Core Viewpoint - The stock of Ultrasonic Electronics has experienced fluctuations, with a recent decline of 2.06% and a year-to-date increase of 26.78%, indicating volatility in its market performance [1][2]. Company Overview - Ultrasonic Electronics, established on September 5, 1997, and listed on October 8, 1997, is located in Shantou, Guangdong Province. The company specializes in the research, production, and sales of printed circuit boards, LCDs, touch screens, ultra-thin and special copper-clad laminates, and ultrasonic electronic instruments [1]. - The revenue composition of Ultrasonic Electronics is as follows: printed circuit boards 50.64%, LCDs 27.87%, copper-clad laminates 16.91%, and ultrasonic electronic instruments and others 4.59% [1]. Financial Performance - For the period from January to September 2025, Ultrasonic Electronics achieved a revenue of 4.674 billion yuan, representing a year-on-year growth of 10.91%. The net profit attributable to the parent company was 178 million yuan, reflecting a year-on-year increase of 20.93% [2]. - Since its A-share listing, Ultrasonic Electronics has distributed a total of 1.148 billion yuan in dividends, with 215 million yuan distributed over the past three years [3]. Shareholder Information - As of September 30, 2025, the number of shareholders of Ultrasonic Electronics was 45,400, an increase of 3.35% from the previous period. The average number of circulating shares per person was 11,817, a decrease of 3.24% [2]. - Among the top ten circulating shareholders, Hong Kong Central Clearing Limited holds 15.3208 million shares, an increase of 11.4716 million shares compared to the previous period. Meanwhile, the fund "Zhaoshang Quantitative Selected Stock Initiation A" holds 3.0497 million shares, a decrease of 826,200 shares [3].

Core Viewpoint - The company is investing 1.364 billion yuan in an AI expansion project at its Chongqing production base to meet the surging demand for high-end printed circuit boards (PCBs) driven by advancements in information technology and AI applications [1][2] Group 1: Investment and Project Details - The total investment for the Chongqing AI expansion project is 1.364 billion yuan [1] - The project aims to build new industrial facilities and introduce advanced equipment to enhance production capacity and manufacturing levels [2] - The project will focus on high multilayer boards, which are essential for high-frequency, high-density applications [2] Group 2: Economic Benefits and Strategic Goals - The internal rate of return (IRR) for the project is projected at 19.92%, with a payback period of 5.69 years, indicating strong economic viability [2] - The expansion will strategically optimize the product structure, allowing the company to quickly increase capacity and capture more high-end orders [2] - The project is expected to align the company's products with the growing demands in AI, cloud computing, and big data sectors, enhancing its core competitiveness and market position [2] Group 3: Market Position - According to the China Printed Circuit Association (CPCA), the company ranks 29th in the comprehensive PCB 100 list and 16th in the domestic PCB 100 list based on revenue [2]

Core Viewpoint - The company is investing 1.364 billion yuan in an AI expansion project at its Chongqing production base to meet the surging demand for high-end printed circuit boards (PCBs) driven by advancements in information technology and AI applications [1][2]. Group 1: Investment and Expansion - The total investment for the Chongqing AI expansion project is 1.364 billion yuan [1]. - The project aims to enhance production capacity and manufacturing levels by constructing new industrial buildings and introducing advanced equipment [2]. - The internal rate of return (IRR) for the project is projected at 19.92%, with a payback period of 5.69 years, indicating strong economic benefits [2]. Group 2: Market Demand and Product Focus - There is an explosive growth in demand for high-end PCBs in sectors such as high-speed switches, AI servers, and 5G base stations, particularly for products like 400G, 800G, and 1.6T switches [1]. - The expansion will strategically optimize the product structure, allowing the company to better meet the needs of emerging fields like AI, cloud computing, and big data [2]. - The company specializes in high-frequency, high-speed, and high-density interconnect PCBs, which are essential for high-end applications [1][2]. Group 3: Industry Position - According to the CPCA, the company ranks 29th in the comprehensive PCB 100 list and 16th in the domestic PCB 100 list, highlighting its significant market presence [3]. - PCBs are critical components in electronic products, serving as the foundation for electrical connections and supporting electronic components, thus being referred to as the "mother of electronic system products" [3].

