电、英特尔、三星电子合计占据 80%以上的市场规模，2024年度，公司2.5D的全球市场占有率约为8%。 此外，公司亦在持续丰富完善3D集成（3DIC）、三维封装（3D Package）等技术平台，以期在集成电 路制造产业更加前沿的关键技术领域实现突破，为未来经营业绩创造新的增长点。 财务数据显示，2022年度、2023年度、2024年度及2025年1—6月，盛合晶微分别实现营业收入约16.33 亿元、30.38亿元、47.05亿元、31.78亿元；同期实现净利润分别约为-3.29亿元、3413.06万元、2.14亿 元、4.35亿元。 在主营业务领域中，公司已大规模向客户提供的各类服务均在中国大陆处于领先地位，具体而言：在中 段硅片加工领域，公司是中国大陆最早开展并实现12英寸Bumping量产的企业之一，也是第一家能够提 供14nm先进制程Bumping服务的企业，公司具备2.5D/3DIC超高密度微凸块的大规模量产能力，填补了 中国大陆高端集成电路制造产业链的空白。根据灼识咨询的统计，截至2024年末，公司是中国大陆12英 寸Bumpin ...

Core Viewpoint - Shenghe Jingwei Semiconductor Co., Ltd. has received acceptance for its IPO on the Sci-Tech Innovation Board, indicating a significant step in its growth trajectory in the semiconductor industry [3]. Company Overview - Shenghe Jingwei is an advanced packaging and testing enterprise for integrated circuits, focusing on 12-inch silicon wafer processing and providing wafer-level packaging (WLP) and multi-chip integration packaging services [3]. - The company aims to support high-performance chips, particularly GPUs, CPUs, and AI chips, through heterogeneous integration methods that enhance performance metrics such as computing power, bandwidth, and energy efficiency [3]. Financial Performance - The company reported revenues of 1.633 billion yuan, 3.038 billion yuan, and 4.705 billion yuan for the years 2022, 2023, and 2024 respectively, with a projected revenue of 3.178 billion yuan for the first half of 2025 [3]. - Net profits for the same periods were -329 million yuan, 34.13 million yuan, 214 million yuan, and 43.5 million yuan for the first half of 2025 [3]. Market Position - According to Gartner, Shenghe Jingwei is projected to be the 10th largest packaging and testing company globally and the 4th largest domestically by 2024, with the highest compound annual growth rate in revenue among the top ten companies from 2022 to 2024 [3]. Shareholding Structure - As of the date of the prospectus, the largest shareholder is Wuxi Chanfang Fund with a 10.89% stake, followed by a group of shareholders from the China Merchants Bank system with a combined 9.95% [4]. - The company has no controlling shareholder or actual controller, ensuring a dispersed shareholding structure where no single shareholder can dominate the shareholder meetings [5].

Core Viewpoint - Tongfu Microelectronics is a leading integrated circuit packaging and testing company, achieving significant revenue and profit growth in the semiconductor industry, driven by advanced packaging demands, particularly from AI applications [2][6]. Group 1: Company Overview - Tongfu Microelectronics was established on February 4, 1994, and listed on the Shenzhen Stock Exchange on August 16, 2007. The company is headquartered in Nantong, Jiangsu Province, and is recognized for its full industry chain service capabilities in integrated circuit packaging and testing [1]. - The company operates in various sectors, including semiconductor packaging, storage, nuclear fusion, superconductivity, and nuclear power [1]. Group 2: Financial Performance - In Q3 2025, Tongfu Microelectronics reported a revenue of 20.116 billion yuan, ranking second among 13 companies in the industry. The top competitor, Changjiang Electronics Technology, achieved a revenue of 28.669 billion yuan, while the industry average was 5.49 billion yuan [2]. - The net profit for the same period was 999.4 million yuan, the highest in the industry, with Changjiang Electronics' net profit at 951 million yuan and the industry average at 250 million yuan [2]. Group 3: Financial Ratios - As of Q3 2025, the company's debt-to-asset ratio was 63.04%, an increase from 59.46% year-on-year and above the industry average of 40.98% [3]. - The gross profit margin was reported at 15.26%, up from 14.33% year-on-year but still below the industry average of 20.20% [3]. Group 4: Shareholder Information - As of September 30, 2025, the number of A-share shareholders increased by 27.05% to 350,700, with an average holding of 4,327.16 shares, a decrease of 21.29% [5]. - Among the top ten shareholders, Hong Kong Central Clearing Limited held 53.7918 million shares, an increase of 28.7179 million shares from the previous period [5]. Group 5: Market Outlook - Huachuang Securities noted that Tongfu Microelectronics achieved record high performance in Q3 2025, driven by the recovery of industry demand and product structure optimization. The company is well-positioned to benefit from the growing demand for advanced packaging driven by AI [6]. - Dongguan Securities highlighted the company's continuous high growth in operating performance, particularly in mid-to-high-end product revenues, and its strategic partnership with AMD as a core packaging supplier [6].

