华山A2000芯片家族

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黑芝麻智能高算力布局迎来回报,具身时代空间广阔
Guan Cha Zhe Wang· 2025-06-17 09:27
Group 1 - The automotive industry is experiencing a significant opportunity with the rise of third-party high-performance computing chips, as companies face the choice between self-developed and externally supplied chips for intelligent driving [1][4] - Tesla's strategy of self-developing HW3.0 and later collaborating with Broadcom for HW4.0 highlights the increasing importance of specialized third-party suppliers in meeting the growing computational demands of intelligent driving [1][3] - Black Sesame Intelligence, a leading domestic chip supplier, has proven its capabilities by becoming a supplier for BYD's "Tianshen Eye" intelligent driving platform and showcasing its products at the Hong Kong "Car Expo" [1][3][4] Group 2 - Black Sesame Intelligence's global expansion is a natural outcome of the trend of Chinese new energy vehicles entering international markets, with its chips widely adopted by major automakers like Geely and Dongfeng [4][5] - The company has been focusing on high-performance chips since its establishment in 2016, launching the 58 TOPS Huashan A1000 chip in 2020 and the 106 TOPS A1000 Pro in 2021, positioning itself ahead of competitors [5][6] - The launch of the Huashan A2000 family, capable of exceeding 1000 TOPS, aligns with the industry's shift towards higher-level intelligent driving features, making Black Sesame a viable alternative to NVIDIA's Orin [6][7] Group 3 - Black Sesame Intelligence is experiencing a commercial harvest period, with a projected revenue increase of 51.8% in 2024 and a gross margin rise to 41.1% [7] - The performance of a System on Chip (SoC) is not solely determined by computational power; the integration with algorithms is crucial, especially as AI model technology advances [7][8] - The Huashan A2000 family features the industry's largest NPU core, "Jiushao," designed for neural network computations, which enhances efficiency compared to traditional GPUs [7][8] Group 4 - The Jiushao architecture supports mixed precision and is optimized for high-precision quantization and Transformer algorithms, which are essential for the development of autonomous driving technologies [8][9] - Black Sesame Intelligence's technology is also being applied in the field of embodied intelligence, with its chips supporting various applications beyond autonomous driving, including humanoid robots [8][9] - The company has partnered with Fourier to provide computational support for its "Dexterous Hand," indicating its commitment to expanding into broader applications of embodied intelligence [9]
国产汽车芯片暗战上海车展
第一财经· 2025-04-30 15:02
Core Viewpoint - The local supply chain is reshaping the global automotive industry landscape through technological breakthroughs, rapid response, and cost advantages, with future competition in the smart automotive industry focusing on ecosystem collaboration and supply chain integration efficiency [3][4]. Group 1: Industry Trends - The competition among automotive companies is shifting from electrification to intelligence, with in-vehicle chips becoming strategic resources for automakers [4]. - The 2025 Shanghai Auto Show featured a dedicated "China Chip Exhibition Area," showcasing over 1,200 domestic automotive chips from more than 150 member units of the China Automotive Chip Industry Innovation Strategic Alliance, marking the largest participation in history [4][5]. - Major chip companies like Horizon Robotics and Black Sesame Intelligence unveiled new products and strategic partnerships at the auto show, indicating a race among domestic chip manufacturers to seize market opportunities [4][5]. Group 2: Technological Developments - Intel participated in the Shanghai Auto Show for the first time, launching its second-generation SDV (AI-enhanced Software Defined) SoC and announcing a collaboration with Black Sesame Intelligence to develop a cockpit-driving integration platform [5]. - The new platform aims to achieve deep integration of cockpit interaction and assisted driving functions, supporting scenarios from L2+ to L4, with a reference design planned for release in Q2 2025 [5]. - Black Sesame Intelligence also announced the mass production of a domestic single-chip central computing platform based on the Wudang C1296 chip, marking a significant step in integrated cockpit solutions [6]. Group 3: Market Dynamics - The global smart driving auxiliary chip market, traditionally dominated by NVIDIA and Tesla, is experiencing shifts as domestic chip companies gain traction [7]. - According to a report, in 2024, the global installation volume of smart driving domain control chips is projected to reach 5.28 million units, with NVIDIA's Drive Orin-X series holding nearly 40% market share and Tesla's FSD at 25.1% [7]. - Domestic chip companies like Horizon Robotics and Black Sesame Intelligence are forming partnerships with multiple OEMs, emphasizing the importance of large-scale production for their survival [7]. Group 4: Competitive Landscape - Domestic chip companies possess advantages such as supply chain security, cost-effectiveness, and rapid service response, which are increasingly valued by automakers amid geopolitical tensions [7]. - However, many domestic chip products are primarily suited for entry-level smart driving assistance systems, typically found in vehicles priced below 200,000 yuan, while high-end products from brands like NIO, Xpeng, and Li Auto still rely heavily on NVIDIA [7]. - The competition with NVIDIA in high-end smart driving chips is expected to intensify in the coming years, as domestic companies work to close the performance and functionality gap [8].
最前线 | 智驾普及下,爱芯元智推出全球产品,黑芝麻2000大算力芯片亮相
3 6 Ke· 2025-04-27 04:56
Core Insights - The chip industry is witnessing two major trends: increased computing power and integration, as demonstrated by new products from Aisin YuanZhi and HezhiMa Intelligent [1] Group 1: Aisin YuanZhi's M57 Series - Aisin YuanZhi launched the M57 series of automotive chips, which boasts a computing power of 10 TOPS and supports mixed precision and BEV algorithms [1] - The M57 chip has a power consumption of no more than 3.5W even at a junction temperature of 125 degrees Celsius, making it suitable for both traditional and energy-efficient electric vehicles [1] - The self-developed image processing technology, Aisin ZhiMou AI-ISP, generates high-definition images under extreme lighting conditions, enhancing decision-making for in-vehicle systems [1] - The integrated MCU with a safety island achieves ASIL-B and ASIL-D level functional safety, ensuring that the advanced driver-assistance systems (ADAS) do not cause accidents due to individual function failures [1] Group 2: HezhiMa's Huashan A2000 Family - HezhiMa's Huashan A2000 family of chips, built on a 7nm automotive-grade process, claims to have computing power up to four times that of current mainstream flagship chips [2] - The Huashan A2000 family includes three products: A2000 Lite for urban assisted driving, A2000 for general assisted driving, and A2000 Pro for high-level general assisted driving [2] - The Huashan A2000 chips feature a self-developed "JiuSha" NPU architecture that supports Transformer hardware acceleration and mixed precision operations (FP8/FP16), enhancing multi-task parallel processing efficiency [3] - The architecture includes a priority preemption mechanism to ensure sufficient computing resources for high-priority tasks, improving safety in complex driving scenarios [3] Group 3: Wudang Series and Safety Technologies - HezhiMa also introduced the Wudang series of chips, which is the industry's first cross-domain integrated computing chip, enhancing vehicle safety by ensuring independent operation of key systems [3] - The Wudang C1296 chip, also showcased, integrates smart cockpit, ADAS, and vehicle body control domains, allowing real-time data communication among them [4] - This solution is already being implemented in multiple new models from Dongfeng and is expected to achieve mass production by 2025 [4]