Group 1 - The core point of the article is the resignation of Huang Xiaodan, the Deputy General Manager and Secretary of the Board of Bomin Electronics, due to health reasons, while she will continue to serve as the Director of the Board Office [1] - The company appointed Li Xiaowei as the new Secretary of the Board, effective from the date of the board meeting on November 6, 2025, until the end of the current board's term [1] - As of the report, Bomin Electronics has a market capitalization of 7.4 billion yuan [1] Group 2 - For the fiscal year 2024, Bomin Electronics' revenue composition is as follows: 74.11% from printed circuit boards, 20.43% from customized electronic device solutions, and 5.46% from other businesses [1]

Core Viewpoint - The company has made significant progress in the research and development of 112G high-speed boards, with products now certified and entering mass production [1] Group 1 - The company has a clear technology development path, advancing 112G technology while simultaneously researching and developing more advanced 224G high-speed product technologies [1]

Core Viewpoint - Tianjin Pulin's stock price has shown significant growth this year, with a year-to-date increase of 25.68% and a recent surge of 19.40% over the last five trading days [1] Group 1: Stock Performance - As of November 7, Tianjin Pulin's stock price reached 24.13 CNY per share, with a trading volume of 2.51 billion CNY and a turnover rate of 4.30%, resulting in a total market capitalization of 59.32 billion CNY [1] - The stock has experienced a net inflow of 13.85 million CNY from main funds, with large orders accounting for 25.54% of total purchases [1] - The company has appeared on the "Dragon and Tiger List" twice this year, with the most recent instance on August 25, where it recorded a net buy of -109 million CNY [1] Group 2: Financial Performance - For the period from January to September 2025, Tianjin Pulin reported a revenue of 1.025 billion CNY, reflecting a year-on-year growth of 23.61%, while the net profit attributable to shareholders decreased by 51.14% to 15.1173 million CNY [2] - The company has a total of 22,700 shareholders as of September 30, which is an increase of 40.62% compared to the previous period, while the average circulating shares per person decreased by 28.89% [2] Group 3: Company Overview - Tianjin Pulin Electric Circuit Co., Ltd. is located in the Tianjin Free Trade Zone and was established on April 27, 1988, with its shares listed on May 16, 2007 [1] - The company's main business involves the production and sales of double-sided and multi-layer printed circuit boards, with 100% of its revenue derived from this segment [1]

Core Viewpoint - Pengding Holdings (002938) reported a decrease in consolidated operating revenue for October 2025 compared to the same period last year, indicating potential challenges in revenue generation [1] Financial Performance - The consolidated operating revenue for October 2025 was RMB 422,868 million, which represents a decrease of 3.08% from the same month last year [1]

Core Insights - The electronic sector experienced a significant net inflow of 20.381 billion yuan, leading among 31 primary industries in the Shenwan classification [1] - The electronic ETF (515260) saw a price increase of 3.3%, recovering its 5-day and 20-day moving averages [1] - Strong demand in the AI-PCB (Printed Circuit Board) sector resulted in notable stock price increases for companies like Dongshan Precision and Shenghong Technology [1][3] Market Performance - The electronic ETF (515260) reached a peak price increase of 3.45% during the trading day, closing at a 3.3% gain [1][2] - Key stocks in the electronic sector showed strong performance, with Dongshan Precision up 10%, and other semiconductor leaders like Cambrian and Haiguang Information also seeing significant gains [3] Industry Trends - The AI chip market in China is projected to grow from 142.537 billion yuan in 2024 to 1,336.792 billion yuan by 2029, with a compound annual growth rate of 53.7% from 2025 to 2029 [4] - The demand for storage chips is expected to rise, with prices increasing by 50% due to negotiations between SK Hynix and Nvidia [3][4] - AMD's approval to export its AI chips to China is seen as a positive development for companies like Haiguang Information, which has been collaborating with AMD since 2016 [3] Investment Opportunities - The electronic ETF (515260) and its associated funds are positioned to benefit from trends in semiconductor, consumer electronics, and AI chip markets [5] - The electronic sector is anticipated to experience a value reshaping driven by AI demand, with expectations of rapid growth in the coming years [5]

Core Viewpoint - Deep South Circuit (002916.SZ) reported that the overall capacity utilization rate of its PCB business remains high in Q3 2025, while the packaging substrate business has seen a significant month-on-month increase in capacity utilization due to rising demand in the storage market and application processor chip products [1] Group 1 - The PCB business is maintaining a high overall capacity utilization rate as of Q3 2025 [1] - The packaging substrate business has experienced a noticeable month-on-month increase in capacity utilization [1] - Increased demand in the storage market and application processor chip products is driving the growth in the packaging substrate business [1]

Core Insights - The company disclosed an investor relations activity record highlighting the capabilities of HDI as a platform technology for high-density wiring in PCB boards [1] - The company's PCB business possesses HDI process capabilities, primarily applied in mid-to-high-end products across various downstream sectors including communication, data centers, industrial control medical, and automotive electronics [1] Summary by Categories Technology - HDI is identified as a platform technology that enables high-density wiring for PCB boards [1] Business Application - The company's PCB business utilizes HDI technology in several mid-to-high-end products [1] - Key downstream sectors for the application of HDI technology include communication, data centers, industrial control medical, and automotive electronics [1]