Core Viewpoint - The document outlines the external investment management measures of Qipai Technology Co., Ltd., aiming to standardize investment behaviors, enhance investment efficiency, and mitigate risks while maximizing the time value of funds [1][2]. Group 1: General Principles - The external investment refers to the company's activities to invest monetary funds, equity, or assessed physical or intangible assets for future returns [2]. - Investments are categorized into short-term and long-term based on the duration, with short-term investments being those that can be liquidated within one year, and long-term investments being those held for over a year [2]. - The investment management should align with the company's development strategy, rationally allocate resources, and promote optimal combinations of factors to create good economic benefits [2]. Group 2: Approval Authority - The company implements a professional management and hierarchical approval system for external investments [3]. - The decision-making bodies for external investments include the shareholders' meeting, board of directors, and the general manager's office, with no other departments or individuals authorized to make investment decisions [3][4]. Group 3: Organizational Management - An investment review team is established, led by the general manager, responsible for collecting information, preliminary evaluations, and establishing a project database for investment suggestions [3][4]. - The investment management department is tasked with researching and formulating the company's development strategy, evaluating major investment projects, and managing the responsibilities of subsidiaries and holding companies [3][4]. Group 4: Decision Management - For short-term investments, the investment management department pre-selects investment opportunities based on profitability, and the financial department provides cash flow statements [4][5]. - Long-term investment projects require preliminary evaluations, feasibility studies, and must be approved by the board of directors and, if necessary, the shareholders' meeting [5][6]. Group 5: Transfer and Recovery of Investments - The company can recover investments under specific circumstances, such as project completion, bankruptcy, or force majeure [7]. - Investment transfers are permitted when projects deviate from the company's direction, incur continuous losses, or when urgent funding is needed [7]. Group 6: Financial Management and Auditing - The financial department is responsible for comprehensive financial records of external investments, ensuring compliance with accounting standards [8][9]. - Annual checks of long and short-term investments are mandated, along with regular audits of subsidiaries [8][9]. Group 7: Reporting and Disclosure - External investments must adhere to legal and regulatory requirements, with significant investments requiring shareholder meeting approval [10][11]. - Subsidiaries are obligated to provide accurate and timely information to the company for disclosure purposes [10][12].

Group 1: Fixed Income Market Insights - The domestic economic recovery shows continued differentiation, with resilient consumer market recovery and ongoing growth in logistics volume [2][7] - As of July 11, the average duration of long-term government bonds has risen to approximately 5.4 years, while the average duration of credit bonds remains stable at about 2.2 years [8][9] - The report suggests a narrow fluctuation in interest rate bonds for Q3 2025, with a bullish outlook on long-term municipal and capital bonds [9][14] Group 2: Financial Data Overview - In June 2025, new loans amounted to 2.24 trillion yuan, and social financing reached 4.2 trillion yuan, with M2 growing by 8.3% year-on-year [11][13] - The report indicates a significant increase in social financing growth, with a year-on-year increase of 8.9% [12][13] - The report anticipates a slight increase in new loans for 2025, driven by government bond financing and credit [11][13] Group 3: Company-Specific Insights - China Shengmu (01432.HK) - China Shengmu is the first organic raw milk brand to obtain dual certification from China and the EU, and it is the largest organic raw milk producer in China [22][23] - The company is expected to benefit from the expansion of the high-end organic milk market as consumer demand for healthy food increases [23][24] - The report forecasts a significant recovery in profits due to the anticipated stabilization of milk and beef prices, which have previously negatively impacted the company's financial performance [23][24] Group 4: Company-Specific Insights - Crystal Technology (603005.SH) - Crystal Technology is a leading supplier of WLCSP advanced packaging, focusing on CMOS image sensor chips and expanding into new fields such as optical devices and GaN devices [25][26] - The company is expected to see revenue growth driven by the increasing demand for automotive CIS, with a projected revenue of 1.13 billion yuan in 2024, representing a year-on-year growth of 23.72% [25][26] - The report highlights the company's strong competitive advantage with a gross margin of 43.28%, which is significantly higher than its peers [26][28]

