Group 1 - The 2025 IAA Mobility exhibition in Munich showcased Hezhima Intelligent's advanced chip products and solutions for integrated cockpit and high-level assisted driving [1] - Hezhima Intelligent launched the "Safe Intelligent Base" solution, centered around the Wudang C1200 family of cross-domain integration chips, aimed at providing seamless upgrades for automotive companies from entry-level to flagship models [1] - The solution is designed to significantly reduce development costs, shorten development cycles, and enhance product competitiveness for automotive manufacturers [1] Group 2 - Hezhima Intelligent has established partnerships with leading companies, including Aptiv, to commercialize the Wudang C1296 chip-based integrated cockpit solution, which is expected to reach mass production by the end of 2025 [2] - The Huashan A1000 family of chips has already been integrated into multiple models from brands such as Geely, Lynk & Co, and Dongfeng [2]

Core Insights - The article discusses the evolving landscape of the automotive auxiliary driving chip industry, emphasizing the importance of long-term partnerships and platform capabilities over short-term gains [1][2][5]. Industry Overview - The auxiliary driving chip market has gained significant attention, with a shift from merely counting "hit models" to understanding the deeper needs of automotive manufacturers [1][2]. - Automotive manufacturers are increasingly prioritizing "controllable, reliable, and evolvable" chip platforms that offer better computing power, energy efficiency, system adaptability, and long-term service capabilities [2][5]. Company Developments - Black Sesame Intelligence (02533.HK) launched a new generation chip platform and announced mass production of the first domestic single-chip central computing platform based on the Wudang C1296 chip, set to be used in multiple new models from Dongfeng Motor by 2025 [3][4]. - The collaboration with Intel to create the "Intel & Black Sesame Intelligent Cabin-Driving Integration Platform" aims to integrate standard vehicle functions into a long-lifecycle platform, addressing cost control for economic models while supporting high-end models [4]. Financial Performance - Black Sesame Intelligence reported a revenue of 474 million yuan for 2024, a 51.8% increase from 312 million yuan in 2023, with a net profit of 313 million yuan, marking a turnaround from previous losses [7]. - The growth in revenue is attributed to the successful sales of auxiliary driving products and solutions, with significant contributions from partnerships with major automotive OEMs like BYD, Dongfeng, and Geely [7]. Market Trends - The auxiliary driving industry is transitioning from early adoption to widespread use, with L2-level auxiliary driving systems expected to see a 25.33% increase in deliveries in 2024, reaching 8.67 million units [8][9]. - The high-level automated navigation driving (NOA) segment is projected to grow significantly, with a 162.31% increase in deliveries, indicating a strong market demand for advanced driving assistance technologies [8][9]. Strategic Focus - The article highlights the importance of deep collaboration between chip manufacturers and automotive companies, emphasizing that the ability to co-evolve and adapt is crucial for long-term success in the industry [9][10]. - Black Sesame's commitment to high R&D investment, amounting to 340 million yuan in 2024, reflects its strategy to enhance product competitiveness and secure a favorable position in the smart automotive chip market [9].

Core Insights - The chip industry is witnessing two major trends: increased computing power and integration, as demonstrated by new products from Aisin YuanZhi and HezhiMa Intelligent [1] Group 1: Aisin YuanZhi's M57 Series - Aisin YuanZhi launched the M57 series of automotive chips, which boasts a computing power of 10 TOPS and supports mixed precision and BEV algorithms [1] - The M57 chip has a power consumption of no more than 3.5W even at a junction temperature of 125 degrees Celsius, making it suitable for both traditional and energy-efficient electric vehicles [1] - The self-developed image processing technology, Aisin ZhiMou AI-ISP, generates high-definition images under extreme lighting conditions, enhancing decision-making for in-vehicle systems [1] - The integrated MCU with a safety island achieves ASIL-B and ASIL-D level functional safety, ensuring that the advanced driver-assistance systems (ADAS) do not cause accidents due to individual function failures [1] Group 2: HezhiMa's Huashan A2000 Family - HezhiMa's Huashan A2000 family of chips, built on a 7nm automotive-grade process, claims to have computing power up to four times that of current mainstream flagship chips [2] - The Huashan A2000 family includes three products: A2000 Lite for urban assisted driving, A2000 for general assisted driving, and A2000 Pro for high-level general assisted driving [2] - The Huashan A2000 chips feature a self-developed "JiuSha" NPU architecture that supports Transformer hardware acceleration and mixed precision operations (FP8/FP16), enhancing multi-task parallel processing efficiency [3] - The architecture includes a priority preemption mechanism to ensure sufficient computing resources for high-priority tasks, improving safety in complex driving scenarios [3] Group 3: Wudang Series and Safety Technologies - HezhiMa also introduced the Wudang series of chips, which is the industry's first cross-domain integrated computing chip, enhancing vehicle safety by ensuring independent operation of key systems [3] - The Wudang C1296 chip, also showcased, integrates smart cockpit, ADAS, and vehicle body control domains, allowing real-time data communication among them [4] - This solution is already being implemented in multiple new models from Dongfeng and is expected to achieve mass production by 2025 [4]

Core Insights - Black Sesame Intelligence Technology Co., Ltd. showcased its innovations in assisted driving, cockpit integration, and safety computing at the 2025 Shanghai International Auto Show, highlighting advancements from foundational chip technology to industry ecosystem collaboration [1] Company Overview - Founded eight years ago, Black Sesame has developed core IPs in ISP and NPU, creating the Huashan series (assisted driving chips) and Wudang series (cross-domain integration chips), and has become the "first stock of AI chips for smart cars" listed on the Hong Kong Stock Exchange [2] - The company has achieved breakthroughs with products like A1000 (the first domestically produced automotive-grade high-performance chip) and C1236 (the world's first cross-domain integration chip), with the upcoming A2000 series designed for high-performance AI computing [2] Technological Innovations - The Huashan A2000 family of chips, built on a 7nm automotive-grade process, integrates 12 functional units, enabling multi-task parallel processing. The self-developed "Jiushou" NPU architecture supports Transformer hardware acceleration and mixed precision computing, achieving top industry energy efficiency [5] - The A2000 family includes A2000 Lite, A2000, and A2000 Pro, catering to various levels of assisted driving needs, with advanced perception capabilities that allow vehicles to understand complex scenarios like tunnels and extreme weather [7] Strategic Collaborations - Black Sesame announced a strategic partnership with Intel to develop the "Intel & Black Sesame Cockpit Integration Platform," combining both companies' core technologies to provide high-performance, cost-effective, and reliable cross-domain integration solutions for global automakers [10] - The collaboration aims to create a prototype solution that integrates the Wudang 1200 family chips as a safety base, Intel's flagship processors for cockpit experience, and Huashan A2000 chips for assisted driving computations, ensuring agile iteration of intelligent systems [10] Product Launches and Market Impact - The company, in collaboration with Dongfeng Motor and Junlian Zhixing, has initiated mass production of the first domestic single-chip central computing platform based on the Wudang C1296 chip, marking a significant step in cockpit integration and assisted driving technology [8] - The C1296 chip, also built on a 7nm process, integrates hardware resources for smart cockpit, assisted driving, and vehicle control, supporting real-time data communication across multiple domains, with plans for mass production by 2025 [8][9]