（文章来源：证券日报） 证券日报网讯通富微电9月29日在互动平台回答投资者提问时表示，公司紧跟行业技术发展趋势，抓住 市场发展机遇，面向未来高附加值产品以及市场热点方向，立足长远，大力开发扇出型、圆片级、倒装 焊等封装技术并扩充其产能；此外，积极布局Chiplet、2D+等顶尖封装技术，形成了差异化竞争优势。 截至目前，公司暂无与英伟达的相关业务合作。 ...

投资者提问： 公司天天说自己有先进封装技术，到底怎么先进？英伟达最强AI芯片公司可以封装吗？ 免责声明：本信息由新浪财经从公开信息中摘录，不构成任何投资建议；新浪财经不保证数据的准确 性，内容仅供参考。 董秘回答(通富微电SZ002156)： 尊敬的投资者，您好！公司紧跟行业技术发展趋势，抓住市场发展机遇，面向未来高附加值产品以及市 场热点方向，立足长远，大力开发扇出型、圆片级、倒装焊等封装技术并扩充其产能；此外，积极布局 Chiplet、2D+等顶尖封装技术，形成了差异化竞争优势。截至目前，公司暂无与英伟达的相关业务合 作。谢谢！查看更多董秘问答>> ...

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services from design simulation to packaging testing for global clients [2][3] - The company covers various fields including AI, high-performance computing, big data storage, 5G, IoT, automotive electronics, and industrial control [2][3] - Major shareholder is Nantong Huada Microelectronics Group, with stable equity structure [2] Financial Performance - Revenue for 2022, 2023, 2024, and the first half of 2025: CNY 21.429 billion, CNY 22.269 billion, CNY 23.882 billion, and CNY 13.038 billion respectively [3] - Net profit for the same periods: CNY 0.502 billion, CNY 0.169 billion, CNY 0.678 billion, and CNY 0.412 billion [3] - 2024 revenue growth of 7.24% and net profit growth of 299.90% [6] - 2025 H1 revenue growth of 17.67% and net profit growth of 27.72% [6] Industry Situation - Global semiconductor market reached USD 346 billion in H1 2025, a year-on-year growth of 18.9% [4] - Forecast for 2025 global semiconductor market size is USD 728 billion, up 15.4% from 2024 [4] - Expected market size for 2026 is USD 800 billion, with a further growth of 9.9% [4] Key Trends in Semiconductor Market - AI-driven growth continues; Asia-Pacific IC design market expected to grow by 15% in 2025 [5] - TSMC maintains dominance in wafer foundry; strong demand for advanced processes [5] - 2025 is a critical year for 2nm wafer manufacturing technology [5] Business Performance in Specific Fields - In H1 2025, the company increased market share in mobile, home appliance, and automotive sectors [9] - Focus on AI and high-performance products, with successful integration of Suzhou and Penang factories [9] Technology Development - Significant progress in large-size FCBGA development, with mass production initiated [11] - Breakthroughs in optical-electrical hybrid packaging technology [11] - Over 1,700 patent applications, with nearly 70% being invention patents [8] Future Outlook - Continued growth expected in AI and new energy vehicle sectors in H2 2025 [10] - Chinese IC packaging and testing industry is anticipated to transition from "catching up" to "keeping pace" and potentially "leading" [10]