Core Viewpoint - The company, Shenzhen Zhizheng High Polymer Materials Co., Ltd., is undergoing a significant asset swap and capital raising process, with Deloitte Huayong Accounting Firm providing an unqualified audit report for the financial statements of Advanced Assembly Materials International Limited for the years 2023 and 2024 [1][2]. Financial Performance - For the year 2024, the target company reported a total operating income of 248,621.11 million yuan, reflecting a year-on-year increase of 12.74%, and a net profit attributable to shareholders of 5,518.84 million yuan, which is a significant turnaround from a loss to a profit, with a year-on-year increase of 173.51% [5][6]. - The company had a high post-receivable collection rate of 92.78% for accounts receivable as of December 31, 2024, indicating strong cash flow management [6]. Market Trends - The average price of lead frames showed a slight decline in 2024, but there are signs of stabilization and recovery in prices due to reduced inventory pressure in the industry [8][9]. - The company’s lead frame products experienced a price increase in the fourth quarter of 2024, aligning with industry trends [8][9]. Customer Base and Sales Model - The company maintains a stable customer base, with the top 20 customers contributing 84.77% of total revenue in 2024, indicating a high level of customer concentration [10][13]. - The revenue from the top five customers accounted for approximately 54.90% of the main business income, demonstrating a consistent customer concentration [10][13]. Revenue Recognition Policies - The company recognizes revenue based on the transfer of control of goods to customers, which aligns with industry practices. For consignment sales, revenue is recognized when customers utilize the goods and provide usage reports [19][20]. - The revenue recognition policies are consistent with those of comparable companies in the semiconductor materials industry, ensuring compliance with industry standards [19][20].

Group 1 - The core viewpoint of the articles highlights the significant activities of Yu Renrong, the leader of OmniVision Technologies, in both the semiconductor industry and education, particularly through the establishment of Dongfang University of Technology [1][3][4] - OmniVision Technologies is planning to list in three locations, with recent efforts to go public in Hong Kong after a successful listing of its subsidiary, Xinhenghui, on the ChiNext board [1][10] - The establishment of Dongfang University of Technology aims to cultivate talent in critical fields such as artificial intelligence, integrated circuits, and new materials, addressing the growing demand for skilled professionals in the semiconductor industry [4][5][10] Group 2 - The university is positioned as a new research-oriented institution, focusing on interdisciplinary studies and aligning with national strategic needs, which is expected to enhance the talent pool for the semiconductor sector [3][4] - Yu Renrong's dual role as a leader in a top semiconductor design firm and as an educational investor is anticipated to foster collaboration between the industry and academia, potentially leading to innovations in semiconductor technology [5][10] - The recent visit of SMIC's chairman to the university indicates a growing interest from major semiconductor manufacturers in collaborating with educational institutions to secure a future talent pipeline [5][7]

Fundraising Overview - The company, Yongxi Electronics (Ningbo) Co., Ltd., has received approval from the China Securities Regulatory Commission to issue convertible bonds to unspecified investors, with a total issuance of 11,650,000 bonds [1] - The total amount of funds raised is not specified in the provided documents, but the company has established a special account for the management of these funds [1][2] Fund Management and Supervision - To ensure proper management and usage of the raised funds, the company has signed a tripartite supervision agreement with its sponsor, Ping An Securities, and the banks managing the special accounts [2][3] - The special accounts are designated solely for the storage and use of funds related to the company's advanced packaging technology research and industrialization project, and cannot be used for other purposes [2][3][4] Special Account Opening - As of July 2, 2025, the company has opened special accounts at several banks, including: - Bank of Communications for advanced packaging technology project - Agricultural Bank of China for technology research and industrialization - China Merchants Bank for supplementing working capital and repaying bank loans [2][4] Tripartite Agreement Details - The tripartite agreement outlines the responsibilities of each party, including the requirement for the sponsor to supervise the use of funds and conduct semi-annual inspections [3][5] - The agreement stipulates that if the company withdraws more than 50 million yuan or 20% of the net raised funds within a twelve-month period, the bank must notify the sponsor [6][11] - The agreement is effective upon signing and remains in force until all funds are spent and the account is closed [7][12]

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications and high-performance computing [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a remarkable rate of 20.9% over the next five years, becoming a key driver for overall market growth [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is projected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is expected to increase rapidly due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets, along with the continuous application of advanced packaging technology, is expected to sustain healthy growth in the coming years [15]. - The integration of AI applications in various sectors, including automotive and consumer electronics, is driving the demand for advanced packaging solutions [30]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei are highlighted as key players benefiting from the local supply chain advantages in the advanced packaging sector [5]. - Significant investments in packaging projects are underway, with total planned investments amounting to approximately $100 billion [29]. - The ongoing demand for advanced packaging solutions is expected to lead to sustained revenue growth for companies involved in this sector [30].

