Core Insights - DeepSeek is enhancing its technological barriers by collaborating with the Institute of Computing Technology, Chinese Academy of Sciences to establish a joint laboratory focused on cutting-edge technologies such as "storage-compute integration" [1] - The dual-driven model of "listing + R&D" is expected to accelerate the transformation of scientific research achievements into practical applications [1] - The laboratory has already filed three patents that have entered the PCT international application stage, which may lead to new profit growth points in the future [1]

Group 1: Market Overview - The report provides a comprehensive overview of the integrated storage and computing technology market, defining product categories and statistical scope [3][4]. - The market is segmented into different product types, including near-storage computing, in-storage computing, and in-storage processing, with growth trends projected from 2020 to 2031 [4][5]. - The global market for integrated storage and computing technology is expected to show significant growth, with specific trends highlighted for various applications, including low and high computing power scenarios [4][5]. Group 2: Industry Development and Trends - The report analyzes the overall development of the integrated storage and computing technology industry during the 14th Five-Year Plan period, identifying key characteristics and barriers to entry [4][5]. - It outlines the development trends and recommendations for the industry, emphasizing the need for innovation and adaptation to market demands [4][5]. - The report forecasts the global and Chinese market sizes for integrated storage and computing technology from 2020 to 2031, highlighting China's growing share of the global market [4][5][6]. Group 3: Competitive Landscape - The competitive landscape of the integrated storage and computing technology market is examined, detailing revenue analysis and market share of major global players from 2020 to 2025 [4][5]. - The report identifies the top five companies in the market by revenue share for 2024, categorizing them into first, second, and third tiers based on market concentration [4][5][6]. - A SWOT analysis of Chinese companies in the integrated storage and computing technology sector is included, providing insights into their strengths, weaknesses, opportunities, and threats [4][5][6]. Group 4: Product and Application Analysis - The report presents a detailed analysis of different product types within the integrated storage and computing technology market, including projected market sizes and shares from 2020 to 2031 [5][6]. - It also examines various applications of integrated storage and computing technology, providing growth trends and market share data for both global and Chinese markets [5][6]. - The analysis includes a breakdown of market sizes for different applications, highlighting the expected growth trajectory from 2020 to 2031 [5][6]. Group 5: Supply Chain and Industry Insights - The report outlines the supply chain for the integrated storage and computing technology industry, detailing the industry chain, procurement models, and production modes [6][7]. - It discusses the major raw materials and suppliers in the industry, as well as the primary downstream customers [6][7]. - The report emphasizes the importance of understanding the supply chain dynamics to identify potential investment opportunities and risks [6][7].

Core Viewpoint - The rapid development of artificial intelligence (AI) presents new challenges for chip computing power, particularly the "memory wall" issue, which arises from the limitations of the von Neumann architecture widely used in processors [1][3]. Group 1: Memory Wall Problem - The von Neumann architecture simplifies hardware design by storing data and instructions in the same memory, but it limits CPU execution capabilities due to sequential instruction processing [3]. - The performance of storage has not kept pace with CPU advancements, leading to significant delays as CPUs wait for memory read/write operations, thus degrading overall system performance [3][4]. Group 2: Processing-In-Memory (PIM) Technology - PIM, or Compute-in-Memory, is an emerging non-von Neumann computing paradigm aimed at addressing the "memory wall" problem by executing computations within memory, reducing data transfer time and energy costs [5][6]. - The development of PIM technology has evolved through various stages since the 1990s, with significant contributions from both academic institutions and companies like Samsung, SK Hynix, and Micron [6][8]. Group 3: Current PIM Technologies - Mainstream PIM technologies include digital PIM (SRAM/DRAM), analog PIM (RRAM, PCM), and hybrid PIM, each with distinct advantages and challenges [8]. - Companies and research institutions have been actively developing PIM prototypes since 2017, with notable advancements in traditional storage technologies [8][9]. Group 4: Sorting Challenges in AI - Sorting is a critical and time-consuming operation in AI systems, affecting applications in natural language processing, information retrieval, and intelligent decision-making [10][11]. - The complexity of sorting operations, particularly in dynamic environments, poses significant challenges for traditional computing architectures, leading to high time and power consumption [10][11]. Group 5: Breakthrough in Sorting Hardware Architecture - A team from Peking University has achieved a breakthrough in efficient sorting hardware architecture based on PIM technology, addressing the inefficiencies of traditional architectures in handling complex nonlinear sorting tasks [13][14]. - The new architecture reportedly enhances sorting speed by over 15 times and improves area efficiency by more than 32 times, with power consumption reduced to one-tenth of traditional CPU or GPU processors [15][17]. Group 6: Implications and Future Applications - This breakthrough is expected to support a wide range of AI applications, including intelligent driving, smart cities, and edge AI devices, providing a robust foundation for next-generation AI technologies [16][17]. - The successful implementation of this sorting architecture signifies a shift from application-specific solutions to broader, general-purpose computing capabilities within PIM systems [15][16].