Core Insights - The company, Jingfang Technology, is a pioneer in the application of WLCSP in the sensor field, particularly in CIS, and has a diverse range of technical and product service capabilities [1] Group 1: Business Performance - For Q3 2025, Jingfang Technology reported revenue of 1.066 billion yuan, ranking 8th in the industry, significantly lower than the top competitor Changdian Technology at 28.669 billion yuan and second-place Tongfu Microelectronics at 20.116 billion yuan [2] - The net profit for the same period was 271 million yuan, ranking 4th in the industry, below Tongfu Microelectronics' 994 million yuan and Changdian Technology's 951 million yuan, but above the industry average of 250 million yuan [2] Group 2: Financial Ratios - As of Q3 2025, the company's debt-to-asset ratio was 12.80%, an increase from 8.94% year-on-year, but still significantly lower than the industry average of 40.98%, indicating strong solvency [3] - The gross profit margin for Q3 2025 was 47.75%, up from 43.60% year-on-year, and higher than the industry average of 20.20%, reflecting robust profitability [3] Group 3: Shareholder Information - As of September 30, 2025, the number of A-share shareholders increased by 7.82% to 147,700, while the average number of circulating A-shares held per shareholder decreased by 7.26% to 4,416.77 [5] - Notable changes among the top ten circulating shareholders included a decrease in holdings by Dongwu Mobile Internet Mixed A and an increase by Hong Kong Central Clearing Limited [5] Group 4: Strategic Developments - The company is focusing on advanced packaging technology and expanding its capabilities in the automotive CIS sector, enhancing its competitive edge in emerging application markets [6] - Jingfang Technology is also involved in significant acquisitions, such as Anteryon in the Netherlands and VisIC in Israel, to broaden its technological scope and industry collaboration [6]

Core Viewpoint - Liyang Chip, a well-known independent third-party professional testing technology service provider in China, focuses on integrated circuit testing and has a comprehensive testing capability for SoC chips [1] Group 1: Business Performance - In Q3 2025, Liyang Chip achieved revenue of 443 million yuan, ranking 11th among 13 companies in the industry, while the industry leader, Changjiang Electronics, reported revenue of 28.669 billion yuan [2] - The net profit for the same period was 2.7353 million yuan, placing the company 10th in the industry, with the top performer, Tongfu Microelectronics, reporting a net profit of 999.4 million yuan [2] Group 2: Financial Ratios - As of Q3 2025, Liyang Chip's debt-to-asset ratio was 55.25%, down from 56.24% year-on-year, which is higher than the industry average of 40.98% [3] - The gross profit margin for Q3 2025 was 26.02%, an increase from 24.51% year-on-year, exceeding the industry average of 20.20% [3] Group 3: Executive Compensation - The chairman, Huang Jiang, received a salary of 4.605 million yuan in 2024, an increase of 22,100 yuan from 2023 [4] - The general manager, Zhang Yifeng, earned 2.7631 million yuan in 2024, up by 27,300 yuan from the previous year [4] Group 4: Shareholder Information - As of September 30, 2025, the number of A-share shareholders increased by 50.88% to 22,800, while the average number of circulating A-shares held per account decreased by 33.44% to 8,924.17 [5] - The company is pursuing a "one body, two wings" strategy, with integrated circuit testing revenue growing by 21.85% year-on-year in the first half of 2025 [5] Group 5: Future Outlook - Revenue is projected to grow by 24.6%, 24.2%, and 23.0% from 2025 to 2027, reaching 608 million, 756 million, and 930 million yuan respectively, with net profit expected to turn positive by 2027 [5] - The company is focusing on the autonomous driving and robotics sectors to enhance future growth potential [5]

Core Insights - Shenghe Jingwei's application for listing on the Sci-Tech Innovation Board has been accepted, marking a significant step in the ongoing trend of semiconductor companies going public in China [1] - Shenghe Jingwei is a leading global provider of advanced packaging services for integrated circuits, focusing on high-performance chips such as GPUs, CPUs, and AI chips, with a strong technological platform in the 2.5D integration field [2] - Since 2020, Shangfeng has invested over 2 billion yuan in more than 20 semiconductor companies, with a significant portion of these companies either in the listing process or already listed, showcasing its strategic focus on the semiconductor sector [3] Company Overview - Shenghe Jingwei specializes in advanced wafer-level packaging and multi-chip integration packaging, aiming to enhance performance metrics like computing power, bandwidth, and energy efficiency [2] - The company is recognized as one of the earliest and largest producers of 2.5D integration technology in mainland China, achieving a market share of approximately 85% in this segment for 2024 [2] Investment Strategy - Shangfeng's investment in Shenghe Jingwei amounted to 150 million yuan, part of a broader strategy to strengthen its competitive edge in the semiconductor industry [3] - The company has focused on investing in sectors that address critical technology gaps, with a significant portion of its investments directed towards semiconductor and new materials companies [3] - Over 60% of the invested companies are either in the process of applying for listing or have already gone public, indicating a successful investment strategy that enhances financial returns and industry influence [3]

Core Insights - On October 30, Qizhong Technology's stock rose by 6.26%, with a trading volume of 699 million yuan [1] - As of September 30, Qizhong Technology reported a revenue of 1.605 billion yuan, an increase of 11.80% year-on-year, while net profit decreased by 19.20% to 185 million yuan [2] Financing and Margin Trading - On October 30, Qizhong Technology had a financing buy-in of 64.44 million yuan and a net buy of 992,300 yuan, with a total financing balance of 352 million yuan [1] - The financing balance represents 6.58% of the circulating market value, indicating a high level compared to the past year [1] - The company had a margin trading balance of 154,000 yuan, which is below the 40th percentile of the past year, indicating a low level of short selling activity [1] Shareholder Information - As of September 30, the number of shareholders increased by 14.73% to 23,800, while the average number of circulating shares per person decreased by 12.84% to 15,367 shares [2] - Qizhong Technology has distributed a total of 297 million yuan in dividends since its A-share listing [3] - Notable institutional shareholders include the Jiashi Shanghai Stock Exchange Science and Technology Innovation Board Chip ETF, which reduced its holdings by 480,800 shares, and the Hong Kong Central Clearing Limited, which is a new shareholder [3]