Core Viewpoint - The demand for advanced packaging continues to grow, driven primarily by AI-related applications [3][30]. Group 1: Advanced Packaging Demand - The advanced packaging market is expected to grow from $39 billion in 2023 to $80 billion by 2029, with a compound annual growth rate (CAGR) of 12.7% [12]. - The 2.5D/3D packaging segment is projected to grow at a CAGR of 20.9% over the next five years, becoming a key driver for market expansion [12]. - Advanced packaging shipments are anticipated to rise from 70.9 billion units in 2023 to 97.6 billion units by 2029, with a CAGR of 5.5% [15]. Group 2: Technology and Equipment - Four main advanced packaging technologies—FC, WLP, 2.5D, and 3D—are facilitating the evolution of packaging technology [5][7]. - The global advanced packaging equipment market is expected to reach $3.1 billion in 2024, marking a historical high [5]. - The demand for etching, thin film deposition, and plating equipment is rapidly increasing due to advancements in packaging technology [5]. Group 3: Market Dynamics - The semiconductor industry is experiencing a downturn in 2023, impacting the advanced packaging market, which saw a year-on-year decline of 3.5% [12]. - The recovery in specific end markets and the ongoing application of advanced packaging technology are expected to sustain healthy growth in the coming years [15]. - AI applications are driving long-term growth in semiconductor revenues, with the AI-related semiconductor market projected to grow at a CAGR of 28.9% from 2024 to 2033 [27]. Group 4: Investment Opportunities - Companies such as ASMPT, North Huachuang, and Zhongwei Company are recommended for investment due to their breakthroughs in niche areas of the domestic equipment market [5]. - Major packaging projects are underway or planned, with total investments amounting to approximately $100 billion [29].

Group 1 - The fan-out panel-level packaging is regarded as the next generation of advanced packaging, with major players like TSMC, ASE, and Powertech actively competing for opportunities in high-performance computing chip integration [1] - TSMC's technology, named CoPoS (Chip-on-Panel-on-Substrate), is expected to establish a pilot line in Chiayi by 2026, focusing on AI and HPC applications [2][1] - ASE has already established a production line for 300x300mm panel-level packaging in Kaohsiung, utilizing Fan-Out technology [3] - Powertech has been developing its fan-out panel-level packaging technology, named PiFO, since 2019, which is similar to TSMC's CoPoS [4][1] Group 2 - The advantages of panel-level fan-out packaging include larger substrate areas and heterogeneous integration capabilities, enhancing chip performance and functionality, making it suitable for 5G communication and IoT devices [1] - TSMC's CoPoS technology is a square design that allows for increased chip output, with mass production expected by 2028 [2] - TSMC also plans to launch a new CoWoS technology in 2027, which will integrate more logic and memory chips into a single package, aligning with the trends of CoPoS development [2]

Core Viewpoint - The article discusses the advancements and future potential of Fan-Out Panel Level Packaging (FOPLP) technology in the semiconductor industry, highlighting the strategic moves by major players like ASE Technology and Powertech Technology to enhance their operational contributions starting next year [4][6]. Group 1: Industry Trends - The global semiconductor industry is experiencing growth driven by emerging applications such as AI, high-performance computing (HPC), 5G, and automotive electronics, which are pushing advanced packaging technologies to the forefront [4]. - FOPLP technology is gaining traction due to its high efficiency, low cost, and high yield, making it a key solution for next-generation packaging [4]. Group 2: Company Developments - ASE Technology has been developing FOPLP for over ten years and plans to begin trial production by the end of this year, with a gradual increase in operational contributions starting next year [4]. - Powertech Technology has already started small-scale shipments of FOPLP and is validating high-end products for significant clients, indicating a positive outlook for future operational contributions [6]. Group 3: Technical Specifications - ASE Technology has progressed from a 300x300mm specification to a 600x600mm specification for FOPLP, with expectations that if the yield meets projections, it will become the mainstream specification [5]. - Powertech Technology has developed a packaging solution for a high-end system-on-chip (SoC) using a 2nm process, with a total packaging cost reaching $25,000, showcasing the high value of advanced packaging designs [6].

Group 1 - The company held its 14th meeting of the third board of directors on May 26, 2025, where all 7 directors attended, and the meeting was deemed legal and effective [1][2]. - The board approved the achievement of the vesting conditions for the second vesting period of the 2023 restricted stock incentive plan, allowing 1,213,530 shares to vest for 244 eligible participants [1][20][54]. - The board also approved the cancellation of certain unvested restricted stocks due to participants leaving the company and performance issues, totaling 119,430 shares [4][68][71]. Group 2 - The company plans to extend the validity period of the shareholder meeting resolution for issuing convertible bonds to June 12, 2026, to ensure the smooth progress of the issuance [7][8][23]. - The board proposed to hold the second extraordinary general meeting of shareholders on June 11, 2025, combining on-site and online voting [17][18]. Group 3 - The company nominated Li Xuesheng as a candidate for independent director to replace Wang Zheyao, who resigned, pending approval at the upcoming shareholder meeting [12][14][15]. - The board approved the adjustment of the committee members of the board to ensure the orderly operation of the committees following the resignation [15][16].