Core Viewpoint - The "2024-2025 Annual 8th China IC Unicorn" list was released by the China IC Unicorn Alliance, highlighting 12 unicorn companies and 2 emerging companies in the integrated circuit industry, aiming to support high-quality development in China's semiconductor sector through systematic valuation and industry empowerment [1][2]. Group 1: Selection Background and Core Objectives - The selection is based on the successful hosting of seven previous events, covering the entire integrated circuit industry chain, including design, manufacturing, packaging, testing, materials, and equipment [2]. - The evaluation criteria include technological innovation, market competitiveness, and ecological collaboration, leading to the selection of 12 unicorns and 2 emerging companies that represent the forefront of China's semiconductor industry [2]. Group 2: Unicorn Companies as Innovation Benchmarks - The 12 selected unicorn companies span key areas such as storage and computing, communication and RF, high-end manufacturing and materials, automotive electronics and smart terminals, core devices and advanced packaging, consumer electronics, and the Internet of Things [3]. - The selected companies set benchmarks for the industry through their technological breakthroughs and market implementations [3]. Group 3: Emerging Companies as Future Growth Drivers - The "Emerging Companies" award recognizes innovative companies with significant technological potential that were established more recently, specifically: 1. Beijing Pingxin Technology Co., Ltd. 2. Cixin Technology Group Co., Ltd. [3]. Group 4: Industry Trends and Ecological Outlook - The semiconductor industry is experiencing dual opportunities for technological restructuring and market expansion, driven by emerging demands such as AI and new energy [4]. - The technological layouts and product innovations of the listed companies align with IDC's forecast for global semiconductor market growth by 2025, addressing the needs for storage density and speed in AI computing, connectivity in IoT devices, and high reliability in automotive electronics [4]. - Specific examples include: - United Storage's high-bandwidth flash memory and Kangying Semiconductor's ePOP chips for AI computing needs [4]. - Feixiang Technology's 5G RF modules and Bolu Intelligent's Wi-Fi+BLE chips for IoT connectivity [4]. - Xihua Technology's automotive-grade MCUs and Ximaiwei's advanced packaging technologies for new energy vehicles [4]. - Zhenxin's wafer processing technology and Kainuo Zhongxing's optical materials for specialized applications [4]. Group 5: About the China IC Unicorn Selection - The China IC Unicorn selection aims to encourage the healthy and rapid development of competitive and investment-worthy integrated circuit companies, summarizing successful business models and enhancing their domestic and international influence [7]. - Since its inception in 2018, the selection has successfully hosted eight sessions, with over 1,500 participating companies and more than 200 recognized companies, of which nearly 30 have successfully gone public or been acquired [7]. Group 6: About the China IC Unicorn Alliance - Established in 2021, the China IC Unicorn Alliance consists of over 90 well-known enterprises and organizations from various sectors, aiming to integrate resources across the semiconductor industry chain and promote technological innovation and industrial upgrades [8]. - The alliance has over 1,000 member companies covering all aspects of the industry chain, including design, manufacturing, packaging, testing, and materials [8].