Group 1 - The 2025 IAA Mobility exhibition in Munich showcased Hezhima Intelligent's advanced chip products and solutions for integrated cockpit and high-level assisted driving [1] - Hezhima Intelligent launched the "Safe Intelligent Base" solution, centered around the Wudang C1200 family of cross-domain integration chips, aimed at providing seamless upgrades for automotive companies from entry-level to flagship models [1] - The solution is designed to significantly reduce development costs, shorten development cycles, and enhance product competitiveness for automotive manufacturers [1] Group 2 - Hezhima Intelligent has established partnerships with leading companies, including Aptiv, to commercialize the Wudang C1296 chip-based integrated cockpit solution, which is expected to reach mass production by the end of 2025 [2] - The Huashan A1000 family of chips has already been integrated into multiple models from brands such as Geely, Lynk & Co, and Dongfeng [2]

Core Insights - The 2025 IAA Mobility in Munich showcased the advancements in smart automotive technology, with Hezhima Intelligent presenting its capabilities in AI-driven smart vehicles [1] Group 1: Product Innovations - Hezhima Intelligent introduced its "Safe Intelligent Base" solution, addressing safety and cost challenges in cross-domain integration for automotive companies [3] - The Wudang C1200 family of chips serves as the core of the "Safe Intelligent Base," enabling seamless upgrades from entry-level to flagship models [3] - The Huashan A2000 chip family was highlighted for its high performance and efficiency, integrating multiple processing units for advanced driving assistance [4] Group 2: Market Collaborations - Hezhima Intelligent is collaborating with various partners, including the team led by Liu Sheng from Wuhan University, to develop humanoid robots and dexterous hands [4] - The Wudang C1200 family, particularly the C1236 and C1296 chips, has gained market recognition, with multiple automotive companies developing cross-domain solutions based on these chips [5] - The C1296 chip is set to be the first mass-produced chip platform for integrated cockpit and driving assistance solutions, with plans for production by the end of 2025 [5] Group 3: Commercialization and Ecosystem - The Huashan A1000 family has demonstrated successful commercialization, with chips already integrated into several vehicle models, including those from Geely and Dongfeng [6] - Hezhima Intelligent's dual approach of "chips + solutions" aims to provide cost-effective and reliable driving assistance technologies [6] - The company emphasizes innovation and open collaboration to enhance the automotive industry's auxiliary driving technology [6]

Core Insights - Black Sesame Intelligence (2533.HK) launched the "Safety Intelligent Base" solution at the 2025 Shanghai International Auto Show, focusing on safety in intelligent driving, utilizing the Wudang C1200 family of cross-domain integration chips to achieve ASIL-D safety standards [2] - The company announced a strategic partnership with Intel to jointly develop the "Cabin-Driving Integration Platform," which will integrate Intel's smart cockpit technology with Black Sesame's advanced driving algorithms, with a reference design expected in Q2 2025 [2] - Black Sesame's Wudang C1296 chip-based cabin-driving integration solution has entered mass production in collaboration with Dongfeng Motor and Junlian Zhixing, aiming for mass production by the end of 2025 [5] Industry Position - Black Sesame ranks third in the market share for traditional independent brand passenger car NOA integrated control computing solutions in China, with a 12.15% market share attributed to the A10000 chip's shipment volume [5] - The Wudang series chips and the Huashan series (including A1000/A2000 families) form a "dual-core drive" technology matrix that covers L2+ to L3+ intelligent driving needs [5] - The company aims to enhance its "technology innovation + open ecosystem" strategy, focusing on optimizing bandwidth performance and extending its technological capabilities from the automotive sector to robotics and edge computing [5]