Group 1: Industry Trends and Developments - The 2025 Shanghai Auto Show features 23 supply chain companies in the vehicle exhibition hall, showcasing advancements in intelligent driving solutions, smart cockpits, automotive-grade chips, power batteries, and charging stations [1] - The exhibition area for automotive technology and supply chain reached approximately 100,000 square meters, highlighting the growing importance of these sectors in the automotive industry [1] - Domestic players like Momenta and Horizon are increasingly penetrating the automotive supply chain, leading to a rise in self-research proportions among car manufacturers [2] Group 2: Key Product Launches - Black Sesame Intelligence launched the Huashan A2000 family of chips aimed at enhancing high-level intelligent driving capabilities [2] - CATL showcased its second-generation sodium-ion battery, which aims to achieve breakthroughs in both range and safety [2] - Bosch introduced its AI smart cockpit platform and an end-to-end model-based urban intelligent driving solution at the auto show [3] Group 3: Competitive Strategies - Valeo emphasized three strategies to tackle fierce competition in the Chinese market: Go newer, Go deeper, and Go together, focusing on innovation, system integration, and collaboration with local manufacturers [5][6] - Visteon is leveraging AI, ecosystem integration, and localized innovation to address competitive pressures, collaborating with tech giants like ByteDance and Qualcomm to enhance its product offerings [7][8] - Continental Group announced the spin-off of its automotive division into a separate entity, Aumovio, to enhance decision-making agility and market responsiveness, with a focus on software-defined vehicles and smart mobility solutions [9][10]

作为2025上海车展的主题论坛之一，"2025汽车半导体生态大会暨中国车规芯片技术路演"于4月25日-26日在国家会议中心（上海）隆重举办。 本次大会由中国能源汽车传播集团和上海市国际展览（集团）有限公司指导，《中国汽车报》社有限公司、上海车展管理有限公司、汽车电子产业 投资联盟联合主办，爱集微咨询（厦门）有限公司协办，旨在往届上海汽车展高水准、高规格、强阵容的基础上，搭建全球汽车半导体产业精英交 流合作、成果展示的顶级平台。 杨宇欣还深入分析了辅助驾驶计算面临的诸多挑战。他指出，当下市场和客户面临应用下沉、方案兼容、全新算法、极限成本等痛点和需求。因此，下 一代辅助驾驶芯片需要具备"高算力+高带宽""友好通用的工具链""平台化、系列化""全栈化的解决方案"等特性。 黑芝麻智能的下一代产品华山A2000家族芯片，正是顺应这些需求的产物。该芯片基于7nm车规工艺打造，集成了CPU、DSP、GPU、NPU 等12类功能 单元，具备强大的单芯片多任务并行处理能力。其核心亮点在于自研的"九韶"NPU架构，采用大核设计并支持Transformer硬加速，同时支持FP8/FP16混合精 度运算，能效比达到行业顶尖水平。九 ...