Core Insights - The Consumer Price Index (CPI) increased by 0.1% month-on-month in April, while year-on-year it decreased by 0.1%. The Producer Price Index (PPI) decreased by 0.4% month-on-month and by 2.7% year-on-year [1][2]. CPI Analysis - The month-on-month CPI change shifted from decline to increase, with a core CPI increase of 0.2% month-on-month and a stable year-on-year increase of 0.5%. This reflects the resilience of the economy [2][4]. - Food prices rose by 0.2%, and service prices increased by 0.3%, driven by seasonal factors and demand recovery during the holiday period [3][4]. PPI Analysis - The PPI's month-on-month decline of 0.4% was consistent with the previous month, influenced by international factors and seasonal declines in energy prices [8][10]. - Certain industrial sectors showed signs of price recovery, with reduced year-on-year declines in sectors such as black metal smelting and non-metallic mineral products [5][6]. Sector Performance - High-tech industries and construction activities contributed to a positive trend in some industrial prices, with specific sectors like wearable smart devices and aircraft manufacturing showing price increases [5][6]. - The international oil price decline negatively impacted domestic oil-related industries, leading to price drops in sectors such as petroleum extraction and refining [10]. Economic Outlook - The People's Bank of China anticipates that policies aimed at expanding domestic demand will support a moderate recovery in price levels [2][11]. - Recent monetary policies, including interest rate cuts and structural tools, are expected to stimulate domestic demand and support price stability [11].

2025 年第一季度，公司经营发展保持稳中有进、稳中提质的良好态势，业务结构进一步优化，预计2025年第一季度实现归属于上市公司股东的净利润人 民币2.00 亿元左右（未经审计），与上年同期人民币1.35亿元相比，同比增长50.00%左右。 华天科技2024年年报显示，公司全年实现营业总收入144.62亿元，同比增长28%；归属净利润6.16亿元，同比大幅增长172.29%。然而，扣非净利润仅为 3341.94万元，同比增长110.85%，显示出公司在非经常性损益方面的依赖较大。华天科技主营业务为集成电路封装测试，产品广泛应用于计算机、网络通 讯、消费电子等领域。2024年，随着电子终端产品需求回暖，公司订单增加，产能利用率提高，业绩显著提升。公司2024年完成集成电路封装575.14亿 只，同比增长22.56%；晶圆级集成电路封装176.42万片，同比增长38.58%。这些数据表明公司在产能和订单量上都有显著提升，但扣非净利润的低水平也 反映出公司在成本控制和盈利能力方面仍有较大提升空间。 近年来，随着半导体技术的不断发展和应用需求的日益提升，先进封装已成为推动国内半导体产业升级的重要领域。特别是在2.5D ...

定、退市风险高等特点，投资者面临较大的市场风险。投资者应充分了解科创板的投 资风险及本公司所披露的风险因素，审慎作出投资决定。 合肥颀中科技股份有限公司 Hefei Chipmore Technology Co.,Ltd. （合肥市新站区综合保税区内） 首次公开发行股票并在科创板上市 招股说明书 保荐人（主承销商） （北京市朝阳区安立路 66 号 4 号楼） 本次发行股票拟在科创板上市，科创板公司具有研发投入大、经营风险高、业绩不稳 合肥颀中科技股份有限公司 招股说明书 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对 发行人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也 不表明其对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判 断或保证。任何与之相反的声明均属虚假不实陈述。 根据《证券法》规定，股票依法发行后，发行人经营与收益的变化，由 发行人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策， 自行承担股票依法发行后因发行人经营与收益变化或者股票价格变动引致的 投资风险。 | 发行股票类型 | 人民币普通股（A 股） | | | | --- | --- | - ...